JPS6323338A - 気密封止構造 - Google Patents

気密封止構造

Info

Publication number
JPS6323338A
JPS6323338A JP16708886A JP16708886A JPS6323338A JP S6323338 A JPS6323338 A JP S6323338A JP 16708886 A JP16708886 A JP 16708886A JP 16708886 A JP16708886 A JP 16708886A JP S6323338 A JPS6323338 A JP S6323338A
Authority
JP
Japan
Prior art keywords
packing
groove
cutting
package
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16708886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0477466B2 (enrdf_load_stackoverflow
Inventor
Toshihiro Kobayashi
俊裕 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16708886A priority Critical patent/JPS6323338A/ja
Publication of JPS6323338A publication Critical patent/JPS6323338A/ja
Publication of JPH0477466B2 publication Critical patent/JPH0477466B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Casings For Electric Apparatus (AREA)
JP16708886A 1986-07-16 1986-07-16 気密封止構造 Granted JPS6323338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16708886A JPS6323338A (ja) 1986-07-16 1986-07-16 気密封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16708886A JPS6323338A (ja) 1986-07-16 1986-07-16 気密封止構造

Publications (2)

Publication Number Publication Date
JPS6323338A true JPS6323338A (ja) 1988-01-30
JPH0477466B2 JPH0477466B2 (enrdf_load_stackoverflow) 1992-12-08

Family

ID=15843192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16708886A Granted JPS6323338A (ja) 1986-07-16 1986-07-16 気密封止構造

Country Status (1)

Country Link
JP (1) JPS6323338A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05214780A (ja) * 1992-02-05 1993-08-24 Tostem Corp 等圧カーテンウォール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05214780A (ja) * 1992-02-05 1993-08-24 Tostem Corp 等圧カーテンウォール

Also Published As

Publication number Publication date
JPH0477466B2 (enrdf_load_stackoverflow) 1992-12-08

Similar Documents

Publication Publication Date Title
JP3045089B2 (ja) 素子のパッケージ構造およびその製造方法
US4701999A (en) Method of making sealed housings containing delicate structures
JP2553924B2 (ja) 周辺キャリア構造体を有するパッケージ式電子デバイス
US5519184A (en) Reusable laser welded hermetic enclosure and method
CA1246757A (en) Magnetically sealed multichip integrated circuit package
JPS6323338A (ja) 気密封止構造
US4015071A (en) Microelectronic circuit case
KR890004819B1 (ko) 수지봉합형 반도체장치의 제조방법
US5883440A (en) Outline forming method for semiconductor device and semiconductor manufacturing device used in this method
JPH03110488A (ja) 樹脂封止集積回路の解析方法
JP3422936B2 (ja) リードフレーム及びその製造方法
JPH0433256Y2 (enrdf_load_stackoverflow)
JP7640075B2 (ja) パッケージ、電子部品、及び製造方法
DK1487704T3 (da) Genlukkeligt udhældningselement
JPH03116947A (ja) セラミックパッケージモジュール
JPS5929443A (ja) 半導体装置用リ−ドフレ−ム
JPS61229343A (ja) 電子部品のパツケ−ジング方法
JPH09142416A (ja) 熱シール板及び合成樹脂製容器の熱封緘方法
JPS62266841A (ja) 樹脂封止型電子部品の局所的開封方法
JP2004115085A (ja) チップケース
KR960014445B1 (ko) 집적회로 패키지의 플레쉬제거 방법 및 리드프레임 구조
JPH07283548A (ja) 空気孔付き収納体
JPH07114243B2 (ja) 回路素子容器
JPH06159512A (ja) パイプ開口端の密封用治具
JPS61258442A (ja) Icの組立不良品識別方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees