JPS63140075A - Pretreatment in vacuum deposition - Google Patents

Abstract

PURPOSE:To form vapor deposited films having excellent adhesiveness by preliminarily mechanically grinding away the oxide films on the surface of a metallic strip and thinly welding metals having the good fit to the vapor deposited film thereon at the time of forming the vacuum deposited films on said surface. CONSTITUTION:The metallic strip 1 is passed between rotating metallic brushes 2 and back up rolls 3 and the oxides on both faces of the strip 1 are ground away by the brushes 2. The strip is introduced into a preliminary vacuum chamber V and is passed between roll brushed constituted of the brushes and deposited metal for half part each and the back up rolls 3 so that the reoxide thin film on both faces of the strip 1 are removed by the rotation of the brushes and same metals as the metals to be deposited by the next vacuum deposition or the metals having the good fit thereto are welded thereon. The metals are again welded thereof by deposition metal rolls 5 consisting of the same metals as the deposited metals and thereafter, the strip is transferred to vacuum deposition device where the vapor deposited metallic layers having the high adhesive power are formed by the vacuum deposition.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pretreatment method for vacuum deposition of a substrate such as a strip (steel sheet).

[Conventional technology and its problems]

As is well known, electroplating is a method for forming a thin film on the surface of a strip, but recently, techniques such as vacuum deposition and cathode sputtering have been used instead of electroplating. This vacuum sonja method is a method in which metals (e.g. zinc), insulators, etc. are heated and emitted in a high vacuum atmosphere, and the evaporated molecules are solidified on the surface of the strip, which is the substrate. The cleaning process that cleans the surface of the strip is considered to be the most important issue.

Therefore, it depends on this pre-processing.

This will have a significant impact on the strength, pinhole grade, and physical properties of the thin film formed.

Therefore, pre-treatment of the strip requires degreasing and removal of the oxide film, and in particular, the removal of this oxide film has been conventionally performed by 1) mechanical grinding, 2) ion bombardment, 3) electrolytic evaporation, and 4) high temperature. Heating, 5) laser irradiation, etc. have been attempted.

By the way, the method for removing the oxide film by mechanical grinding is as follows:
In a low vacuum region of 10-2 Torr or more (the atmosphere is the same as the atmosphere), after the oxide film is removed, the strip surface is re-oxidized, and sufficient coagulation and adhesion of Geisha metal cannot be obtained.

[Means for solving problems]

Therefore, the present invention was created with a focus on eliminating the problems in the conventional method of removing an oxide film by mechanical grinding. An object of the present invention is to provide a pretreatment method for vacuum evaporation, which is characterized in that, while mechanically grinding (chilling) an oxide, a metal that is compatible with the evaporated metal is deposited on the ground substrate surface.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure and operation of the present invention will be explained in detail with reference to embodiments shown in the accompanying drawings. The attached drawing shows a schematic diagram of an embodiment of the present invention, in which a strip 1 introduced into a pre-vacuum chamber 1 is cleaned of oxides on its surface by a brush 2. A back unroll 3 is provided on the opposite side of the brush 2.

A pair of these brushes 2 and bank up rolls 3 are provided symmetrically with the strip 1 in between to remove oxides from the upper and lower surfaces of the strip 1. These brushes 2 are pushed into the strip 1 and rotated in the direction of the arrow to grind (chip) the formed oxide film.

Next, the atmosphere of the vacuum chamber V (10-2 Torr
) while removing the oxide film formed underneath
Then, a bank unroll 3 is applied using a welding metal roll 5 made of the same welding metal as this welded metal.
Press to weld the metal again.

Here, the welding metal attached to each roll is selected to be a metal that can be welded to the strip 1 and is compatible with the stem welding in the subsequent process.For example, in the case of zinc evaporation, zinc is welded. In addition, if the temperature of the contact surface does not rise sufficiently and welding is not possible, the welding metal is heated by directly applying electricity.

Although this embodiment has been explained using a strip, the present invention is not limited to this, and it goes without saying that it can be applied to general substrates. Instead, a method of scraping off the surface layer with a rotary blade, file, etc. may be used.

In summary, since the present invention adopts the configuration described in the claims, the following effects are achieved.

〔Effect of the invention〕

It goes without saying that the vacuum evaporation method, which forms a thin film without raising the temperature of the substrate, is well matched with the pretreatment method of mechanically polishing the substrate to remove the oxide film. While removing the film, a metal that is compatible with the deposited metal is welded to the ground surface of the substrate, thereby avoiding oxidation again and further improving the adhesion of the thin film solidified by vacuum evaporation.

[Brief explanation of the drawing]

The accompanying drawings show schematic illustrations of embodiments of the invention. 1...Strip, 4...Roll brush, 5...
Welded metal roll, ■...vacuum chamber.

Claims (1)

[Claims] A degreased substrate is introduced into a vacuum, and while oxides on the substrate surface are mechanically ground in the vacuum, a metal that is compatible with the vapor-deposited metal is welded to the ground substrate surface. Pretreatment method in vacuum evaporation.