JPS63239162A - Manufacture of ceramic joined body - Google Patents
Manufacture of ceramic joined bodyInfo
- Publication number
- JPS63239162A JPS63239162A JP7167487A JP7167487A JPS63239162A JP S63239162 A JPS63239162 A JP S63239162A JP 7167487 A JP7167487 A JP 7167487A JP 7167487 A JP7167487 A JP 7167487A JP S63239162 A JPS63239162 A JP S63239162A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- ceramic
- members
- bonded
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明はセラミックス部材とセラミックス部材あるいは
セラミックス部材と金属部材との接合方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for joining ceramic members and ceramic members or ceramic members and metal members.
(従来の技術)
従来より、セラミックス部材の長所を生がし、かつ欠点
を補うためセラミックス部材に金属部材を接合したり、
セラミックス部材どおしを接合して複合体として利用す
るということがよく行われている。(Prior art) Traditionally, metal members have been bonded to ceramic members in order to take advantage of the advantages of ceramic members and compensate for their drawbacks.
It is common practice to bond ceramic members together and use them as a composite.
このようなセラミックス−セラミックスまたはセラミッ
クス−金属間の接合方法としては種々の方法が知られて
おり、例えば両者の間に複数枚のインサート材をはさん
で接合するという方法がある。この方法は、接合用のろ
う材や無機材と、必要に応じて接合界面の応力を緩和す
るための応力緩和材を何枚か積層して、被接合部材の接
合すべき面の間に挿入し、この状態で加熱して接合する
方法である。Various methods are known for bonding ceramics to ceramics or ceramics to metals. For example, there is a method in which a plurality of insert materials are sandwiched between the two. This method involves laminating several layers of brazing filler metal or inorganic material for bonding and, if necessary, stress relief material to relieve stress at the bonding interface, and inserting the layers between the surfaces of the parts to be bonded. Then, in this state, they are heated and bonded.
(発明が解決しようとする問題点)
このように複数枚のインサート材をはびんで接合する方
法では、接合面が小さなものや接合面の形状が複雑なも
のでは、加熱炉にセットする際や加熱初期の段階の衝撃
や振動等によりインサート材がずれる可能性が大きく、
このため接合位置がずれてうまく接合できなかったり、
また接合面積が当初の予定より小さくなり十分な接合強
度が得られないという問題があった。(Problems to be Solved by the Invention) In this method of joining multiple insert materials in a bottle, if the joining surface is small or the shape of the joining surface is complicated, it may be difficult to set it in the heating furnace. There is a high possibility that the insert material will shift due to shock or vibration during the initial stage of heating.
For this reason, the joining position may shift and it may not be possible to join properly.
There was also the problem that the bonding area was smaller than originally planned and sufficient bonding strength could not be obtained.
本発明はこのような問題点を解決するためになされたも
ので、小さな接合面や複雑な接合面であってもインサー
ト材がずれることなく正確な位置に固定でき、十分な接
合強度と健全な接合体が得られるセラミックス接合体を
製造する方法を提供することを目的とする。The present invention was made to solve these problems, and it allows the insert material to be fixed in an accurate position without shifting even on small or complex joint surfaces, and provides sufficient joint strength and soundness. It is an object of the present invention to provide a method for manufacturing a ceramic bonded body that yields a bonded body.
[発明の構成]
(問題を解決するための手段)
本発明のセラミックス接合体の製造方法は、接合しよう
とするセラミックス部材とセラミックス部材またはセラ
ミックス部材と金属部材との間に1枚または複数枚のイ
ンサート材を挿入した後、このインサート材の外部より
有機接着剤を塗布して接合部を固定し、この状態で加熱
して両者を接合することを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The method for manufacturing a ceramic bonded body of the present invention includes one or more bonded ceramic members and a ceramic member or a ceramic member and a metal member to be bonded. After inserting the insert material, an organic adhesive is applied from the outside of the insert material to fix the bonded portion, and in this state, the two are bonded by heating.
本発明のセラミックス接合体の製造方法を適用できる接
合方法としては、従来より知られているメタライズろう
付は法や直接ろう付は法のような各種ろう付は法や活性
金属法等のセラミックス−セラミックスまたはセラミッ
クス−金属間の接合方法のうちで、接合界面に少なくと
も1枚以上のインサー1〜材を介在させて接合する方法
であればどのような接合方法でもよい。また、このイン
サート材としては、各種ろう付は法に使用するろう材や
活性金属法に使用するチタンやジルコニウム等の金属箔
のような接合に寄与する層が挙げられ、本発明はこれら
のインサート材を複数枚使用する場合により効果的であ
り、さらにこれらの接合に寄与する眉の他に銅やニッケ
ル、コバール等の応力緩和層を含んでいてもよい。The joining methods to which the method for manufacturing a ceramic bonded body of the present invention can be applied include the conventionally known metallization brazing method, direct brazing method, various brazing methods, and active metal method. Among the bonding methods between ceramics or ceramics and metals, any bonding method may be used as long as the bonding method involves interposing at least one inserter 1 to the material at the bonding interface. In addition, examples of the insert material include layers that contribute to bonding, such as brazing materials used in various brazing methods and metal foils such as titanium and zirconium used in active metal methods. It is more effective when a plurality of materials are used, and may further include a stress relieving layer of copper, nickel, Kovar, etc. in addition to the material that contributes to bonding.
また、有機接着剤としては加熱接合中に分解するもので
あれtrどのようなものでもよいが、特に接合性がよく
分解残金が少ない、アクリル系やイソシアネ−1・系の
接着剤が好ましい。Further, as the organic adhesive, any type of adhesive that decomposes during heat bonding may be used, but acrylic-based or isocyanate-1-based adhesives are particularly preferred, as they have good bonding properties and produce little decomposition residue.
本発明のセラミックス接合体の製造方法についてさらに
詳しく述べると、まず被接合部材間に必要なインサート
材を挿入し、接合部の外面より有機接着剤により、少な
くともその積層状態が取扱い中にくずれないように接着
して、加熱炉中に配置する。そして、適用した接合方法
に合せた接合温度までの昇温過程で、使用した有機接着
剤の分解温度で適当な時間保持し、接合温度前に有機接
着材を分解除去した後、接合温度まで昇温して接合を完
成させる。To explain in more detail the method for manufacturing the ceramic bonded body of the present invention, first, a necessary insert material is inserted between the members to be bonded, and an organic adhesive is applied to the outer surface of the bonded part so that at least the laminated state does not collapse during handling. and place it in a heating oven. In the process of raising the temperature to the bonding temperature that matches the bonding method applied, the organic adhesive used is held at the decomposition temperature for an appropriate period of time, the organic adhesive is decomposed and removed before the bonding temperature, and then the temperature is raised to the bonding temperature. Heat it to complete the bond.
(作 用)
本発明のセラミックス接合体の製造方法において、加熱
接合前の被接合部材およびインサート材からなる積層物
を有機接着剤により固定しているので、積層物の取扱い
等による積層間のずれが無くなり、また有機接着剤は加
熱中に分解してしまうので接合体に悪影響を与えること
もない。(Function) In the method for manufacturing a ceramic bonded body of the present invention, since the laminate consisting of the members to be joined and the insert material before heat bonding is fixed with an organic adhesive, there is no possibility of misalignment between the laminates due to handling of the laminate, etc. Furthermore, since the organic adhesive decomposes during heating, it does not adversely affect the bonded product.
(実施例) 次に、本発明の一実施例について説明する。(Example) Next, one embodiment of the present invention will be described.
実施例
まず、第1図に示すように、12mnx 12mmx
20nlの窒化ケイ素を主成分とするセラミックス部材
1と12n+mx 12no+x 20nn+のステン
レス製の金属部材2との間に、応力緩和層として厚さ0
.2nunの銅板11を中央にしてその両側面に、接合
に寄与する層として厚さ3μmのTi箔3aと厚さ60
μmのAg−Cu合金箔3bとを順に配置した後、この
積層した接合部の側周面にアロンアルファ(商品名)5
を塗布してインサート材および被接合部材を固定し、こ
の状態で加熱炉中に配置させ、真空中で加熱して接合し
た。なお、加熱条件は第2図に示すように、250°C
1300℃および600°Cの各温度で有機接着剤の分
解用および真空上昇のための保持を行い、そして接合温
度830℃で6分間保持する昇温プログラムに従って行
った。Example First, as shown in Fig. 1, 12 mm x 12 mm x
A stress relaxation layer with a thickness of 0 is provided between the ceramic member 1 mainly composed of 20nl silicon nitride and the stainless steel metal member 2 of 12n+mx 12no+x 20nn+.
.. A 3 μm thick Ti foil 3a and a 60 μm thick Ti foil 3a are placed on both sides of the 2nun copper plate 11 in the center as a layer that contributes to bonding.
After arranging the Ag-Cu alloy foils 3b of μm in order, Aron Alpha (trade name) 5
was applied to fix the insert material and the members to be joined, and in this state, they were placed in a heating furnace, and joined by heating in a vacuum. The heating conditions are 250°C as shown in Figure 2.
Holds were carried out at temperatures of 1300° C. and 600° C. for decomposition of the organic adhesive and for raising the vacuum, and a temperature ramp program was followed in which the bonding temperature was held at 830° C. for 6 minutes.
このようにして得たセラミックス−金属接合体の接合部
の外観検査を行ったところ、加熱接合前の有機接着剤に
よる固定時と同形状でずれの発生も認められず、また接
合界面の分析を行ったところ、界面生成物層内のAg中
にごく微量のCが固溶していたが、接合強度は4点曲げ
試@(上スパン10rn +m、下スパン30m1l、
クロスヘッドスピード0.51m/分)で350MPa
と良好な値を示した。When we visually inspected the joint of the ceramic-metal bonded body obtained in this way, we found that it had the same shape as when it was fixed with an organic adhesive before heat bonding, and no deviation was observed. As a result, a very small amount of C was found to be a solid solution in the Ag in the interfacial product layer, but the bonding strength was determined by a 4-point bending test @ (upper span 10rn+m, lower span 30ml, 1l,
350MPa at crosshead speed 0.51m/min)
showed a good value.
[発明の効果]
以上説明したように本発明のセラミックス接合体の製造
方法によれば、セラミックス部材や金属部材の被接合部
材間に、接合に使用するインサート材を挿入した後、接
合部の外部より有機接着剤で固定しているので、取板い
性が大幅に向上し作業効率がアップするとともに、積W
J′PIJの位置ずれもなくなり、これにより接合が充
分性なえ、接合強度の低下を防止できる。[Effects of the Invention] As explained above, according to the method for manufacturing a ceramic bonded body of the present invention, after inserting an insert material used for bonding between ceramic members or metal members to be bonded, the outside of the bonded portion is Since it is fixed with a more organic adhesive, the ease of removal is greatly improved, work efficiency is increased, and the stacking weight is reduced.
Misalignment of J'PIJ is also eliminated, thereby ensuring sufficient bonding and preventing a decrease in bonding strength.
第1図は本発明の一実施例の方法を説明するための加熱
接合前の接合部の断面図、第2図は本発明の一実施例の
加熱接合時の昇温プログラムを示すグラフである。
1・・・・・・・・・セラミックス部材2・・・・・・
・・・金属部材
3a・・・・・・Ti箔
3b・・・・・・Ag−Cu合金箔
4・・・・・・・・・銅板FIG. 1 is a sectional view of a bonded portion before heat bonding for explaining the method of an embodiment of the present invention, and FIG. 2 is a graph showing a temperature increase program during heat bonding of an embodiment of the present invention. . 1... Ceramic member 2...
...Metal member 3a...Ti foil 3b...Ag-Cu alloy foil 4...Copper plate
Claims (3)
ス部材またはセラミックス部材と金属部材との間に1枚
または複数枚のインサート材を挿入した後、このインサ
ート材の外部より有機接着剤を塗布して接合部を固定し
、この状態で加熱して両者を接合することを特徴とする
セラミックス接合体の製造方法。(1) After inserting one or more insert materials between the ceramic members to be joined, or between the ceramic members and the metal members, an organic adhesive is applied from the outside of the insert material to bond the joint. A method for manufacturing a ceramic bonded body, characterized by fixing the two and heating them in this state to bond the two.
力緩和層とからなる特許請求の範囲第1項記載のセラミ
ックス接合体の製造方法。(2) The method for manufacturing a ceramic bonded body according to claim 1, wherein the plurality of insert materials include a layer contributing to bonding and a stress relaxation layer.
系接着剤である特許請求の範囲第1項または第2項記載
のセラミックス接合体の製造方法。(3) The method for manufacturing a ceramic bonded body according to claim 1 or 2, wherein the organic adhesive is an acrylic or isocyanate adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7167487A JPS63239162A (en) | 1987-03-27 | 1987-03-27 | Manufacture of ceramic joined body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7167487A JPS63239162A (en) | 1987-03-27 | 1987-03-27 | Manufacture of ceramic joined body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63239162A true JPS63239162A (en) | 1988-10-05 |
Family
ID=13467367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7167487A Pending JPS63239162A (en) | 1987-03-27 | 1987-03-27 | Manufacture of ceramic joined body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63239162A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1058450C (en) * | 1995-09-01 | 2000-11-15 | 昆明理工大学 | Adhesion method capable of controlling effectively thickness of adhibited layer |
CN1101361C (en) * | 1997-03-12 | 2003-02-12 | 太原理工大学 | Glow brazing process for welding ceramic and metal |
JP2008108957A (en) * | 2006-10-26 | 2008-05-08 | Denki Kagaku Kogyo Kk | Production method of junction structure |
-
1987
- 1987-03-27 JP JP7167487A patent/JPS63239162A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1058450C (en) * | 1995-09-01 | 2000-11-15 | 昆明理工大学 | Adhesion method capable of controlling effectively thickness of adhibited layer |
CN1101361C (en) * | 1997-03-12 | 2003-02-12 | 太原理工大学 | Glow brazing process for welding ceramic and metal |
JP2008108957A (en) * | 2006-10-26 | 2008-05-08 | Denki Kagaku Kogyo Kk | Production method of junction structure |
JP4750670B2 (en) * | 2006-10-26 | 2011-08-17 | 電気化学工業株式会社 | Manufacturing method of ceramic circuit board |
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