JPS63219187A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS63219187A
JPS63219187A JP61247925A JP24792586A JPS63219187A JP S63219187 A JPS63219187 A JP S63219187A JP 61247925 A JP61247925 A JP 61247925A JP 24792586 A JP24792586 A JP 24792586A JP S63219187 A JPS63219187 A JP S63219187A
Authority
JP
Japan
Prior art keywords
hybrid integrated
circuit board
printed circuit
integrated circuit
metal substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61247925A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0531839B2 (enrdf_load_stackoverflow
Inventor
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61247925A priority Critical patent/JPS63219187A/ja
Priority to US07/107,990 priority patent/US4884125A/en
Priority to DE8787114938T priority patent/DE3777324D1/de
Priority to EP87114938A priority patent/EP0264780B1/en
Priority to KR1019870011409A priority patent/KR900007232B1/ko
Publication of JPS63219187A publication Critical patent/JPS63219187A/ja
Publication of JPH0531839B2 publication Critical patent/JPH0531839B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP61247925A 1986-10-15 1986-10-17 混成集積回路 Granted JPS63219187A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP61247925A JPS63219187A (ja) 1986-10-17 1986-10-17 混成集積回路
US07/107,990 US4884125A (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
DE8787114938T DE3777324D1 (de) 1986-10-15 1987-10-13 Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann.
EP87114938A EP0264780B1 (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
KR1019870011409A KR900007232B1 (ko) 1986-10-15 1987-10-14 혼성집적회로

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61247925A JPS63219187A (ja) 1986-10-17 1986-10-17 混成集積回路

Publications (2)

Publication Number Publication Date
JPS63219187A true JPS63219187A (ja) 1988-09-12
JPH0531839B2 JPH0531839B2 (enrdf_load_stackoverflow) 1993-05-13

Family

ID=17170585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61247925A Granted JPS63219187A (ja) 1986-10-15 1986-10-17 混成集積回路

Country Status (1)

Country Link
JP (1) JPS63219187A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6365263U (enrdf_load_stackoverflow) * 1986-10-20 1988-04-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6365263U (enrdf_load_stackoverflow) * 1986-10-20 1988-04-30

Also Published As

Publication number Publication date
JPH0531839B2 (enrdf_load_stackoverflow) 1993-05-13

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