JPS61281680A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To minimize the tip diameter of the television camera by sealing a solid-state image pickup element which is mounted on a substrate with a transparent body equipped with the reflecting surface to change the light receiving path. CONSTITUTION:A square solid-state image pickup element 6 is mounted on the substrate 7. The element 6 and the substrate 7 are almost parallel to an optical axis 9. A bonding area 10 is provided in the longitudinal direction of the substrate 7, and a spacer 11 to surround the element 6 is fixed on the substrate 7. By the transparent body 13 of a prism, etc., equipped with a reflecting surface 12 to change the light receiving path at the edge part as shown by the arrow mark, the element 6 is enclosed. Since a length L in the direction vertical to the element 6 can be made small than the length M of one side of the element 6, the tip diameter of the camera tip part is determined by the length M of one side of the element 6. A circuit element 14 to constitute an impedance converting circuit does not give the influence to the diameter (l) in the longitudinal direction of the substrate 7, and therefore, can be mounted on the substrate 7.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a solid-state imaging device suitable for use in a video camera having an ultra-small tip, such as an endoscope.

(b) Conventional technology As disclosed in Japanese Patent Application Laid-Open No. 122087/1987, a conventional solid-state imaging device has a solid-state imaging device mounted on a substrate, and this solid-state imaging device constitutes a light receiving window. By sealing with a flat transparent body and arranging the optical lens and the solid-state image sensor in parallel, the solid-state image sensor was kept perpendicular to the light-receiving optical axis.

(c) Problems to be solved by the invention In the conventional technology, the solid-state image sensor (1) is connected to the light receiving optical axis (2).
As shown in Figure 3, the length of the bonding area (4) for connecting the electrode of the solid-state image sensor (1) to the terminal of the substrate (3) is Camera tip diameter! Therefore, there was a problem that the tip diameter had to be thick (%K,
Since the video camera used in endoscopes has its tip inserted into the human body through the mouth, such a small length has been a considerable problem.

In addition, in endoscopes, it is impossible to incorporate circuits after the amplifier circuit into the tip of the camera that is inserted into the human body, but it is impossible to incorporate the circuits after the amplifier circuit into the tip of the camera, which is inserted into the human body.
It is also difficult to lead the signal directly to an amplifier circuit outside the human body via a long cable because it is accompanied by attenuation. Therefore, as shown in FIG. 4, it is necessary to place an impedance conversion circuit (5) close to the solid-state image sensor (1)K. Furthermore, it is necessary to provide a space for mounting the impedance conversion circuit (5), and the diameter of the tip becomes larger.

B) Means for Solving the Problems The present invention is a device in which a solid-state image sensor is mounted on a substrate, and the solid-state image sensor is sealed with a transparent body having a reflective surface for changing the light receiving optical path. .

((e) Effect) In the present invention, it is no longer necessary to arrange the solid-state image sensor perpendicularly to the light receiving optical axis, and the bonding area can be arranged in a direction that is not related to the tip diameter. It becomes possible to mount it on a substrate in a direction that is not related to the tip diameter.

(f) Embodiment Figure 1 is a side view showing an embodiment of the present invention, and Figure 2 is a plan view of the main parts thereof. (6) is a square solid-state image sensor such as COD, and (7) is a solid-state image sensor. A substrate made of alumite or ceramic (8) for mounting the element is an optical lens, and the solid-state image sensor (6) and the substrate (7) are aligned with the optical axis (9).
) is arranged approximately parallel to the

The bonding area αQ between the electrode of the solid-state image sensor (6) and the substrate (power terminal) is arranged in the longitudinal direction of the substrate (7), and the spacer αυ surrounding the solid-state image sensor (6) is located on the substrate (7). A transparent body α3 such as a prism with a reflective surface (12) at the end that changes the receiving optical path as shown by the arrow, such as a mirror surface or a total reflective surface,
The solid-state image sensor (6) is hermetically sealed.

Here, the length L in the direction perpendicular to the solid-state image sensor (6), consisting of the thickness of the transparent body U, the spacer qυ, and the substrate (force), should be smaller than the length M of the negative side of the solid-state image sensor (6). is possible, so the tip diameter l of the camera tip is determined by the length M of the negative side of the solid-state image sensor (6).

For example, if the length M of one side of the solid-state image sensor (61 is 6), the width N of the spacer αυ is 0.5111, and the thickness of the cover is 1, the tip diameter in this example is , 60 (
0,51) However, in the conventional example, the length of the bonding region (4) is added, so even if this length is 1n on one side, it is 9
+(1x2)=11tg, which exceeds 10m.

By the way, in FIGS. 1 and 2, a4 is a circuit element such as a printed resistor, chip capacitor, or transistor that constitutes an impedance conversion circuit, and in this embodiment, the longitudinal direction of the substrate (7) is set to the tip diameter l. Since it has no influence at all, such a circuit element can be mounted on the same substrate on which the solid-state image sensor (6) is mounted. Note that FIG. 2 shows a state with the transparent body a3 removed.

In the above description, the solid-state image sensor (6) is referred to as 6111
Although the shape is a square with 11 sides, it is also possible to make it rectangular, such as 4 m x 7 m. In this case, according to the present invention, the diameter of the tip can be adjusted to the short side of 4 m of the solid-state image sensor. However, if the solid-state image sensor is arranged perpendicularly to the light-receiving optical axis as in the conventional case, the diameter of the tip must be adjusted to the length of the seven long sides (and the difference in diameter becomes larger).

In addition, if the impedance circuit can be made into a chip, seal this chip together with the solid-state image sensor (6),
May be packaged.

(g) Effects of the invention According to the invention, the diameter of the tip of the video camera can be reduced,
Ideal for endoscopes and other video cameras that require a very thin tip. Furthermore, it becomes possible to mount accessory circuit components on the same substrate in close proximity to the solid-state imaging device without increasing the diameter of the tip.

[Brief explanation of the drawing]

Fig. 1 is a side view showing an embodiment of the present invention, Fig. 2 is a plan view of essential parts of the embodiment, Fig. 3 is a schematic diagram showing the configuration of a conventional solid-state imaging device, and Fig. 4 is an endoscope. 1 is a schematic diagram showing a circuit configuration of a video camera used. Explanation of main drawing numbers (6)...Solid-state image sensor, (7)...Substrate, (
8)...Optical lens, α2...Reflecting surface, αy・
...Transparent body. Applicant Sanyo Electric Co., Ltd. and 1 other representative Patent attorney Yasuo Sano Figure 1 Figure 2 Figure 3 Figure 411

Claims (1)

[Claims] (1) A solid-state imaging device, characterized in that a solid-state imaging device is mounted on a substrate, and the solid-state imaging device is sealed with a transparent body having a reflective surface for changing a light receiving optical path.