JPS632363A - 容量膜 - Google Patents

容量膜

Info

Publication number
JPS632363A
JPS632363A JP61145398A JP14539886A JPS632363A JP S632363 A JPS632363 A JP S632363A JP 61145398 A JP61145398 A JP 61145398A JP 14539886 A JP14539886 A JP 14539886A JP S632363 A JPS632363 A JP S632363A
Authority
JP
Japan
Prior art keywords
film
mixed
region
concentration
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61145398A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553069B2 (enExample
Inventor
Masanobu Yoshiie
善家 昌伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61145398A priority Critical patent/JPS632363A/ja
Publication of JPS632363A publication Critical patent/JPS632363A/ja
Publication of JPH0553069B2 publication Critical patent/JPH0553069B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP61145398A 1986-06-20 1986-06-20 容量膜 Granted JPS632363A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61145398A JPS632363A (ja) 1986-06-20 1986-06-20 容量膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61145398A JPS632363A (ja) 1986-06-20 1986-06-20 容量膜

Publications (2)

Publication Number Publication Date
JPS632363A true JPS632363A (ja) 1988-01-07
JPH0553069B2 JPH0553069B2 (enExample) 1993-08-09

Family

ID=15384335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61145398A Granted JPS632363A (ja) 1986-06-20 1986-06-20 容量膜

Country Status (1)

Country Link
JP (1) JPS632363A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143861A (en) * 1989-03-06 1992-09-01 Sgs-Thomson Microelectronics, Inc. Method making a dynamic random access memory cell with a tungsten plug
US6267470B1 (en) * 1996-01-11 2001-07-31 Canon Kabushiki Kaisha Ink jet head structure having MOS transistors for power supply, and head substrate, ink jet cartridge, and ink jet apparatus having the same
JP2001237424A (ja) * 1999-12-24 2001-08-31 Hynix Semiconductor Inc ゲート誘電体膜が適用される半導体素子の製造方法
JP2002519865A (ja) * 1998-06-30 2002-07-02 ラム リサーチ コーポレーション 高誘電率ゲート絶縁体を有するulsimos
JP2008252118A (ja) * 1998-03-12 2008-10-16 Lucent Technol Inc ドープされた金属酸化物誘電体材料を有する電子部品及びドープされた金属酸化物誘電体材料を有する電子部品の作製プロセス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861634A (ja) * 1981-10-09 1983-04-12 Fujitsu Ltd 半導体装置用誘電体層の製造方法
JPS61156865A (ja) * 1984-12-28 1986-07-16 Nec Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861634A (ja) * 1981-10-09 1983-04-12 Fujitsu Ltd 半導体装置用誘電体層の製造方法
JPS61156865A (ja) * 1984-12-28 1986-07-16 Nec Corp 半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143861A (en) * 1989-03-06 1992-09-01 Sgs-Thomson Microelectronics, Inc. Method making a dynamic random access memory cell with a tungsten plug
US6267470B1 (en) * 1996-01-11 2001-07-31 Canon Kabushiki Kaisha Ink jet head structure having MOS transistors for power supply, and head substrate, ink jet cartridge, and ink jet apparatus having the same
JP2008252118A (ja) * 1998-03-12 2008-10-16 Lucent Technol Inc ドープされた金属酸化物誘電体材料を有する電子部品及びドープされた金属酸化物誘電体材料を有する電子部品の作製プロセス
JP2013093589A (ja) * 1998-03-12 2013-05-16 Alcatel-Lucent Usa Inc 誘電体材料を含む個別要素又は半導体デバイスを含む集積回路デバイス
JP2002519865A (ja) * 1998-06-30 2002-07-02 ラム リサーチ コーポレーション 高誘電率ゲート絶縁体を有するulsimos
JP2001237424A (ja) * 1999-12-24 2001-08-31 Hynix Semiconductor Inc ゲート誘電体膜が適用される半導体素子の製造方法

Also Published As

Publication number Publication date
JPH0553069B2 (enExample) 1993-08-09

Similar Documents

Publication Publication Date Title
US8741712B2 (en) Leakage reduction in DRAM MIM capacitors
US8546236B2 (en) High performance dielectric stack for DRAM capacitor
US8574999B2 (en) Blocking layers for leakage current reduction in DRAM devices
US20140183697A1 (en) High Work Function, Manufacturable Top Electrode
US8581319B2 (en) Semiconductor stacks including catalytic layers
JP2004153238A (ja) CMOSアプリケーション用の多重高κゲート誘電体を堆積する方法
US20130119512A1 (en) Top Electrode Templating for DRAM Capacitor
US8975633B2 (en) Molybdenum oxide top electrode for DRAM capacitors
CN102449712A (zh) 电容器及形成电容器的方法
US8878269B2 (en) Band gap improvement in DRAM capacitors
US9178010B2 (en) Adsorption site blocking method for co-doping ALD films
US20130052790A1 (en) Doping approach of titanium dioxide for dram capacitors
US8349696B1 (en) Asymmetric MIM capacitor for DRAM devices
US8835273B2 (en) High temperature ALD process of metal oxide for DRAM applications
JPS632363A (ja) 容量膜
US8647960B2 (en) Anneal to minimize leakage current in DRAM capacitor
KR100519777B1 (ko) 반도체 소자의 캐패시터 및 그 제조 방법
Kim et al. Characterization of zirconium silicate gate dielectrics deposited on Si (100) using Zr (NEt2) 4 and Si (O nBu) 4
US8853049B2 (en) Single-sided non-noble metal electrode hybrid MIM stack for DRAM devices
JP3182889B2 (ja) 強誘電体装置
JPH0513676A (ja) 半導体装置
TW439175B (en) Integrated circuit device with composite oxide dielectric
KR19990053224A (ko) 반도체 메모리 장치의 캐패시터 및 그 제조방법
JPH0260157A (ja) 半導体装置
JP2003192431A (ja) ビスマス層状強誘電体、強誘電体素子、強誘電体薄膜の製造方法

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term