JPS63140075A - Pretreatment in vacuum deposition - Google Patents
Pretreatment in vacuum depositionInfo
- Publication number
- JPS63140075A JPS63140075A JP28589986A JP28589986A JPS63140075A JP S63140075 A JPS63140075 A JP S63140075A JP 28589986 A JP28589986 A JP 28589986A JP 28589986 A JP28589986 A JP 28589986A JP S63140075 A JPS63140075 A JP S63140075A
- Authority
- JP
- Japan
- Prior art keywords
- strip
- metals
- deposited
- brushes
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001771 vacuum deposition Methods 0.000 title abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims description 10
- 238000002203 pretreatment Methods 0.000 claims description 5
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 13
- 150000002739 metals Chemical class 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 241000885593 Geisha Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- -1 zinc) Chemical class 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ストリップ(帯鋼板)等基板の真空蒸着にお
ける前処理法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pretreatment method for vacuum deposition of a substrate such as a strip (steel sheet).
周知のように、ストリップの表面に薄膜を形成する方法
には電気メツキ法があるが、最近、電気メツキ法に代っ
て真空叢着や陰極スパッタリングなどの技術が用いられ
るようになった。この真空尊者法は、高真空雰囲気内で
金属(例えば亜鉛)・絶縁物などを加熱茎発させ、その
蒸発分子を基板であるストリップ表面に凝固させる方法
であることから、その前処理として当該ストリップの表
面を洗浄する洗浄処理は最も重要な事項とされている。As is well known, electroplating is a method for forming a thin film on the surface of a strip, but recently, techniques such as vacuum deposition and cathode sputtering have been used instead of electroplating. This vacuum sonja method is a method in which metals (e.g. zinc), insulators, etc. are heated and emitted in a high vacuum atmosphere, and the evaporated molecules are solidified on the surface of the strip, which is the substrate. The cleaning process that cleans the surface of the strip is considered to be the most important issue.
したがって、この前処理如何によっては。Therefore, it depends on this pre-processing.
形成された薄膜の強度、ピンホールグレード、薄膜の物
理的特性などに大きな影響を及ぼすことになる。This will have a significant impact on the strength, pinhole grade, and physical properties of the thin film formed.
そのため、ストリップの前処理としては脱脂および酸化
膜の除去が必要であって、特に、この酸化膜の除去は従
来より、1)機械的研削、2)イオン衝撃、3)電解蒸
発、4)高温加熱、5)レーザ照射などが試みられてい
る。Therefore, pre-treatment of the strip requires degreasing and removal of the oxide film, and in particular, the removal of this oxide film has been conventionally performed by 1) mechanical grinding, 2) ion bombardment, 3) electrolytic evaporation, and 4) high temperature. Heating, 5) laser irradiation, etc. have been attempted.
ところで、前記機械的研削による酸化膜の除去方法は、
l 0−2Torr以上の低真空領域(雰囲気は大気と
同じ)では、酸化膜を除去した後、ストリップ表面が再
酸化され、十分な芸者金属の凝固・密着性が得られない
。By the way, the method for removing the oxide film by mechanical grinding is as follows:
In a low vacuum region of 10-2 Torr or more (the atmosphere is the same as the atmosphere), after the oxide film is removed, the strip surface is re-oxidized, and sufficient coagulation and adhesion of Geisha metal cannot be obtained.
そこで本発明は、従来の機械的研削による酸化膜の除去
方法における問題点を除去することに着目して創作され
たもので、脱脂された基板を真空中に導入し、該真空中
において基板表面の酸化物を機械的研削(はつり)を行
いつつ、蒸着金属となじみの良い金属を、研削された基
板表面に溶着させることを特徴とする真空蒸着における
前処理法を提供することにある。Therefore, the present invention was created with a focus on eliminating the problems in the conventional method of removing an oxide film by mechanical grinding. An object of the present invention is to provide a pretreatment method for vacuum evaporation, which is characterized in that, while mechanically grinding (chilling) an oxide, a metal that is compatible with the evaporated metal is deposited on the ground substrate surface.
本発明の構成を作用とともに添付図面に示す実施例によ
り詳細に説明する。添付図面は本発明の実施例の概略図
を示すものであるが、予備真空室■に導入されたストリ
ップlはブラシ2で表面の酸化物を除去される。そのブ
ラシ2の反対側にバックアンプロール3を設けている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure and operation of the present invention will be explained in detail with reference to embodiments shown in the accompanying drawings. The attached drawing shows a schematic diagram of an embodiment of the present invention, in which a strip 1 introduced into a pre-vacuum chamber 1 is cleaned of oxides on its surface by a brush 2. A back unroll 3 is provided on the opposite side of the brush 2.
これらブラシ2およびバンクアップロール3を一対、ス
トリップ1を挟んで対称的に設け、ストリップ1の上下
表面の酸化物を除去する。これらブラシ2はストリップ
1へ押込まれ、矢印の方向へ回転することで、形成され
ている酸化膜を研削(はつり)することができる。A pair of these brushes 2 and bank up rolls 3 are provided symmetrically with the strip 1 in between to remove oxides from the upper and lower surfaces of the strip 1. These brushes 2 are pushed into the strip 1 and rotated in the direction of the arrow to grind (chip) the formed oxide film.
次いで、ブラシと溶着金属が半分ずつから構成されてい
るロールブラシ4により、バックアンプロール3で支持
されながら、当該真空室Vの雰囲気(10−2Torr
)下で形成された酸化膜を除去しつつ、所定の金属を1
g着させ、その後、この溶着させた金属と同一の溶着金
属から成る溶着金属ロール5で、バンクアンプロール3
に押圧して、再度金属を溶着させる。Next, the atmosphere of the vacuum chamber V (10-2 Torr
) while removing the oxide film formed underneath
Then, a bank unroll 3 is applied using a welding metal roll 5 made of the same welding metal as this welded metal.
Press to weld the metal again.
ここにおいて、各ロールに付設した溶着金属はストリッ
プ1と溶着可能で、かつ、後工程の茎着金屈となじみの
良い金属を選択する6例えば、亜鉛蒸着であれば亜鉛を
溶着させる。また、接触表面の温度が十分上がらず、溶
着できない場合は、溶着金属を直接通電により過熱して
行う。Here, the welding metal attached to each roll is selected to be a metal that can be welded to the strip 1 and is compatible with the stem welding in the subsequent process.For example, in the case of zinc evaporation, zinc is welded. In addition, if the temperature of the contact surface does not rise sufficiently and welding is not possible, the welding metal is heated by directly applying electricity.
なお、本実施例はストリップで説明したが、本発明はこ
れに限らず、一般の基板にも適用できることはいう迄も
ない、また、機械的研削シま本実施例のようにブラシに
よるものだけでなく、回転刃、やすりなどで表面層削り
とる方法であってもよい。Although this embodiment has been explained using a strip, the present invention is not limited to this, and it goes without saying that it can be applied to general substrates. Instead, a method of scraping off the surface layer with a rotary blade, file, etc. may be used.
以上要するに本発明は、特許請求の範囲に記載された構
成を採択したので、次の効果を奏する。In summary, since the present invention adopts the configuration described in the claims, the following effects are achieved.
基板の温度を上げずに薄膜を形成する真空蒸着法に、酸
化膜の除去として、基板を機械的に研〜1(はつり)す
る前処理法が良好にマツチングすることは勿論、基板表
面の酸化膜を除去しつつ、蒸着金属となじみの良好な金
属を、研削された基板表面に溶着させるので、再度の酸
化は免れるとともに、真空蒸着による薄膜の凝固の密着
性が一段と向上する。It goes without saying that the vacuum evaporation method, which forms a thin film without raising the temperature of the substrate, is well matched with the pretreatment method of mechanically polishing the substrate to remove the oxide film. While removing the film, a metal that is compatible with the deposited metal is welded to the ground surface of the substrate, thereby avoiding oxidation again and further improving the adhesion of the thin film solidified by vacuum evaporation.
添付図面は、本発明の実施例の概略図を示す。
1・・・ストリップ、4・・・ロールブラシ、5・・・
溶着金属ロール、■・・・真空室。The accompanying drawings show schematic illustrations of embodiments of the invention. 1...Strip, 4...Roll brush, 5...
Welded metal roll, ■...vacuum chamber.
Claims (1)
板表面の酸化物を機械的研削を行いつつ、蒸着金属とな
じみの良い金属を、研削された基板表面に溶着させるこ
とを特徴とする真空蒸着における前処理法。A degreased substrate is introduced into a vacuum, and while oxides on the substrate surface are mechanically ground in the vacuum, a metal that is compatible with the vapor-deposited metal is welded to the ground substrate surface. Pretreatment method in vacuum evaporation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28589986A JPS63140075A (en) | 1986-12-02 | 1986-12-02 | Pretreatment in vacuum deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28589986A JPS63140075A (en) | 1986-12-02 | 1986-12-02 | Pretreatment in vacuum deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63140075A true JPS63140075A (en) | 1988-06-11 |
Family
ID=17697460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28589986A Pending JPS63140075A (en) | 1986-12-02 | 1986-12-02 | Pretreatment in vacuum deposition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63140075A (en) |
-
1986
- 1986-12-02 JP JP28589986A patent/JPS63140075A/en active Pending
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