JPS6322747U - - Google Patents
Info
- Publication number
- JPS6322747U JPS6322747U JP1986117004U JP11700486U JPS6322747U JP S6322747 U JPS6322747 U JP S6322747U JP 1986117004 U JP1986117004 U JP 1986117004U JP 11700486 U JP11700486 U JP 11700486U JP S6322747 U JPS6322747 U JP S6322747U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- sealed
- base
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986117004U JPH066509Y2 (ja) | 1986-07-30 | 1986-07-30 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986117004U JPH066509Y2 (ja) | 1986-07-30 | 1986-07-30 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322747U true JPS6322747U (cg-RX-API-DMAC10.html) | 1988-02-15 |
| JPH066509Y2 JPH066509Y2 (ja) | 1994-02-16 |
Family
ID=31002122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986117004U Expired - Lifetime JPH066509Y2 (ja) | 1986-07-30 | 1986-07-30 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066509Y2 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231742A (ja) * | 2008-03-25 | 2009-10-08 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029672A (cg-RX-API-DMAC10.html) * | 1973-07-17 | 1975-03-25 | ||
| JPS5745961A (en) * | 1980-09-04 | 1982-03-16 | Toshiba Corp | Resin-sealed semiconductor device |
| JPS57211761A (en) * | 1981-06-23 | 1982-12-25 | Nec Corp | Semiconductor device |
| JPS5991747U (ja) * | 1982-12-09 | 1984-06-21 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPS6083242U (ja) * | 1983-11-15 | 1985-06-08 | 松下電工株式会社 | 電子回路素子 |
-
1986
- 1986-07-30 JP JP1986117004U patent/JPH066509Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029672A (cg-RX-API-DMAC10.html) * | 1973-07-17 | 1975-03-25 | ||
| JPS5745961A (en) * | 1980-09-04 | 1982-03-16 | Toshiba Corp | Resin-sealed semiconductor device |
| JPS57211761A (en) * | 1981-06-23 | 1982-12-25 | Nec Corp | Semiconductor device |
| JPS5991747U (ja) * | 1982-12-09 | 1984-06-21 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPS6083242U (ja) * | 1983-11-15 | 1985-06-08 | 松下電工株式会社 | 電子回路素子 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231742A (ja) * | 2008-03-25 | 2009-10-08 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066509Y2 (ja) | 1994-02-16 |