JP3417777B2 - Electronic endoscope - Google Patents

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an electronic endoscope in which an endoscope observation image is captured by a solid-state imaging device. 2. Description of the Related Art FIG. 6 shows a state in which a solid-state imaging device 10 and a flexible substrate 20 are connected before being incorporated into the distal end of an insertion portion of an endoscope. Numeral 11 denotes a light receiving surface of the solid-state imaging device 10, and 12 denotes pad portions provided on both sides in the same direction as the light receiving surface 11. [0005] Reference numeral 21 denotes a reinforcing plate for the flexible substrate 20.
For example, it is formed of an electrically insulating thin plate such as a polyimide resin. The tip of an inner lead 22 disposed from the reinforcing plate 21 toward the solid-state imaging device 10 is bonded to the pad portion 12 on the front surface of the solid-state imaging device 10. Further, leads 23 for connecting to other circuits are provided.
Are arranged outward from the reinforcing plate 21. The inner lead 22 and the lead 23 are both formed of, for example, a copper material. [0005] The unit of the solid-state image sensor 10 and the flexible substrate 20 configured as described above has the inner lead 22 attached to the solid-state image sensor 10 before being incorporated into the insertion portion of the endoscope.
Along the side surface of the light receiving surface 11. FIG. 7 shows a state in which the inner lead 22 is bent as described above. In order to electrically insulate the side surface of the solid-state imaging device 10 from the inner lead 22, the inner lead 22 is bent. The adhesive 100 is applied from the portion to the side surface of the solid-state imaging device 10.
A cover glass 13 is attached so as to cover the light receiving surface 11 and the bonding portion. As described above, the adhesive 100 for electrically insulating the side surface of the solid-state imaging device 10 from the inner lead 22 is applied in a thin and uniform thickness. Difficult to do, its thickness is 0.2mm ~ 0.5m
m. As a result, as shown in FIG. 7, after the inner lead 22 is bent, the assembled external dimension L of the unit of the solid-state imaging device 10 and the flexible substrate 20 is increased, and the endoscope endoscope is correspondingly increased. The diameter of the distal end of the insertion portion became large, impairing the insertability to the patient. In view of the above, the present invention provides an electronic electronic device capable of ensuring electrical insulation between the side surface of a solid-state imaging device and an inner lead and reducing the assembled external dimensions of the solid-state imaging device and a flexible substrate unit. It is intended to provide an endoscope. In order to achieve the above object, an electronic endoscope according to the present invention comprises a pad provided on a solid-state imaging device in the same direction as a light receiving surface, and a flexible base having a flexible base. In an electronic endoscope in which the inner leads are bonded and the inner leads are bent and arranged along the side surface of the solid-state imaging device toward the rear of the light receiving surface, except for a portion to be bonded to the pad portion. An electrical insulating member is applied to a surface of the inner lead along the solid-state imaging device. Further, in the electronic endoscope of the present invention, an inner lead of a flexible substrate is bonded to a pad portion provided on the solid-state imaging device in the same direction as the light receiving surface, and the inner lead is connected to the solid-state imaging device. In an electronic endoscope that is bent and disposed along the side surface of the element toward the rear of the light receiving surface, except for a portion to be bonded to the pad portion, a surface of the inner lead on a side along the solid-state imaging device is removed. And a sheet-shaped electrical insulating member laminated. The thickness of the electric insulating member is 0.01
It is good to be in the range of 0.1 mm to 0.1 mm. Embodiments of the present invention will be described with reference to the drawings. FIG. 2 shows a distal end portion of the insertion portion of the endoscope, and FIG. 3 shows a cross section taken along the line III-III. The distal end portion main body 31 is formed of one component made of an electrically insulating plastic material such as modified polyphenylene oxide and polysulfone, and is provided at the distal end of the elongated flexible insertion portion so as to be freely bent by remote control. Part 32
Is connected to the tip portion. The bending portion 32 rotatably connects a number of node rings 33 with rivets 34, and has a mesh tube 35 around its outer periphery.
, And the outer surface thereof is further covered with an outer cover 36 made of a rubber tube or the like. The distal end portion of the outer cover 36 is tightly bonded to the outer peripheral surface of the distal end portion main body 31. 38 is a bending operation wire. The distal end main body 31 and the bent portion 32 are screwed by a female screw into a pair of metal screw pieces 37 embedded in the concave portion of the distal end main body 31 with a female screw. It is linked by being done. The endoscope according to the present embodiment is a so-called forward-looking endoscope for observing the front, and an observation window 41, an air supply / water supply nozzle 42, and an A non-illuminated window, a forceps channel exit hole, and the like are provided. Reference numerals 71 and 72 denote distal end portions of the air supply and water supply tubes, 73 denotes a light guide fiber bundle for illumination, and 74 denotes a forceps channel. Inside the observation window 41, an objective lens group 46 is provided.
Are fixed in a metal lens frame 47 by a spacer 49 at predetermined intervals. An insulating ring 51 made of an electrically insulating plastic material is joined to the outer peripheral portion of the front half of the lens frame 47. The outer peripheral surface of the insulating ring 51 is formed with a hole 5 having a circular cross section formed in the front end portion of the tip end body 31 in parallel with the axial direction.
An O-ring 53 for sealing is attached to the fitting portion. Reference numeral 54 denotes a defoamed electrically insulating adhesive. The connecting member 48 fixed to the rear end portion of the lens frame 47 has a rectangular outer shape, and the front end portion of a metal shield pipe 55 is fitted and joined to the outer peripheral portion. . The shield pipe 55 has a rectangular hole 5 formed through the circular hole 52 and extending to the rear end of the distal end main body 31.
6 and a solid-state imaging device 10 formed of, for example, a charge-coupled device (CCD).
Are fixed with the light receiving surface 11 facing forward. A color correction filter 58 is attached to the front surface of the cover glass 13 attached to the front surface. Reference numeral 59 denotes a light shielding mask for shielding unnecessary light around the optical path. In the shield pipe 55, as shown in FIG.
An electronic component 61 for processing a signal input / output to / from the
The solid-state imaging device 10 is attached to the wiring board 62 and is disposed on the rear side. Then, the signal cable 63 is led backward from there. Insulating tapes 64 and 65 are wound around the outer peripheral surface of the components arranged in the shield pipe 55 and the outer peripheral surface of the shield pipe 55, respectively, to electrically insulate the shield pipe 55 from the inside and outside. ing. A flexible substrate 20, such as a TAB substrate (tape automating bonding), is attached to the solid-state imaging device 10, and the rear ends of the leads 23 of the flexible substrate 20 are bent inward. Then, the wiring board 62 is fixed thereto. The solid-state imaging device 10 and the flexible substrate 20
Before being incorporated in the shield pipe 55, as shown in FIG. 6 in advance, the inner leads of the flexible substrate 20 are attached to the pad portions 12 provided on both sides in the same direction as the light receiving surface 11 of the solid-state imaging device 10. 22 are connected by bonding. Then, the cover glass 13 is joined so as to cover the light receiving surface 11 and the bonding portion. Reference numeral 21 denotes a reinforcing plate for the flexible substrate 20,
For example, it is formed of an electrically insulating thin plate such as a polyimide resin. The leads 23 for connecting to the wiring board 62 are arranged outward from the reinforcing plate 21. The inner lead 22 and the lead 23 are both formed of a copper material or the like.
Except for the bonding part and the vicinity of the end of the lead 23,
An electric insulating member such as a silicon adhesive is thinly applied to the back surfaces of the inner leads 22 and the leads 23, for example. Its thickness ranges from 0.01 mm to 0.1 mm. When the unit composed of the solid-state imaging device 10 and the flexible substrate 20 configured as described above is incorporated into the shield pipe 55, the inner leads 22 are connected to the light receiving surface 11 along the side surface of the solid-state imaging device 10. It is bent so that it goes to the back of. FIG. 1 shows a state in which the inner lead 22 is bent as described above.
The electrically insulating member 70 applied to the back surface of the solid-state imaging device 1
0 and the inner lead 22 are electrically insulated from each other. As described above, the thickness of the electrically insulating member 70 is in the range of 0.01 mm to 0.1 mm. Therefore, as shown in FIG. 1, the assembled outer dimension L of the unit of the solid-state imaging device 10 and the flexible substrate 20 after the inner lead 22 is bent is small.
1 can be formed to be thin, and it is possible to obtain an excellent insertion property with less pain for the patient. FIG. 5 shows a solid-state image pickup device 10 and a unit of a flexible substrate 20 according to a second embodiment of the present invention, in which an electric insulating member 70 is applied to the back surfaces of the inner leads 22 and the leads 23. Instead, a sheet-like electric insulating member 80 is laminated. Electrical insulation member 8
As the material of 0, polyester, polyimide, or the like can be used, and its thickness is in the range of 0.01 mm to 0.1 mm. Also in the second embodiment, by bending the inner lead 22, as shown in FIG. 1, the electric insulating member 80 laminated on the back surface of the inner lead 22 is attached to the package of the solid-state imaging device 10. It is sandwiched between the inner lead 22 and the both are electrically insulated. As a result, as in the first embodiment, the assembled outer dimensions L of the unit of the solid-state imaging device 10 and the flexible substrate 20 after the inner leads 22 are bent are small. Can be formed to have a small diameter, and an excellent insertion property with less pain for the patient can be obtained. According to the present invention, an electric insulating member is applied to the surface of the inner lead along the solid-state imaging device except for the portion to be bonded to the pad portion of the solid-state imaging device, The electrical insulation between the solid-state image sensor and the inner lead is ensured by laminating the electrical insulating member of the solid-state image sensor, and the unit of the solid-state image sensor and the flexible substrate after the inner lead is bent is assembled. Dimensions can be reduced. As a result, the outer shape of the distal end of the insertion section of the endoscope into which the solid-state imaging device is incorporated can be formed thin, and an endoscope having excellent insertion characteristics with less pain for the patient can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view of a solid-state imaging device and a unit of a flexible substrate according to an embodiment of the present invention after an inner lead is bent. FIG. 2 is a side sectional view of a distal end of an insertion section of an endoscope in which the solid-state imaging device according to the embodiment of the present invention is incorporated. FIG. 3 is a sectional view taken along the line III-III of the embodiment of the present invention. FIG. 4 is a partially enlarged side cross-sectional view around the solid-state imaging device incorporated in the distal end of the insertion section of the endoscope according to the embodiment of the present invention. FIG. 5 is a front view of a solid-state imaging device and a flexible substrate unit according to a second embodiment of the present invention before the inner lead is bent. FIG. 6 is a front view of a unit including a solid-state imaging device and a flexible substrate before an inner lead is bent. FIG. 7 is a side cross-sectional view of a state in which a conventional solid-state imaging device and a flexible substrate unit are bent after inner leads are bent. [Description of Signs] 10 Solid-state imaging device 11 Light receiving surface 12 Pad section 20 Flexible substrate 21 Reinforcement plate 22 Inner lead 23 Lead 70 Electrical insulating member 80 Electrical insulating member

Claims (1)

(57) by bonding the inner leads of the flexible substrate to the pad portion provided in the same direction as the light-receiving surface to the Claims 1 solid-state imaging device, the upper Symbol solid-state imaging the inner leads Along with bending and disposing the element along the side of the element toward the rear of the light receiving surface , a reinforcing plate as a base material of the flexible substrate is provided.
Bonding part of the inner lead to the pad part
Solid-state imaging at the lead-side end, which is the opposite end
In the electronic endoscope arranged on the surface opposite to the device, the entire surface of the inner lead except for a portion for bonding to the pad portion on the surface of the inner lead along the solid-state imaging device ,
Over the entire surface except for the near-equipped rear end of the lead, the reinforcing plate is a base material of the flexible substrate coated with a different electrically insulating member, or in the substrate of the flexible substrate An electronic endoscope in which a sheet-shaped electric insulating member different from a reinforcing plate is laminated.