JP4157621B2 - Sputtering deposition system - Google Patents

Description

【００１１】
【発明の効果】
以上のように本発明によるときは、基板をターゲットの前方を移動させてスパッタリング成膜する装置に於いて、基板の移動経路に沿って移動する移動体を設けてこれに該ターゲットのスパッタ面を擦る部材を設けたので、該スパッタ面に付着物が発生した頃に該移動体を作動させ、真空成膜室を真空状態としたまま擦り部材で該スパッタ面を擦ることによりその付着物を取り除け、短時間にその取り除き作業を終えることができ、装置の運転効率が高まる等の効果がある。
【図面の簡単な説明】
【図１】本発明を適用するスパッタリング装置の側面線図
【図２】図１の装置に本発明を適用した状態の側面図
【符号の説明】
１ 真空成膜室、５ 基板、６ 移動経路、７ 移動手段、９ スパッタターゲット、１２ 移動体、１３ 擦り部材、[0001]
BACKGROUND OF THE INVENTION
The present invention mainly relates to an in-line type sputtering film forming apparatus.
[0002]
[Prior art]
Conventionally, an apparatus for moving a substrate in front of a sputtering target provided in a vacuum film formation chamber to perform sputtering film formation on the substrate is known, and a plurality of targets are provided along the movement path, and the substrate is passed through. An in-line apparatus for forming a film with sputtered particles from each target is also known.
[0003]
[Problems to be solved by the invention]
When, for example, conductive carbon is used for the sputter target and a diamond-like carbon (DLC) insulating film is formed on the substrate by sputtering, the DLC film partially adheres to the surface of the target, that is, the sputtering surface. May end up. Such a film is also referred to as a nodule, and the target on the part to which the insulating film is adhered is not sputtered. If the film becomes thick, abnormal discharge occurs, which is not preferable because it damages the substrate and the film. When such deposits are attached, the vacuum film formation chamber is opened and the target is exchanged or the sputtering surface is cleaned and removed. However, if the vacuum film formation chamber is exposed to the atmosphere, it takes a long time to resume sputtering. Accompanied by.
[0004]
An object of the present invention is to remove deposits on a target surface without opening a vacuum film formation chamber.
[0005]
[Means for Solving the Problems]
In the present invention, in an apparatus for moving a substrate in front of a sputtering target provided in a vacuum film formation chamber and performing sputtering film formation on the substrate, a moving body that moves along the movement path of the substrate is provided. The above-mentioned object is achieved by attaching a rubbing member for removing deposits on the sputtering surface of the target. The rubbing member is composed of a brush.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. In FIG. 1, reference numeral 1 denotes a longitudinal vacuum film forming chamber in which a vacuum pump 2 is evacuated and a loading chamber 3 and an unloading chamber 4 are connected to both ends. The substrate 5 prepared in the loading chamber 3 is moved by the moving means 7 along the moving path 6 in the vacuum film forming chamber 1, and the substrate 5 is moved by the sputter target 9 attached to the sputter cathode 8 during the movement. The film is subjected to a film forming process and accommodated in the unloading chamber 4. 10 is a sputtering power source such as a high frequency power source, and 11 is a bias applying power source. The moving means 7 includes a rail 7a, a holder 7c having wheels 7b running on the rail 7a, a rack 7d provided on the lower surface of the holder 7c, a rack 7d arranged along the rail 7a and rotated by an electric motor. The meshing gear 7e is used.
[0007]
In the case where a plurality of the cathodes 8 are provided to form an in-line type, and at least one of them includes a carbon (conductive) target and a DLC insulating film is formed on the substrate 5 by sputtering, the insulating sputtered particles Adheres to the sputtered surface of each target 8 to form nodules, resulting in the disadvantages described above. In the present invention, for example, a moving body 12 as shown in FIG. The rubbing member 13 for removing the deposits on the sputtering surface of the target 9 was attached thereto.
[0008]
The rubbing member 13 is formed of, for example, a synthetic resin brush or spatula, and is attached to a swingable support member 15 that is ejected from the moving body 12 by a spring 14. Further, the moving body 12 is provided with wheels 16 and a rack 17 so as to move along the rail 7a by the rotation of the gear 7e.
[0009]
The deposit on the sputtering surface of the target 9 increases as the sputtering time elapses and grows into a film. Compared with the case where the moving body 12 is run at the beginning of the deposition start time and the sputtering surface is rubbed with the rubbing member 13. The deposits can be removed easily, and the deposition rate is prevented from lowering due to the deposits and abnormal discharge is prevented, and it is not necessary to introduce the atmosphere into the vacuum deposition chamber 1 so that the vacuum state is maintained. It can be removed while maintaining it. In addition, although the moving body 12 was comprised with the traveling body in order to clean a some target, you may comprise with the moving body reciprocated with a cylinder etc. when there are few targets.
[0010]
[Table 1]

[0011]
【The invention's effect】
As described above, according to the present invention, in the apparatus for sputtering deposition by moving the substrate in front of the target, a moving body that moves along the movement path of the substrate is provided, and the sputtering surface of the target is provided on this. Since the rubbing member is provided, the moving body is operated when deposits are generated on the sputtering surface, and the deposits are removed by rubbing the sputtering surface with the rubbing member while the vacuum film forming chamber is kept in a vacuum state. The removal operation can be completed in a short time, and the operation efficiency of the apparatus is increased.
[Brief description of the drawings]
FIG. 1 is a side view of a sputtering apparatus to which the present invention is applied. FIG. 2 is a side view of the sputtering apparatus to which the present invention is applied.
1 vacuum film forming chamber, 5 substrate, 6 moving path, 7 moving means, 9 sputter target, 12 moving body, 13 rubbing member,

Claims (2)

In an apparatus for moving a substrate in front of a sputtering target provided in a vacuum film formation chamber and performing sputtering film formation on the substrate, a moving body that moves along the movement path of the substrate is provided, and the target A sputtering film forming apparatus comprising a rubbing member for removing deposits on a sputtering surface. The sputtering film forming apparatus according to claim 1, wherein the rubbing member is constituted by a brush.

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