JPS63222733A - Electronic endoscope - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic endoscope, and more particularly, to a means for connecting a solid-state image sensor chip and an IC chip in an electronic endoscope.

[Prior Art] As is well known, an IC for driving a COD (solid-state image sensor)
If it is placed away from the COD, the signal waveform will be distorted, so it is desirable to place it close to the COD. However, if they are placed close to each other on the same chip, heat generated in the IC will be conducted to the COD, which is undesirable because dark current will increase. Therefore, in the past, the COD was covered with a package made of resin, ceramic, or the like, and connected to the IC provided nearby using a lead wire or the like in a heat-insulating manner.

[Problems to be Solved by the Invention] Therefore, in conventional electronic endoscopes, the CCD is covered with a heat insulating package and incorporated into the end of the endoscope. It had to become that much larger.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic endoscope that eliminates the above-described drawbacks in the arrangement of the conventional COD and IC and allows the distal end to be made smaller in diameter and smaller in size.

[Means and effects for solving the problems] The present invention has the following features:
In order to achieve the above object, a solid-state image sensor chip and an IC chip related thereto are die-bonded to the same substrate, and both chips are directly wire-bonded.

[Example〕 Hereinafter, the present invention will be explained based on illustrated embodiments.

FIGS. 1 and 2 are sectional views of essential parts of the distal end of an electronic endoscope according to an embodiment of the present invention.

The distal end of the electronic endoscope 1 is provided with an objective optical system lens 3 on the distal end side within the distal end main body 2, and covered with a second cover glass 4 and a first cover glass 5 on the rear side thereof. A CCD chip 6 is fixed on the base 8 by die bonding, and an IC chip 7 is fixed by die bonding near the two-legged CCD chip 6 on the base 84. 7 are wire-bonded 17 to each other on the base 8, as shown in FIG. On the back side of the base 8, electric circuit components 9 such as a capacitor C and a resistor R, which are connected to the CCD chip 6, IC chip, etc., are arranged. Further, the electric circuit component 9 is electrostatically shielded by a shield portion 10. In Fig. 2, reference numeral 11 indicates a signal cable line drawn out through the base 8 toward the endoscope's hand control section, 12 indicates a 4-tube consisting of an insulating tube, and 13 indicates a cable attached to the distal end. An insulating ring, 14 a forceps channel, 15 a light guide, and 16 a frost path for air and water supply, respectively. In addition, in the present invention, in order to facilitate wire bonding, the CCD chip 6 and the IC chip 7 are placed on the same base 8 by making the heights of their respective surfaces as equal as possible, as shown in FIG. I try to place them close together. Then, the upper surface of the CCD chip 6 that has been wine-bonded 17 is covered with a transparent heat insulating material 1 as shown in FIG.
At the same time, the upper surface of one IC chip 7 is covered with a good heat conductive material 19, and the good heat conductive material 19 is penetrated through the base 8 and is embedded through a metal rod 20 to provide good heat conduction. They are fixed to the body 21 to dissipate heat and prevent the heating of the IC chip 7 from being conducted to the CCD chip 6.

According to the electronic endoscope of the present invention configured in this way, C
The CD chip 6 and the IC chip 7 are arranged extremely close to each other to make it compact, and the heating of the IC chip 7 is also controlled by C.
It is not conducted to the CD chip 6, and the performance of the CCD chip can be maintained well. That is, the CCD chip 6 can maintain its performance and can be connected to the IC chip and other related components in a compact manner, so that the tip of the endoscope can be made smaller and smaller in diameter.

Note that if the cover glasses 4 and 5 on the front side of the CCD chip 6 in FIG. 2 are replaced with a transparent plastic lens 22 to cover it as shown in FIG. 5, it will function as the rear end lens of the objective optical system. The focal length of the objective optical system can be shortened, and the CCD chip 6 can be protected and heating caused by the incidence of illumination light can be reduced. In addition, as shown in FIG. 6, in order to prevent heating from the light guide 15, which reaches a high temperature, there is a forceps channel 14 or a feeder between the light guide 15 and the CCD chip 6 and its driving electric circuit. An air/water pipe 16 may be provided to prevent the heat of the light guide 15 from being transmitted to the COD and its electric circuit.

Further, as a means to make the endoscope tip as small as possible, as shown in FIG. 7, the L side portion of the objective optical system 3 at the tip may be cut diagonally into a shape 1a. .

With such a shape, ease of insertion into a body cavity can be improved. Also, as shown in Figure 8, the CO at the tip
Since there is more space in the flexible tube at the rear of the portion where D and related members are disposed, the outer diameter of the flexible B8 tube may be reduced by shifting the built-in members.

[Effects of the Invention] As explained above, according to the present invention, the CCD chip can be compactly arranged at the tip of an electronic endoscope without any loss in performance, so the tip of the electronic endoscope can be made compact and thin. It is possible to provide an electronic endoscope that can be made to have a smaller diameter, and that has solved the drawbacks of the conventional electronic endoscope.

[Brief explanation of the drawing]

Fig. 1.2 is a cross-sectional view of the main part of the tip of an electronic endoscope showing an embodiment of the present invention; Fig. 3 is a side view showing a state in which a CCD chip and an IC chip are connected by wire bonding. Figure 4 shows the above 3rd figure.
5 and 6 are side sectional views showing the two sides of the CCD chip and the IC chip covered with a heat-insulating transparent member and a good heat-conducting member, respectively. FIGS. 7 and 8 are cross-sectional views of the endoscope distal end showing other examples of means for making the endoscope distal end small. FIGS. 1...Electronic endoscope 3...Objective optical system lens (objective optical system)
6... CCD chip (solid-state image sensor) 7
......IC chip (IC) 8...
...Base (board) 17... Wire bonding %3 figure horse 4 figure horse 6 figure horse A figure %8 figure

Claims (1)

[Scope of Claims] An electronic endoscope comprising a solid-state image sensor that photoelectrically converts a subject image formed by an objective optical system, and an IC related to the solid-state image sensor, at the end of the endoscope, An electronic endoscope characterized in that the solid-state image sensor chip and the IC chip are die-bonded onto the same substrate, and both chips are directly wire-bonded.