JPH06179013A - Vacuum arc descaling device - Google Patents

Abstract

PURPOSE:To stabilize a discharging arc by providing a strip at right angles with a pass line of a material to be treated at positions in contact with electrode shields. CONSTITUTION:A strip 21 for vapor deposition of vapor molecules supplied continuously in the orthogonal direction with a pass line of a material 20 to be treated is set at a position in contact with or approaching to electrode shields 12, 13 directly above or below electrodes 10, 11 on both sides of the pass line continuously supplying the material 20 to be treated into a vacuum tank conducted to a vacuum system. Since this vapor deposition strip 21 is heated mainly by radiation heat based on discharge, it is water-cooled by rolls 22. Its position is adjusted by arms 25 to the electrode shields 12, 13 and bridle rolls 24 are arranged. In this way, vapor molecules accumulated on the electrode shields 12, 13 are removed continuously by a vacuum arc descaling device (e.g. brush rolls 23).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum arc descaling device for removing scale, rust, etc. adhering to a metal material or a metal product by utilizing arc discharge under vacuum.

[0002]

2. Description of the Related Art Conventionally, descaling of metals is known to be a chemical treatment with an acid, a mechanical method such as shot blasting or polishing with a brush or a grindstone. Japanese Patent Publication Sho 57-5
Japanese Patent No. 6109 discloses a hot strip descaling method, and there is a proposal to melt and evaporate the scale by an electron beam, a laser, or a discharge arc. In addition, JP-A-4-110
Japanese Patent No. 084 proposes to melt and evaporate the scale with a discharge arc in a vacuum.

That is, as shown in FIGS. 3 and 4, the electrode 1
0 and 11 are vertically opposed to each other, and the traveling direction (arrow) is given to the processed material 20. The electrodes 10 and 11 are L-shaped member electrode shields 12 and 13 which are insulating insulators 14 and electrodes 10 and 1, respectively.
It is fixed at 1. A cooling water pipe 15 is provided inside the electrodes 10 and 11 and the electrode shields 12 and 13. By providing the water-cooled electrode shields 12 and 13, the scattering of the arc is limited, but the vaporized molecules tend to adhere to the low temperature part to form the deposit 16, which hinders stable discharge and continuous operation. At the same time, it may adversely affect the quality of the material to be treated.

The present applicant has previously filed Japanese Patent Application No. 3-272895.
In the specification, an airtight hopper is provided at the bottom of the vacuum chamber to continuously discharge the scale, and a vapor deposition strip pass line for trapping vaporized molecules is set on the ceiling of the vacuum chamber.
A vacuum arc descaling device was proposed.

[0005]

DISCLOSURE OF THE INVENTION According to the present invention, a material to be continuously fed is descaled in a vacuum chamber to efficiently collect vaporized molecules and to deposit vaporized molecules which easily adhere to an electrode shield. The present invention provides a vacuum arc descaling device that solves unstable discharge and enables continuous operation.

[0006]

According to the present invention, a path line for continuously supplying a material to be processed is sandwiched in a vacuum chamber which is electrically connected to a vacuum system, and a position which is in contact with or close to an electrode shield immediately above or below an electrode, A vacuum arc descaling device, characterized in that a strip for vapor deposition of vapor molecules to be continuously fed is set. Further, the present invention is a vacuum arc descaling device characterized in that a deposit removing device is brought into contact with the surface of the vapor deposition strip to mechanically remove the deposit.

[0007]

According to the present invention, a strip for actively depositing vaporized molecules is arranged at a position in contact with or close to the electrode shield. This strip is delivered continuously, so that it is removed from the electrode at a position away from the electrode, and then it is delivered again to a position where it comes into contact with or comes close to the electrode shield immediately above or below the electrode. It By arranging this strip for vapor deposition, it is possible to remove the vaporized molecules that have adhered to the electrode shield until now, always ensure a stable discharge, and obtain a stable material to be treated. .

[0008]

The present invention will be described below with reference to the drawings. INDUSTRIAL APPLICABILITY The present invention is a continuous descaling line for materials to be treated such as ferrous and non-ferrous wires, strips and tubes, which are continuously descaled by arc discharge in vacuum (1 to 100 pa). ◎ Electrode 1 in the figure
0 and 11 are arranged in a vacuum chamber (not shown), and the electrode shields 12 and 13 are fixed by an insulating insulator 14. The electrode shields 12 and 13 are L-shaped in cross section and are provided with a width that covers the pass line side of the electrodes 10 and 11. As the electrodes 10 and 11, for example, an assembly of multi-divided electrodes is used as shown in FIG.

Evaporative Molecule Deposition Strip 21 of the Invention
Is provided so as to surround the electrodes 10 and 11 via a roll 22 and to be fed in a direction different from the traveling direction of the pass line of the material 20 to be processed, for example, a right angle direction. Since the vapor deposition strip 21 is heated mainly by the radiant heat generated by the discharge, the roll 22 is water-cooled. The position of the electrode shields 12 and 13 is adjusted by the arm 25, and the bridle roll 24 is provided if necessary. The width of the vapor deposition strip is given by the width of the electrode shield 12. A deposit removing device, for example, a brush roll 23 is brought into contact with the vapor deposition strip 20 and is provided inside or outside the vacuum system. The brush roll 23 is engaged with a drive system (not shown), and is rotated in a direction opposite to the feeding direction of the vapor deposition strip 21.

That is, the vapor deposition strip of the present invention is arranged at a position in contact with or close to the shield of the electrode, and the strip is continuously fed. Therefore, in the present invention, when a positive potential is applied to the electrode, the scale of the material to be treated spontaneously vapor-deposits on the strip for vapor deposition where the metal molecules move relatively slowly due to arc discharge and adheres to the surface at a position away from the electrode. After the evaporated molecules are removed, it is fed again to a position in contact with or close to the electrode shield directly above or below the electrode. By arranging this vapor deposition strip,
Evaporative molecules that had been attached to the electrode shield up to now can be removed, a stable discharge can always be secured, and a material with a stable quality can be obtained.

[0011]

According to the present invention, in descaling in a vacuum chamber, the deposition of vaporized molecules that tend to adhere to the electrode shield is positively vapor-deposited on the vapor-deposition strip and is efficiently recovered, so that an unstable arc discharge is solved. It enables continuous operation.

[Brief description of drawings]

FIG. 1 is a partial side view of the present invention.

FIG. 2 is a partial front view of FIG.

FIG. 3 is a partial side view of a conventional example.

FIG. 4 is a perspective view of FIG.

Claims (2)

[Claims] Delivery 1. The material is continuously fed to a position in contact with or close to an electrode shield immediately above or directly below the electrode, with a pass line for continuously feeding the material to be treated being sandwiched in a vacuum chamber connected to a vacuum system. A vacuum arc descaling device characterized by setting a strip for vapor deposition of vapor molecules. 2. The vacuum arc descaling device according to claim 1, wherein the deposit removing device is brought into contact with the surface of the vapor deposition strip to mechanically remove the deposit.