JPS6323341A - 固体装置及びその製造方法 - Google Patents

固体装置及びその製造方法

Info

Publication number
JPS6323341A
JPS6323341A JP62173941A JP17394187A JPS6323341A JP S6323341 A JPS6323341 A JP S6323341A JP 62173941 A JP62173941 A JP 62173941A JP 17394187 A JP17394187 A JP 17394187A JP S6323341 A JPS6323341 A JP S6323341A
Authority
JP
Japan
Prior art keywords
terminal
base
layer
stem
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62173941A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458188B2 (cg-RX-API-DMAC7.html
Inventor
Takuji Yamada
拓司 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62173941A priority Critical patent/JPS6323341A/ja
Publication of JPS6323341A publication Critical patent/JPS6323341A/ja
Publication of JPH0458188B2 publication Critical patent/JPH0458188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP62173941A 1987-07-14 1987-07-14 固体装置及びその製造方法 Granted JPS6323341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62173941A JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62173941A JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6323341A true JPS6323341A (ja) 1988-01-30
JPH0458188B2 JPH0458188B2 (cg-RX-API-DMAC7.html) 1992-09-16

Family

ID=15969904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62173941A Granted JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6323341A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214052A (ja) * 1988-02-22 1989-08-28 Toshiba Corp 半導体装置
JP2008270608A (ja) * 2007-04-23 2008-11-06 Asahi-Seiki Mfg Co Ltd 気密封止リング及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214052A (ja) * 1988-02-22 1989-08-28 Toshiba Corp 半導体装置
JP2008270608A (ja) * 2007-04-23 2008-11-06 Asahi-Seiki Mfg Co Ltd 気密封止リング及びその製造方法

Also Published As

Publication number Publication date
JPH0458188B2 (cg-RX-API-DMAC7.html) 1992-09-16

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