JPS63233595A - Planar type display device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a planar display device,
In particular, it relates to an electroluminescent (EL) display device according to claim 1.

BACKGROUND OF THE INVENTION A typical display device according to the prior art usually consists of a printed circuit board having a driving IC and a brainer display panel suitably spaced from the printed circuit board. Display panels are attached to printed circuit boards by mounting fixtures between the substrate and the panel. Proper wiring between the display panel and the board is done by jumper wiring method.

A display device of the above-mentioned type is shown in Finnish patent publication 71860 and is based on the use of a tape that is elastic and has adhesive strength on both sides to attach a printed circuit board to a panel. .

FIG. 1 shows a typical conventional display device, in which the printed circuit board l is 5n60/Pb4
It is attached to the display panel 3 with copper fingerstrips 15 pre-coated with a layer of solder alloy of G, the number of contactors of which is equal to the number of contacts on the display panel 3, and the printed circuit board. It is also equal to the number of contacts in l. In this case, the integrated circuit 7 is arranged on a printed circuit board l.

The hatched area A indicates the area on the printed circuit board l in which the electronic functional components are arranged. Therefore, since IC7 requires a non-negligible proportion of the limited effective area, the remaining area A is relatively small.

Further, the disadvantages of the conventional techniques described above include complicated mounting, low bonding reliability, easy breakage during handling, and difficulty in automating production.

OBJECTS OF THE INVENTION The object of the invention is to overcome the drawbacks of the prior art and to create a comprehensively new type of display device. In order to make the IC fit into a circuit structure, the invention is based on placing the IC outside the printed circuit board, and furthermore, the circuit structure is connected to the printed circuit board on the one hand through appropriate leads. on one side and a display panel on the other. To be more specific, the display device according to the invention has the features set out in claim 1 of the appended claims.

In a preferred embodiment of the invention, the plurality of ICs are TAB
TABJ according to (tape automatic bonding) method
It is attached by lead wires onto the film carrier tape to form the JIJ& body.

〔effect〕

The present invention provides significant advantages. It is easy to replace the IC and the layout of the printed circuit board is less complex, reducing the area of the printed circuit board while providing for one circuit functional structure, as shown in Figure 2. It provides increased area and also avoids mounting the TAB on the printed circuit board, eliminating two of the bonding steps and making it easier to automate the placement of TAB structures on the printed circuit board. , the large pad area of the solder on the printed circuit board compared to the width of the TAB construction leads simplifies the application for mass production, and the thermal excursions imposed on the bonding material also simplifies the application. This makes it easier to perform elastic bonding and also provides greater overall reliability for the bonding.

(Example) The present invention has been studied in detail using the examples shown in FIGS. 2 to 6.

In this embodiment, as shown in FIG.
L display panel glass 3 and printed circuit board l are 2
They are fixed to each other by a cellular sheet-like member 5 having adhesive properties on one side and a glass plate 6 wrapped in a capsule shape.

The TAB structure 7, IO is designed so that the leads 9 of the IC package 7 can be directly bonded to the contact pads H on the back side of the EL display panel glass plate 3. Similarly, the lead wire 8 of the IC package 7 is
It is directly bonded to contact pads G on printed circuit board l.

Therefore, the TAB structure 7, lO
Since the number of lead wires is 12, the number of lead wires bonded to the EL display and panel glass plate 3 is 64.
Therefore, the present invention is accomplished by TAB m adult 7.10 cooperating with IC7.

In FIG. 4, TAB structure 7. The IC7, located in the center of -10, is equipped with a total number of 2x36 leads at its exit;
) and one set of 2x4 leads (leads 16, 17) to serve as base leet wires. The contact pad E of the outlet lead wire 9 is 62X
It has a pitch of O,7621+2×0,:181 lI-, which is equal to the pitch of the contact pad on the EL display panel glass plate 3. Next, the rectangular contact pad E of the exit lead 9 with a pad area of 0.406 x 2.000 m52 is 5n60
/Pb40 solder alloy pad size of the EL display panel 3 which is pre-coated with a solder alloy of Pb40.

The number of conductors at the inlet of the integrated circuit 7 is 2x4 leads (lead 8), which are joined appropriately to the 0th order, and the lead 15 (2x 2 leads) to the base lead. used as. Contact pads C and D of leads 8 and 15 are rectangular with areas of 0.5 x 20 m (C) and 1.0 x 2.0 m (C), respectively. The leads 8 and 15 shown are driven (from left to right) with the following drive signals:

-Vgc (GND) One power supply OK - Data output POL IIVcc -Vss (GND) Drive signal connected to the lead wire (not shown) of the other half of the symmetrically configured TAB structure are corresponding (from right to left).

-VccfL (12V) LE -Data Input BL HVcc -Vss (GND) The TAB structure 7.10 is secured entirely by Kapton film carrier tape 1O111, which is used to place the structure in the desired location. Supported. Kapton film material has an average thickness of 150IL1
1 polyimide plastic. TAB construct 7,
The lead wire No. 10 is made of copper foil with a thickness of 35 mm and a thickness of 0.
．． It is coated with a 5μ thick 5n80/Pb40 solder alloy layer. The width of the lead wire 8 is 0.5-1, the width of the lead wire 15 is 1.0-■, and the width of the lead wire 9 is 0.
．． The minimum width of the leads 8 and 9 that weave into the IC 7 by way of a tapering taper, which is 406 m, is 0.09651 square meters.

The mounting technique of the TAB structure to which the present invention is applied is based on the method using a conventional film carrier tape, where the film carrier tape is made in the first step. This step includes punching the edges of the tape for sprocket holes and punching punches 12, 13 and 14, which punch out the TAB structure 7. from the carrier tape. Facilitates separation of IOs. The second stage involves the etching of the conductor pattern for the 111 layer of carrier tape with copper foil and the leads 8.9.15.16 and 17 of the TAB structure; in the third stage the conductors are - The zero-order stage, which is coated with lead alloy and stamped out, is an ILB (internal lead bonding) operation, which bonds the integrated circuit 7 to the leads of the TAB structure. The fifth stage is the IC
7 and the sixth step is the OLB
(external lead wire bonding) operation and to connect the %EL display panel glass plate 3 to the printed circuit board l, the T with the encapsulated IC7 is
AB structure 7, including placement and bonding of IO.

Regarding bonding, the leads 8 and 15 of the TAB structure 7.10 are properly aligned over the contact pads G of the printed circuit board I, as shown in FIG. However, the lead wires avoid the areas where the edges of the carrier tape 10 and the printed circuit board 1 coincide.

The pitch of the rectangular contact pads G on the printed circuit board is 2.
．． 011, and the area of the pad is 2.0
It is m■2. this.

In the arrangement of the bonding pad C of the lead wire 8 extending over the contact pad G, a margin is provided for the width.

As shown in the wSB diagram, the DAR construct 7°10
The pitch of the leads 9 of the EL display panel glass plate 3 is equal to the pitch of the pre-coated contact pads H on the EL display panel glass plate 3.
The area of the contact pad H of is 0.5 mm in width and about 3.0 mm in length, which is larger than the contact pad E of the lead wire 9. The length of the contact pad of lead wire 9 is 2.0ml.
It is. In FIG. 6, the black lines at the edges represent the silicone strips necessary for manufacturing the EL display panel 3. In FIG. 4, when the TAR@adult 7, 1O is separated from the carrier film tape along the rectangular punchings 12.13.14, its shape is such that it protrudes from the side with the short parallel sides. It is generally trapezoidal in shape with an inlet lead 8 extending from the side and an outlet lead 9 protruding from the long parallel side. This shape of the TAB structure 7, 1O facilitates the placement of adjacent structures, as shown in FIG.

Without departing from the scope of the invention, devices different from the illustrative embodiments described above may also be envisaged.

Therefore, in addition to the example of bonding an EL display panel glass plate to a printed circuit board, devices of TAB structures with ICs are commonly utilized for other applications of connecting a structure to a printed circuit board. It is possible that Furthermore, several multiple ICs can also be combined in one TAB structure.

[Brief explanation of drawings]

FIG. 1 shows a simplified diagram of a display structure according to the prior art. FIG. 2 shows an EL display according to the present invention, and is a schematic diagram viewed from a printed circuit board. FIG. 3 is an enlarged side view of FIG. 2 and is a detailed view of the structure. FIG. 4 is a plan view of a partial section from the printed circuit board in FIG. 2, showing one half of the TAB structure. 5UA is a diagram illustrating the connection of the TAB structure shown in FIG. 4 to a printed circuit board; FIG. 6 is a diagram illustrating the connection of the TAB structure shown in FIG. 4 to a display panel. (Explanation of symbols of main parts) 7. 1O... TAB structure, 7... Integration circuit (IC) package 3...
...EL display glass plate...
・Printed circuit board 8.9...Lead wire l0111...Kapton film carrier tape

Claims (1)

Claims: 1. A printed circuit board (1), preferably made of glass, having an edge provided with at least one first set (G) of contact pads; ) and comprising at least one second set (H) of contact pads at its edges; 1)
and attachment means (5, 6) between the printed circuit board (1) and the display panel (3) for physical attachment between the printed circuit board (1) and the display panel (3); and the first set of contact pads. (G) and said second set (H) contact means (7,
IC (7) consisting of at least one set of (8, 9)
in a planar display device comprising at least one IC (7), each of said contact means comprising at least one IC (7);
) to the first set of contact pads (G), and an exit lead (9) to connect the IC (7) to the second set of contact pads (H). and, furthermore, the number of the inlet leads (8) is substantially less than the number of the outlet leads and the first set (G) is corresponding to the inlet leads (8). A planar display characterized in that the number of the outlet leads 9 is set equal to the number of contact pads of the corresponding second set (H). Device. 2. In each of said contact means, an inlet lead (8) and an outlet lead (9) and an IC (7) are attached to a thin film foil (10, 11) and bonded by TAB (tape automatic bonding) method. A display device according to claim 1, characterized in that it forms two TAB structures. 3. The TAB structure (7, 10) has at least approximately the shape of a trapezoid, and the inlet lead (8) extends from the parallel side of the trapezoid having the short side and from the side having the long side. Display device according to claims 1 and 2, characterized in that an outlet lead (9) projects from the display device.