JP3438932B2 - Imaging device assembling method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus assembling method which is an improved method of assembling an image pickup section of an image pickup apparatus.

[0002]

2. Description of the Related Art In recent years, various image pickup devices for photoelectrically converting an image of a subject have been developed due to the development of optoelectronic technology.

In recent years, in particular, it has been required to reduce the size and weight of these image pickup devices. Therefore, a solid-state image pickup device, such as a CCD, which is integrated at high density, is used as a photoelectric conversion means. It's coming.

[0004]

However, conventionally, when connecting a lead wire of such a high-density CCD and a cable for driving and controlling the CCD and extracting an image pickup signal, one cable is manually provided for each. Since they were soldered one by one, they had to be soldered at multiple points,
There is a drawback that work efficiency is extremely low.

Also, since the soldering is done manually, the CCD
When connecting the thin lead wire and the connection cable of the above, not only skillful technique is required for reliable soldering, but even if such technique is mastered, stable and efficient soldering is possible. There is also a problem that performing the procedure becomes a very difficult task.

Further, when the pitch of the lead wires of the CCD becomes short, there is a risk that adjacent lead wires may be short-circuited by soldering.

The present invention has been made in view of the above circumstances, and it is possible to improve the work efficiency of the solder connection work of the solid-state image pickup device and the signal cable, and to improve the quality and reliability of the solder connection portion. An object of the present invention is to provide a method for assembling an image pickup device.

[0008]

An image pickup apparatus assembling method according to the present invention is an image pickup apparatus assembling method in which connecting conductors are soldered to a plurality of external leads of a solid-state image pickup element. least also a portion of the external lead, the housing jig having a plurality of grooves capable of receiving and connecting conductors connecting the part of the external lead, the housing the part of the external lead the connection conductor 1 And a second step of applying solder to the storage portion of the external conductor and the connection conductor of the part of the storage jig, and the partial external lead and the connection conductor to which the solder is applied. And a third step of heating and melting the containing portion of
In addition, in the first step
Position the connecting conductor longer than the groove of the storage jig.
At the same time, it is heated and melted by the third step and solidified.
Storage of the part of the external lead and the connection conductor
The fourth for cutting the connecting conductor exposed longer than the portion
It has a step of.

[0009]

[Operation] In the image pickup apparatus assembling method according to the present invention, in the first step, the part of the external leads and the connecting conductors connected to the part of the external leads are connected to the housing jig having the plurality of grooves.
The body is accommodated, and in a second step, solder is applied to the accommodating portion of the external lead and the connection conductor of the accommodation jig, and in a third step, the solder is applied. A portion of the external lead and the portion containing the connecting conductor are heated and melted and fixed . Then, in a fourth step, the
The part which is heated and melted and fixed by the step 3
Longer than the storage area between the external lead and the connecting conductor.
The connecting conductor that has been taken out is cut.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 relate to an embodiment of the present invention, FIG. 1 is a configuration diagram showing a configuration of an endoscope apparatus assembled by an image pickup apparatus assembling method of the present embodiment, and FIG. 2 is a diagram of the image pickup apparatus of FIG. FIG. 3 is a cross-sectional view showing the configuration, FIG. 3 is a flowchart showing a flow of an image pickup apparatus assembling method for assembling the image pickup apparatus of FIG. 2, FIG. 4 is an explanatory view for explaining the assembling of the image pickup apparatus according to the flowchart of FIG. 3, and FIG. It is a block diagram which shows the structure of the principal part of the modified example of an imaging device.

As shown in FIG. 1, an endoscope 1 having a built-in image pickup device assembled by the image pickup device assembling method of the present embodiment has an insertion portion 2 to be inserted into a lumen and a base of the insertion portion 2. A universal cable 4 having an operating portion 3 provided on the end side and a connecting connector 5 extending from the operating portion 3 at the tip.
And is configured.

A light source device 6 is connected to the connector 5, and illumination light is supplied from the light source device. The illumination light is emitted forward from the front end surface of the insertion portion 2 by a light guide (not shown) that is inserted through the endoscope 1.
Then, the reflected light of the illuminated illumination light from an observation site (not shown) is imaged on the image pickup surface of the image pickup device 8 which is provided at the tip of the insertion portion 2 and is formed of a solid-state image pickup device, such as a CCD. It The image formed on the imaging device 8 is photoelectrically converted and transmitted to the signal cable 10. Signal cable 10
Is connected to the video processor 12 via a connection cord 11 which extends through the endoscope and extends from the connection connector 5 so as to generate image data of the observed region. The image pickup device 8 is driven by a drive circuit (not shown) in the video processor 12.

A signal cable 10 connected to the image pickup device 8.
Is an excess cable winding and storing section 21 in the connector 5.
Is connected to the video processor 12 via. The surplus cable winding / storing section 21 is provided to adjust the length of the signal cable 10 in accordance with a plurality of types of endoscopes 1 having different lengths of the insertion section 2, that is, for example, insertion. In the type of endoscope in which the length of the portion 2 is short, the length of the signal cable 10 wound in the excess cable winding and storing portion 21 is longer than that in the type of endoscope in which the length of the insertion portion 2 is long. ing.

The connector 5 is provided with a cap 22 made of metal or an electromagnetic absorber, and the cap 22 is grounded to the ground. That is, since the signal cable 10 is wound in the excess cable winding / accommodating section 21, noise (mainly electromagnetic field noise) is more likely to occur than a signal propagating in the signal cable 10. Therefore, the cap 22 is provided. By absorbing the unwanted radiation noise generated in the housing section 21 and grounding the gap 22, the radiation of the unwanted radiation noise to the outside of the connector 5 is reduced.

Next, the detailed structure of the image pickup device 8 will be described. As shown in FIG. 2, the imaging device 8 includes an objective lens 31 on which a subject image is incident, a CCD 32 which captures the subject image formed on the imaging surface by the objective lens 31, and a photoelectric conversion signal which is captured by the CCD 32, for example. The signal cable 10 is connected to the CCD 32 and the circuit board 33. The signal cable 10 is connected to the CCD 32 and the circuit board 33.

The CCD 32 has a plurality of external input / output leads, and these leads are connected to the first external lead 35 to which the internal conductor 37 of the core wire 34 of the signal cable 10 is directly connected and the circuit board 33. The second external lead 36 to be connected is provided. Since the CCD 32 is arranged in the distal end portion of the endoscope 1 and has a small size, the pitch p of the external leads 35 and 36 is extremely short, for example, p = 0.4 mm. There is. The external leads 35 and 36 are connected and fixed to the internal conductor 37 of the core wire 34 of the signal cable 10 and the circuit board 33 by solder 38.

Next, regarding the method of assembling the image pickup device 8,
It will be described with reference to a flowchart and an assembled view of FIG. 3 in FIG. Incidentally, FIG. 3 (a) is a cross-sectional view for explaining a fixed state of the assembly jig such as a CCD, FIG. 3 (b) FIGS. 3 (a) in the
A view taken along line A direction, C in FIG. 3 (c) FIG. 3 (b)
It shows a cross-sectional view along the line -C '.

[0018] First, in step S1, as shown in FIG. 3, fixedly bonded CCD32 the CCD fixing frame 41. Then, the CCD fixing frame 41 integrated with the CCD 32 is fixed to the fixing jig 42. Next, in step S2, the stage 43 having a plurality of grooves adapted to the pitch and width of the first external leads 35 is arranged along the first external leads 35. Then, the core wire 34 of the signal cable 10 is arranged along the groove of the stage 43 from above the first external lead 35. At this time, the inner conductor 37 of the core wire 34 is exposed longer than the groove of the stage 43. The core wire 34 is supported by the core wire receiving member 49.

Since the stage 43 is a member for connecting the external leads 35, 36 to the internal conductor 37 of the core wire 34 of the signal cable 10 and the circuit board 33 by the solder 38, the stage 43 has a large heat capacity. Since the solder does not adhere even if it is a metal, it is formed of a member having a large heat capacity, such as stainless steel.

The stage 43 is not limited to this, and the stage 43 may be formed of a material without solder, for example, a material such as ceramic or resin. Alternatively, the surface of metal or the like may be coated with plastic or ceramic to be insulated.

Next, in step S3, the first lead 35
The front and rear are pressed with the pressing threads 45 and 46 so that the core conductor 34 and the inner conductor 37 of the core wire 34 come into close contact with each other. And step S
In step 4, a solder 38 such as cream solder is applied to the connection portion between the first lead 35 and the inner conductor 37 of the core wire 34, and in step S5, the solder 38 is melted by the laser beam 48 from the laser probe 47 to melt the first solder 38. The connecting portion between the lead 35 and the inner conductor 37 of the core wire 34 is fixed.

Then, in step S6, as a post-treatment, the pressing threads 45 and 46 are removed, the excess exposed portion 50 of the internal conductor 37 is cut, and finally, the stage 43 is removed to remove the plurality of first leads 35. And the inner conductor 37 of the core wire 34 are independently connected and fixed.

As described above, according to the image pickup apparatus assembling method of this embodiment, the first lead 35 and the inner conductor 37 of the core wire 34 are arranged along the groove of the stage 43, and the solder 38 is melted by the laser beam 48. CCD 32
It is possible to improve the work efficiency of the solder connection work with the inner conductor 37 of the core wire 34 of the signal cable and to improve the quality and reliability of the solder connection portion.

[0024] Although the removal stage 43 in step S 6, for example, if the stage 43 is formed by those subjected to insulation treatment on the material or metal surfaces other than metal, FIG. 3 (b), (c) If the stage 43 is cut along the broken line B shown in, the stage 43 may be left as a part of the imaging device without being removed after the assembly.

A laser beam 48 is used to melt the solder 38.
However, the present invention is not limited to this, and it is also possible to use hot air or other high-energy light source or a heat source such as a reflow furnace for melting.

As a modification of the above embodiment, as shown in FIG. 5, the signal cable may be formed by adding a connecting conductor 51 having a constant thickness to the tip of the inner conductor 37 of the core wire 34. By previously attaching the connecting conductor 51 to the inner conductor 37 of the core wire 34 in this manner, the thickness of the connecting portion of the inner conductors 37 of the core wires 34 having different thicknesses can be made uniform, so that the first lead The connection with 35 can be performed more reliably and with good workability.

[Appendix] 1) The image pickup apparatus assembling method according to claim 1, wherein in the first step, after the part of the external leads and the connection conductor are housed in the groove of the housing part. Fixing the front and rear of the part of the external lead and the connection conductor.

By providing such steps,
The part of the external lead and the connection conductor can be reliably housed and maintained in the groove of the housing portion.

2) A method for assembling an image pickup device according to claim 1, wherein, in the housing portion, solder that melts due to the amount of heat applied to the external leads of the housing portion and the connection conductor does not melt and adhere. It is formed of a member having a heat capacity.

3) The method of assembling the image pickup device according to attachment 2), wherein the housing portion is a metal member.

4) A method for assembling an image pickup device according to claim 1, wherein at least the groove of the storage portion is coated with an insulating film.

5) The image pickup apparatus assembling method according to claim 1, wherein the housing portion is a ceramic member or a resin member.

6) A method of assembling an image pickup device according to claim 1, wherein heat applied to the external lead and the connection conductor of the part of the housing portion is supplied by a laser beam.

7) The image pickup apparatus assembling method according to claim 1, wherein the connection conductor is a signal cable extending into an insertion portion to be inserted into a lumen of an endoscope.

8) In an electronic endoscope for picking up an image of a subject in the lumen by means of a solid-state image sensor provided at the tip of an insertion section to be inserted into the lumen, a signal cable connected to the solid-state image sensor is used. An electronic endoscope comprising signal cable adjusting means for adjusting the length according to the length of the insertion portion.

In the electronic endoscope constructed as described above, since the image pickup apparatus including the same solid-state image pickup element and signal cable can be used for the electronic endoscopes of plural kinds of length, The device can be mass-produced and an inexpensive electronic endoscope can be realized.

[0037]

As described above, according to the image pickup apparatus assembling method of the present invention, the storage jig having the plurality of grooves for storing the connection conductors connected to some of the external leads in the first step, Part of the external leads and the connecting conductors were housed, solder was applied to the part of the housing jig where the external leads and the connecting conductors were housed, and solder was applied in the third step. Since a part of the housing containing the external lead and the connection conductor is heated and melted, it is possible to improve the work efficiency of the solder connection work of the solid-state imaging device and the signal cable, and improve the quality and reliability of the solder connection part. There is an effect.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a configuration of an endoscope apparatus including an imaging device assembled by an imaging device assembling method according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the configuration of the image pickup apparatus shown in FIG.

FIG. 3 is an explanatory view showing an assembling method of the image pickup apparatus,

FIG. 4 is a method of assembling an image pickup apparatus for assembling the image pickup apparatus of FIG.
Flow chart showing the flow of

5 is a configuration diagram showing a configuration of a main part of a modified example of the image pickup apparatus in FIG.

[Explanation of symbols]

1 ... Endoscope 2 ... insertion part 3 ... Operation part 4 ... Universal cable 5 ... Connector 6 ... Light source device 8 ... Imaging device 10 ... Signal cable 12 ... Video processor 31 ... Objective lens 32 ... CCD 33 ... Circuit board 34 ... Core wire 35 ... First external lead 36 ... Second external lead 37 ... Inner conductor 38 ... Solder 41 ... CCD fixed frame 42 ... Fixing jig 43 ... Stage 45, 46 ... Holding thread 47 ... Laser probe 48 ... Laser beam

Claims (2)

(57) [Claims] 1. A imaging apparatus assembling method for solder connection to connect conductors to a plurality of external leads of the solid-state imaging device, said solid plurality of external leads of the least well <br/> part of the external lead of the imaging device A housing jig having a plurality of grooves capable of housing a connecting conductor to be connected to a part of the external leads,
A first step of accommodating the part of the external leads and the connection conductor; a second step of applying solder to an accommodating part of the accommodating jig between the part of the external leads and the connection conductor; And a third step of heating and melting a portion of the external conductor to which the solder is applied and the connection conductor, the third conductor being heated and melted. 2. The connection in the first step.
Place the conductor longer than the groove of the storage jig and
In the third step, the heat-melted and fixed
Longer than the storage area for some external leads and the connection conductor
Fourth step of cutting the exposed connection conductor
The image pickup apparatus according to claim 1, further comprising:
Assembly method .