JPH06136536A - Continuous vapor deposition plating device - Google Patents

Abstract

PURPOSE:To stably execute continuous vapor deposition plating by attachably and detachably providing a plate for prevention of the fall of foreign matter between the band to be treated and the ceiling of the vapor deposition chamber in the vapor deposition chamber. CONSTITUTION:The inside of the vapor deposition chamber 1 is adjusted to a vacuum atmosphere and a raw material 4 for vapor deposition plating in a raw material crucible 3 is heated to evaporate by an electron gun, etc. The band 2 to be treated is made to travel and is successively introduced into the vapor deposition chamber 1 where the band 2 to be treated is subjected to continuous vapor deposition plating. The plate P for prevention of the fall of the foreign matter is provided between the band 2 to be treated and the ceiling of the vapor deposition chamber 1 at this time. The plate P is constituted of a central plate 7 and end plates 6a, 6b. The width or area of the plate P is changed by moving the end plates 6a, 6b by means of a cylinder 8 according to the width of the band 2 to be treated. As a result the fall of condensed deposits 5 sticking to the ceiling, etc., and the sticking of the falled deposits to the band 2 to be treated, etc., are prevented and the stable continuous vapor deposition plating is executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous vapor deposition plating apparatus. More specifically, the zone to be treated such as a steel strip is run and introduced into the vapor deposition chamber in sequence, and the zone to be treated is covered with Al, Ti, Zn, The present invention relates to a continuous vapor deposition plating apparatus for vapor deposition plating those alloys, ceramics, and mixtures thereof by a vacuum vapor deposition method.

[0002]

2. Description of the Related Art Conventionally, as a continuous vapor deposition plating apparatus, one basically having a vapor deposition plating raw material and its vaporizing means inside and a vapor deposition chamber having an internal atmosphere adjusting means is used. Then, the continuous vapor deposition plating is performed by a method of adjusting the atmosphere in the vapor deposition chamber, evaporating the vapor deposition plating raw material, running the zone to be treated, successively introducing and introducing the vapor into the vapor deposition chamber, and continuously performing the vapor deposition plating. .

For example, a continuous vapor deposition plating apparatus as illustrated in FIG. 3 is used. The greatest feature of this apparatus is that it has two chambers, a first vapor deposition chamber 11 and a second vapor deposition chamber 17, as vapor deposition chambers. According to this apparatus, the zone 2 to be treated introduced into the vacuum by the inlet side vacuum seal device 12 is vapor-deposited on one surface (the lower surface of the zone 2 to be treated) in the first vapor deposition chamber 11 and then deflector roll. It is guided to the second vapor deposition chamber 17 via 15 and the other surface (the upper surface of the initially processed zone 2) there.
Is vapor-deposited on. In FIG. 3, 13 is a seal roll, 14 is an electron gun, 3 is a vapor deposition plating raw material crucible, 18
Shows an outlet vacuum seal device.

A vapor deposition chamber generally used in such a conventional apparatus is illustrated in FIG. In such a vapor deposition chamber, vapor such as metal vapor evaporated from the vapor deposition plating raw material crucible 3 in the vapor deposition chamber 1 condenses and adheres to the surface of the zone 2 to be processed to form a vapor deposition plating layer. Will achieve the purpose of. However, the vapor that has not adhered to the zone 2 to be processed adheres and accumulates on the inner wall of the vapor deposition chamber 1. Especially when the evaporation rate is high, the vapor is condensed and adheres also to the ceiling portion of the vapor deposition chamber 1 located above the zone 2 to be processed, and the condensed deposit 5 of the vapor deposition material vapor is deposited.

When the condensed deposit 5 is deposited on the ceiling of the vapor deposition chamber in this way, a part of the condensed deposit 5 is peeled off due to its own weight, vibration, etc., and falls off. It is sandwiched between 15, 16 mag, and as a result,
There are problems that the treated zone 2 is pressed and scratches are generated, and condensed matter (hereinafter referred to as foreign matter) is attached to the treated zone 2. On the other hand, such foreign matter also adheres to the roll, and if this foreign matter is left to stand, the foreign matter will also cause a scratch on the treated band 2.

It is desirable to remove the foreign matter adhering to the roll, but for that purpose, the operation of the apparatus is stopped at any time,
It is necessary to open the vacuum of the vapor deposition chamber 1 and the vacuum sealing devices 12 and 18 to the atmosphere, and therefore, it is necessary to stop the device for a long time, and it is necessary to frequently remove foreign substances, and the work amount is It will be huge. Moreover, even if such foreign matter removal work is performed frequently, it is difficult to completely prevent condensed deposits adhering to the ceiling and side walls of the deposition chamber from falling onto the zone to be treated during vapor deposition plating. It is the current situation.

[0007]

As described above, the above-mentioned conventional continuous vapor deposition plating apparatus has a problem that foreign matter may fall onto the zone to be treated. It is a very serious problem and its early solution is strongly desired.

The present invention has been made in view of such circumstances, and its purpose is to solve the problems of the above-mentioned prior art and to prevent foreign matter from falling onto the zone to be treated. It is intended to provide a vapor deposition plating apparatus.

[0009]

To achieve the above object, the present invention provides a continuous vapor deposition plating apparatus having the following configuration. That is, the continuous vapor deposition plating apparatus according to the present invention,
In a continuous vapor deposition plating apparatus that sequentially introduces and introduces a zone to be treated into the vapor deposition chamber and performs vapor deposition plating on the zone to be treated, between the zone to be treated inside the vapor deposition chamber and the ceiling of the vapor deposition chamber The continuous vapor deposition plating apparatus is characterized in that the foreign matter drop prevention plate is detachably provided.

[0010]

As described above, in the continuous vapor deposition plating apparatus according to the present invention, the plate for preventing foreign matter from falling from the ceiling to the zone to be treated can be attached and detached between the zone to be treated in the vapor deposition chamber and the ceiling of the vapor deposition chamber. Since the condensed foreign matter (foreign matter) adhering to the ceiling of the vapor deposition chamber falls off, the foreign matter rides on the plate, and the plate prevents any further foreign matter from falling, thus Foreign matter can be prevented from falling onto the treatment zone.

Since the plate is removable,
If there is a risk that condensed deposits (foreign matter) adhering to the lower surface will fall into the zone to be processed, or if there is a problem with condensed deposits adhering to the upper surface of the plate to some extent, vaporize the plate used up to that point. It can be removed from the chamber and a plate for renewal can be attached to the vapor deposition chamber. Therefore, the plate can be replaced and the state of preventing foreign matter from falling onto the zone to be processed can be continued and maintained with almost no interruption of the operation of the apparatus. still,
The above removed plate can be
Can be used as the next replacement plate.

With respect to the plate, if the plate is composed of a plurality of plate members whose plate widths or areas are variable according to the width of the band to be processed, even if the width of the band to be processed changes, the plate is correspondingly changed. It is possible to change the width or the area, and thus it is possible to reliably prevent foreign matter from falling onto the zone to be processed.

When the plate is constructed so that its position can be adjusted in accordance with the meandering of the zone to be treated, even if the zone to be treated meanders, the position of the plate can be changed according to the meandering of the zone, so that the foreign matter falls on the zone to be treated. Can be reliably prevented.

If the distance between the plate and the zone to be processed in the vapor deposition chamber is set to more than 0 mm and 200 mm or less, the rate of increase in the amount of condensed deposits on the lower and upper surfaces of the plate is slow,
Condensed deposits can be prevented from falling from the plate for a long period of time. Therefore, the period until the replacement of the plate is long, and the continuous operation of the apparatus can be performed for a long time. Here, the range of the distance L is obtained by experiments. That is, the relationship between the distance L between the zone to be treated and the plate and the time during which continuous operation can be performed without causing scratches on the zone to be treated was empirically determined, and as shown in FIG. Since the rate of increase of the amount of condensed deposits on the plate surface increases, the condensed deposits fall from the plate in a short period of time, and therefore the continuous operation time without causing scratches on the zone to be treated can be achieved. It was found that, when the distance L exceeds 200 mm, the time during which continuous operation is possible is drastically short and is 3 days or less. Therefore, the distance L between the plate to be processed and the plate is 0 mm.
The optimum value was over 200 mm.

If the lower surface of the plate is subjected to a surface roughening treatment for enhancing the adhesion of the vapor deposition material vapor to the condensed deposit, the adhesion between the plate and the condensed deposit is improved, and therefore, Condensed deposits are less likely to fall off from the plate, and the time required for falling to the zone to be treated becomes longer. The method of this surface roughening treatment is not particularly limited, but it is effective to apply sandpaper finish, scotch bright finish, file finish or the like to the lower surface of the plate.

[0016]

EXAMPLE A continuous vapor deposition plating apparatus according to an example of the present invention has the same structure as the conventional apparatus illustrated in FIG. 3, except for the vapor deposition chamber. The vapor deposition chamber applied to the apparatus of this example is shown in FIG. This vapor deposition chamber is a processing target zone 2 in the vapor deposition chamber.
4 and a ceiling of the vapor deposition chamber 1 are provided with a plate P for preventing foreign matter from falling from the ceiling to the zone to be processed and an auxiliary device such as a plate width expansion / contraction mechanism thereof.
It has the same structure as the conventional vapor deposition chamber illustrated in FIG.

The plate P is composed of three plate members for varying the plate width or area according to the width of the zone to be processed, and the plate width expansion / contraction mechanism is connected thereto. That is, the plate P is composed of a central plate 7 and end plates 6a and 6b, and a cylinder 8 for expanding and contracting the plate width is connected to the end plates 6a and 6b. In FIG. 1, 3 is a vapor deposition plating raw material crucible, 4 is a vapor deposition plating raw material, 9 is a vacuum packing, and 5 is a condensed deposit attached during the following vapor deposition plating.

Using the continuous vapor deposition plating apparatus according to the above-mentioned embodiment, the vacuum vapor deposition method is applied to the strip to be treated such as a steel strip.
Evaporative plating of l, Ti, Zn, etc. was performed. That is, the inside of the vapor deposition chamber 1 is adjusted to a vacuum atmosphere, the vapor deposition plating raw material 4 in the raw material crucible 3 is heated and evaporated by a heating means such as an electron gun, and the zone 2 to be processed is moved to enter the vapor deposition chamber 1. By successively introducing the same, continuous vapor deposition plating was performed on the zone 2 to be treated. The end plates 6a and 6b were moved by the cylinder 8 according to the width of the zone 2 to be processed, and the width or area of the plate P was changed. That is, the end plates 6a and 6b are moved so that the width of the plate P (the width from the left end of the left end plate 6a to the right end of the right end plate 6b) is always larger than the width of the processed zone 2. It was

In this continuous vapor deposition plating, the vapor evaporated from the vapor deposition plating raw material 4 condenses on the surface of the zone 2 to be treated,
While adhering to form a vapor-deposited plating layer, it also condenses and adheres to the ceiling portion of the vapor deposition chamber 1 or the like to form a condensed adhering substance 5, which is deposited. The amount of the condensed adhering substances (foreign matter) 5 increases with the passage of time, and a part of the condensing adhered matter (foreign matter) peels off due to its own weight, vibration, etc., but the foreign matter falls on the plate P, and more than that. It does not fall, so that no foreign matter falls onto the zone 2 to be processed.

When the vapor deposition plating is further continued, the amount of the condensed deposit adhered to the plate P also increases, and eventually, a part of the condensed deposit (foreign matter) falls off and falls on the zone 2 to be treated.
By updating the plate P until this state is reached, foreign matter is prevented from falling onto the zone 2 to be processed. As a result, the vapor deposition plating can be continuously performed without causing the foreign matter to drop onto the zone 2 to be processed. The plate P can be easily replaced, and the required time is extremely short.
Further, the period until the plate P needs to be exchanged (the period until foreign matter comes off from the plate P) is considerably long, and the frequency of this exchange is comparatively low, so that continuous vapor deposition plating is not very hindered. Does not come.

At this time, if the distance L between the plate P and the zone 2 to be processed is set to more than 0 mm and 200 mm or less, the rate of increase of the amount of condensed deposits on the plate is slow, so the plate P is replaced. Is longer, and continuous vapor deposition plating can be continuously performed for a long period of time. Note that this period is extended as the distance L is smaller.
Further, if the surface of the plate P is roughened, the adhesion with the condensed deposits is improved and the condensed deposits are less likely to fall off, so that the plate P needs to be replaced. Until the period becomes even longer.

Depending on the case, the zone 2 to be treated does not always run at a fixed position, but may meander.
In such a case, the position of the plate P, that is, the position of the left end of the left end plate 6a and the position of the right end of the right end plate 6b may be adjusted in accordance with the meandering of the zone to be processed. It is also possible to perform the control.

[0023]

EFFECTS OF THE INVENTION According to the continuous vapor deposition plating apparatus of the present invention, it is possible to prevent the condensed deposit (foreign matter) attached to the ceiling or the like of the vapor deposition chamber from dropping onto the zone to be treated. Therefore, it is possible to solve the problems that the conventional apparatus has such as the adhesion of foreign matter and the occurrence of pressing scratches due to the foreign matter falling onto the zone to be processed, and stable continuous vapor deposition plating without causing such problems. You will be able to do it.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an outline of a vapor deposition chamber applied to a continuous vapor deposition plating apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a relationship between a distance L between a plate to be processed and a plate in continuous vapor deposition plating and a continuous production available time (a time during which continuous operation can be performed without causing scratches on the plate to be processed).

FIG. 3 is a side sectional view showing an example of a continuous vapor deposition plating apparatus.

FIG. 4 is a side sectional view showing an outline of an example of a vapor deposition chamber used in a conventional continuous vapor deposition plating apparatus.

[Explanation of symbols]

1--Evaporation chamber, 2--Treatment zone, 3--Crucible for vapor deposition plating material, 4--Raw material for vapor deposition plating, 5--Condensation deposit,
6a, 6b--End plate, 7--Center plate, 8
--Cylinder, 9--Vacuum packing, 11--First deposition chamber, 12--Inlet vacuum seal device, 13--Seal roll,
14--electron gun, 15, 16--deflector roll, 17--
2nd evaporation chamber, 18--Outside vacuum seal device, P--Plate for preventing foreign substances from falling onto the zone to be processed.

Front page continuation (72) Shoji Miyake, 1 Kanazawa-machi, Kakogawa-shi, Hyogo Kamido Steel Works, Ltd. Kakogawa Steel Works (72) Inventor, Junji Kawafuku, Kanazawa-machi, Kakogawa-shi, Hyogo Kamido Steel Works, Ltd. Kakogawa Steel Works (72) Inventor Masatoshi Iwai 1 Kanazawa Town, Kakogawa City, Hyogo Prefecture Kadogawa Steel Works Co., Ltd. Kakogawa Steel Works

Claims (1)

[Claims] 1. A zone to be treated is successively introduced and led out into a vapor deposition chamber,
In a continuous vapor deposition plating apparatus for performing vapor deposition plating on the zone to be treated, a plate for preventing foreign matter from falling from the ceiling to the zone to be treated is detachably provided between the zone to be treated inside the vapor deposition chamber and the ceiling of the vapor deposition chamber. A continuous vapor deposition plating apparatus characterized in that