JPS6323334A - 半導体素子処理方法 - Google Patents
半導体素子処理方法Info
- Publication number
- JPS6323334A JPS6323334A JP62133998A JP13399887A JPS6323334A JP S6323334 A JPS6323334 A JP S6323334A JP 62133998 A JP62133998 A JP 62133998A JP 13399887 A JP13399887 A JP 13399887A JP S6323334 A JPS6323334 A JP S6323334A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive sheet
- handling ring
- semiconductor chip
- semiconductor chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000012545 processing Methods 0.000 title abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 238000003672 processing method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 17
- 238000004140 cleaning Methods 0.000 abstract description 12
- 238000005406 washing Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 38
- 210000000988 bone and bone Anatomy 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62133998A JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62133998A JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6323334A true JPS6323334A (ja) | 1988-01-30 |
| JPS6323655B2 JPS6323655B2 (enrdf_load_stackoverflow) | 1988-05-17 |
Family
ID=15117991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62133998A Granted JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323334A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214134A (ja) * | 1989-02-15 | 1990-08-27 | Nitto Denko Corp | 半導体ウエハマウンタにおける粘着テープテンション付与装置 |
| FR2794443A1 (fr) * | 1999-06-02 | 2000-12-08 | Commissariat Energie Atomique | Procede de transfert d'elements et dispositif permettant ledit transfert |
| JP2002076096A (ja) * | 2000-08-29 | 2002-03-15 | Disco Abrasive Syst Ltd | 半導体素子のピックアップ方法 |
| JP2007173587A (ja) * | 2005-12-22 | 2007-07-05 | Tokyo Seimitsu Co Ltd | エキスパンド方法、装置及びダイシング装置 |
| CN106816412A (zh) * | 2017-01-19 | 2017-06-09 | 吉林麦吉柯半导体有限公司 | 晶圆的切割工艺及晶圆的生产方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11437747B2 (en) | 2020-09-25 | 2022-09-06 | Apple Inc. | Spring-loaded contacts having capsule intermediate object |
-
1987
- 1987-05-29 JP JP62133998A patent/JPS6323334A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214134A (ja) * | 1989-02-15 | 1990-08-27 | Nitto Denko Corp | 半導体ウエハマウンタにおける粘着テープテンション付与装置 |
| FR2794443A1 (fr) * | 1999-06-02 | 2000-12-08 | Commissariat Energie Atomique | Procede de transfert d'elements et dispositif permettant ledit transfert |
| WO2000075968A1 (fr) * | 1999-06-02 | 2000-12-14 | Commissariat A L'energie Atomique | Procede de transfert d'elements et dispositif permettant ledit transfert |
| JP2002076096A (ja) * | 2000-08-29 | 2002-03-15 | Disco Abrasive Syst Ltd | 半導体素子のピックアップ方法 |
| JP2007173587A (ja) * | 2005-12-22 | 2007-07-05 | Tokyo Seimitsu Co Ltd | エキスパンド方法、装置及びダイシング装置 |
| CN106816412A (zh) * | 2017-01-19 | 2017-06-09 | 吉林麦吉柯半导体有限公司 | 晶圆的切割工艺及晶圆的生产方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6323655B2 (enrdf_load_stackoverflow) | 1988-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5476566A (en) | Method for thinning a semiconductor wafer | |
| TWI283457B (en) | Manufacturing method of semiconductor device | |
| KR100506109B1 (ko) | 접착성 테이프의 박리 기구, 접착성 테이프의 박리 장치,접착성 테이프의 박리 방법, 반도체 칩의 픽업 장치,반도체 칩의 픽업 방법, 반도체 장치의 제조 방법 및반도체 장치의 제조 장치 | |
| US6949158B2 (en) | Using backgrind wafer tape to enable wafer mounting of bumped wafers | |
| US7622328B2 (en) | Processing method of wafer | |
| US6153536A (en) | Method for mounting wafer frame at back side grinding (BSG) tool | |
| JP2002100588A (ja) | 半導体装置の製造方法 | |
| US7833601B2 (en) | Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods | |
| US6784021B2 (en) | Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus | |
| JP2003209160A (ja) | 半導体ウェハを用いた半導体装置の製造方法 | |
| JP2002075937A (ja) | 半導体ウエハの加工方法 | |
| US20130210239A1 (en) | Pre-cut wafer applied underfill film | |
| US9362105B2 (en) | Pre-cut wafer applied underfill film on dicing tape | |
| JPH11307488A (ja) | 半導体装置、その製造方法、加工ガイドおよびその加工装置 | |
| TW201921545A (zh) | 基板處理系統及基板處理方法 | |
| TW200410304A (en) | Process for manufacturing thin semiconductor chip | |
| JPS6323334A (ja) | 半導体素子処理方法 | |
| JP2008258412A (ja) | シリコンウエハの個片化方法 | |
| US7498236B2 (en) | Silicon wafer thinning end point method | |
| US20030073264A1 (en) | Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portion | |
| JPS5963742A (ja) | 半導体素子の製造方法 | |
| US20060275585A1 (en) | Peelable tape carrier | |
| JP2003086540A (ja) | 半導体装置の製造方法及びその製造装置 | |
| JP2004327986A (ja) | 半導体ウエハを薄くする方法 | |
| JPH05109679A (ja) | 半導体装置の製造方法 |