JPS6323334A - 半導体素子処理方法 - Google Patents

半導体素子処理方法

Info

Publication number
JPS6323334A
JPS6323334A JP62133998A JP13399887A JPS6323334A JP S6323334 A JPS6323334 A JP S6323334A JP 62133998 A JP62133998 A JP 62133998A JP 13399887 A JP13399887 A JP 13399887A JP S6323334 A JPS6323334 A JP S6323334A
Authority
JP
Japan
Prior art keywords
wafer
adhesive sheet
handling ring
semiconductor chip
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62133998A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323655B2 (cs
Inventor
Masayuki Tatewaki
館脇　政行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62133998A priority Critical patent/JPS6323334A/ja
Publication of JPS6323334A publication Critical patent/JPS6323334A/ja
Publication of JPS6323655B2 publication Critical patent/JPS6323655B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Dicing (AREA)
JP62133998A 1987-05-29 1987-05-29 半導体素子処理方法 Granted JPS6323334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62133998A JPS6323334A (ja) 1987-05-29 1987-05-29 半導体素子処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62133998A JPS6323334A (ja) 1987-05-29 1987-05-29 半導体素子処理方法

Publications (2)

Publication Number Publication Date
JPS6323334A true JPS6323334A (ja) 1988-01-30
JPS6323655B2 JPS6323655B2 (cs) 1988-05-17

Family

ID=15117991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62133998A Granted JPS6323334A (ja) 1987-05-29 1987-05-29 半導体素子処理方法

Country Status (1)

Country Link
JP (1) JPS6323334A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214134A (ja) * 1989-02-15 1990-08-27 Nitto Denko Corp 半導体ウエハマウンタにおける粘着テープテンション付与装置
FR2794443A1 (fr) * 1999-06-02 2000-12-08 Commissariat Energie Atomique Procede de transfert d'elements et dispositif permettant ledit transfert
JP2002076096A (ja) * 2000-08-29 2002-03-15 Disco Abrasive Syst Ltd 半導体素子のピックアップ方法
JP2007173587A (ja) * 2005-12-22 2007-07-05 Tokyo Seimitsu Co Ltd エキスパンド方法、装置及びダイシング装置
CN106816412A (zh) * 2017-01-19 2017-06-09 吉林麦吉柯半导体有限公司 晶圆的切割工艺及晶圆的生产方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11437747B2 (en) 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214134A (ja) * 1989-02-15 1990-08-27 Nitto Denko Corp 半導体ウエハマウンタにおける粘着テープテンション付与装置
FR2794443A1 (fr) * 1999-06-02 2000-12-08 Commissariat Energie Atomique Procede de transfert d'elements et dispositif permettant ledit transfert
WO2000075968A1 (fr) * 1999-06-02 2000-12-14 Commissariat A L'energie Atomique Procede de transfert d'elements et dispositif permettant ledit transfert
JP2002076096A (ja) * 2000-08-29 2002-03-15 Disco Abrasive Syst Ltd 半導体素子のピックアップ方法
JP2007173587A (ja) * 2005-12-22 2007-07-05 Tokyo Seimitsu Co Ltd エキスパンド方法、装置及びダイシング装置
CN106816412A (zh) * 2017-01-19 2017-06-09 吉林麦吉柯半导体有限公司 晶圆的切割工艺及晶圆的生产方法

Also Published As

Publication number Publication date
JPS6323655B2 (cs) 1988-05-17

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