JPS63217787A - Three plate camera - Google Patents
Three plate cameraInfo
- Publication number
- JPS63217787A JPS63217787A JP62050542A JP5054287A JPS63217787A JP S63217787 A JPS63217787 A JP S63217787A JP 62050542 A JP62050542 A JP 62050542A JP 5054287 A JP5054287 A JP 5054287A JP S63217787 A JPS63217787 A JP S63217787A
- Authority
- JP
- Japan
- Prior art keywords
- attached
- solid
- terminal
- camera
- spectroscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000012544 monitoring process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Color Television Image Signal Generators (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は監視用カラーカメラ等に使用するカラー用３板
カメラに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a color three-panel camera used for surveillance color cameras and the like.
従来の技術
２ ヘ一／゛
従来のカラーカメラは、プリズムで被写体の反射光を３
経路に分離し、赤（Ｒ）、緑（Ｇ）、青（Ｂ）のフィル
タを介してそれぞれの撮像素子をカメラ本体に取シ付け
ていた。そして、これら撮像素子の出力信号はリード線
を介して色信号処理回路へ入力されていた。Conventional technology 2 F/゛Conventional color cameras use a prism to collect the reflected light from the subject in 3
The image sensors were separated into paths and attached to the camera body through red (R), green (G), and blue (B) filters. The output signals of these image sensors are input to the color signal processing circuit via lead wires.
発明が解決しようとする問題点
しかしながら、上記従来のカラー用３板カメラは３個の
撮像素子と色信号処理回路との間をＩＪ −ド線を介し
て接続するという構成になっていたので、組立作業が面
倒であるとともに、小型、軽量化をしにくいという問題
点があった。Problems to be Solved by the Invention However, the above-mentioned conventional color three-chip camera has a configuration in which the three image pickup elements and the color signal processing circuit are connected via IJ-wires. There were problems in that assembly work was troublesome and it was difficult to make it smaller and lighter.
本発明は上記問題点を解決するものであり、組立作業が
容易で、小型、軽量化の容易な優れた３板カメラを提供
することを目的とする。The present invention is intended to solve the above problems, and aims to provide an excellent three-panel camera that is easy to assemble, small in size, and light in weight.
問題点を解決するだめの手段
本発明は上記問題点を解決するために、分光器のそれぞ
れの出射口に、固体撮像素子を取シ付け、この固体撮像
素子の端子にフレキシブルプリント基板を取り付けて、
回路構成部をつづら折りにし３ ・・−・
てケースに収納するという構成にしだものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a method in which a solid-state image sensor is attached to each output port of a spectrometer, and a flexible printed circuit board is attached to the terminal of this solid-state image sensor. ,
The structure is such that the circuit components are folded up and stored in a case.
作用
本発明は上記構成によシ、撮像素子と回路構成部との接
続にリード線が不要となるので、組立作業が容易とな９
、小型、軽量化を図ることができる。Effect of the Invention Due to the above structure, the present invention eliminates the need for lead wires to connect the image sensor and the circuit component, making assembly work easier.
, smaller size, and lighter weight.
実施例
第１図は本発明の一実施例による３板カメラの組立斜視
図、第２図は同実施例の一部切り欠きにて示す正面図で
ある。Embodiment FIG. 1 is an assembled perspective view of a three-panel camera according to an embodiment of the present invention, and FIG. 2 is a partially cutaway front view of the same embodiment.
第１図、第２図において、１は表面１ａで受光した景色
を走査して映像信号として端子１ｂから出力する固体撮
像素子、２はセラミックで形成され固体撮像素子１の端
子１ｂを孔２ａに挿入して固体撮像素子１を取り付ける
ベース板である。３は入射した光を赤、緑、青の３系統
に分光する分光器であり、収納されたプリズムにより３
系統に分光し、それぞれの系統に赤、緑、青のいずれか
のフィルタを取り付けだものである。４はフレキシブル
プリント基板であり、固体撮像素子１の端子１ｂを挿入
してハンダ付する取付部４ａと、円形であって色信号処
理回路のチップ部品を搭載する回路構成部４ｃ、 ４
ｅ、 ４ｇ、 ４ｉ、 と折シ曲げ部４ｄ、４ｆ
、４ｈ、４ｊとから形成されている。５はレンズ群、６
はレンズ群５およびフレキシブルプリント基板４等を取
り付けるケースである。In FIGS. 1 and 2, numeral 1 is a solid-state image sensor that scans the scenery received on the surface 1a and outputs it as a video signal from the terminal 1b, and 2 is made of ceramic, and the terminal 1b of the solid-state image sensor 1 is inserted into the hole 2a. This is a base plate into which the solid-state image sensor 1 is inserted. 3 is a spectrometer that separates the incident light into three systems: red, green, and blue.
The light is divided into systems, and each system is equipped with a red, green, or blue filter. 4 is a flexible printed circuit board, which includes a mounting part 4a into which the terminal 1b of the solid-state image sensor 1 is inserted and soldered, and a circular circuit component part 4c on which chip components of a color signal processing circuit are mounted.
e, 4g, 4i, and folded parts 4d, 4f
, 4h, and 4j. 5 is a lens group, 6
This is a case in which the lens group 5, flexible printed circuit board 4, etc. are attached.
次に本実施例の組立工程について説明する。Next, the assembly process of this embodiment will be explained.
まず、固体撮像素子１の端子１ｂをベース板２の孔２ａ
に挿入する（工程（イ））。次に分光器３０３個の分光
面３３〜３Ｃに、固体撮像素子１の表面１ａが対向する
ようそれぞれ取シ付ける（工程（ロ））。従って、端子
１ｂが外部に向う方向で取シ付けられる。そして、この
端子１ｂにフレキシブル基板４の取付部４ａの孔４ｂを
挿入させて、ハンダ付を行ない取り付ける（工程（ハ）
）。次に折シ曲げ部４ｊ、４ｄ、４ｆ、４ｈを折シ曲げ
て、コネクタ部７を円板４（１）に取シ付ける。最後に
分光器３のプリズム入射面がレンズ５に対向するように
してケースにフレキシブルプリント基板４等を５ ・−
収納する。First, connect the terminal 1b of the solid-state image sensor 1 to the hole 2a of the base plate 2.
(Step (a)). Next, the solid-state imaging device 1 is attached to the spectroscopic surfaces 33 to 3C of the three spectroscopes so that the surface 1a thereof faces each other (step (b)). Therefore, the terminal 1b is attached in the direction facing outside. Then, insert the terminal 1b into the hole 4b of the attachment part 4a of the flexible board 4, and perform soldering to attach it (step (c)).
). Next, the bent portions 4j, 4d, 4f, and 4h are bent and the connector portion 7 is attached to the disk 4(1). Finally, the flexible printed circuit board 4 and the like are housed in the case so that the prism entrance surface of the spectrometer 3 faces the lens 5.
このようにして本実施例は、３板カメラを組立てるので
、撮像素子１と分光器３および色信号処理回路とがリー
ド線なしで取り付けできる。In this embodiment, a three-chip camera is assembled in this manner, so that the image sensor 1, spectrometer 3, and color signal processing circuit can be attached without lead wires.
なお、ベース板３の一面（端子１ｂ側）に色信号処理回
路等の所定の電気回路を設けるようにし、その回路用と
して設けたピンをフレキシブル基板４の孔４ｂに対応す
るようにしてもよい。また、フレキシブル基板４はカメ
ラケース６に収納する前にあらかじめ第１図（ホ）のよ
うにした状態で樹脂モールドするようにしてもよいし、
又はメタル、プラスチック等で作った筒に入れて一体化
しておいてもよい。Note that a predetermined electric circuit such as a color signal processing circuit may be provided on one surface of the base plate 3 (on the terminal 1b side), and the pin provided for the circuit may be made to correspond to the hole 4b of the flexible substrate 4. . Furthermore, the flexible substrate 4 may be resin-molded in the state shown in FIG. 1 (E) before being stored in the camera case 6.
Alternatively, it may be integrated into a tube made of metal, plastic, etc.
本実施例では固体撮像素子１はベース板２を介してプリ
ズム３に固定するようにしており、固体撮像素子１の大
きさにかかわらずプリズム３と対応させることができ、
かつ温度変化に対しても安定した一体化状態を保持でき
る。フレキシブル基板４でリード線を使用することなく
色信号処理回路を構成することができる一方、ベース板
２の一６ハ゛−／
面にフレキシブル基板４を直接接合するようにしている
だめに組立作業も容易にできる。さらにこのような構成
により、小型用３板カメラの実現が容易である。In this embodiment, the solid-state image sensor 1 is fixed to the prism 3 via the base plate 2, so that it can be made to correspond to the prism 3 regardless of the size of the solid-state image sensor 1.
Moreover, a stable integrated state can be maintained even under temperature changes. While it is possible to configure a color signal processing circuit using the flexible substrate 4 without using lead wires, since the flexible substrate 4 is directly bonded to the 16-/- side of the base plate 2, assembly work is also required. It's easy to do. Furthermore, with such a configuration, it is easy to realize a compact three-chip camera.
発明の効果
本発明は上記実施例より明らかなように、分光器のそれ
ぞれの出射口に、固体撮像素子を取り付け、この固体撮
像素子の端子にフレキシブルプリント基板を取り付けて
、回路構成部をつづら折りにしてケースに収納するとい
う構成にしだので、撮像素子と回路構成部との接続にリ
ード線が不要となり、組立作業が容易で、小型軽量化が
できるという効果を有する。Effects of the Invention As is clear from the above embodiments, the present invention has a method in which a solid-state image sensor is attached to each exit port of a spectrometer, a flexible printed circuit board is attached to the terminal of this solid-state image sensor, and the circuit component is folded in a zigzag manner. Since the structure is such that the image sensor is housed in a case, lead wires are not required to connect the image sensor and the circuit component, and the assembly work is easy and the device can be made smaller and lighter.
第１図は本発明の一実施例による３板カメラの組立斜視
図、第２図は同実施例の一部切シ欠きにて示す正面図で
ある。
１・・・固体撮像素子、１ａ・・・表面、１ｂ・・・端
子、２・・・ベース板、２ａ・・・孔、３・・・分光器
、４・・・フレキシブルプリント基板、４ａ・・・取付
部、４Ｃ９４７ ・−２
ｅ、 ４ ｇ、 ４ ｉ・−回路構成部、４ｄ、
４ｆ、 ４．ｈ。
４」・・・折り曲げ部、５・・・レンズ群、６・・・ケ
ース。FIG. 1 is an assembled perspective view of a three-panel camera according to an embodiment of the present invention, and FIG. 2 is a partially cutaway front view of the same embodiment. DESCRIPTION OF SYMBOLS 1... Solid-state image sensor, 1a... Surface, 1b... Terminal, 2... Base plate, 2a... Hole, 3... Spectrometer, 4... Flexible printed circuit board, 4a.・・Mounting part, 4C947 ・-2 e, 4 g, 4 i・-Circuit component, 4 d,
4f, 4. h. 4"...Bending portion, 5...Lens group, 6...Case.
Claims (1)
した光をプリズムで３系統に分光し、赤緑青のフィルタ
を介して出射する分光器と、複数の回路構成部およびこ
れらを接続する折り曲げ部が形成され、一端には取付部
、他端にはコネクタ部が形成されたフレキシブルプリン
ト基板とを備え、上記分光器のそれぞれの出射口に上記
固体撮像素子が対向するよう上記ベース板を取り付け、
上記端子へ上記取付部をそれぞれ取り付けて、上記回路
構成部をつづら折りにしてケースに収納することを特徴
とする３板カメラ。A base plate with the terminal of the solid-state image sensor passed through the hole, a spectrometer that splits the incident light into three systems using a prism and outputs it through a red, green, and blue filter, and multiple circuit components and these are connected. The base plate is provided with a flexible printed circuit board having a bent part formed therein, a mounting part formed at one end, and a connector part formed at the other end, and the base plate is arranged so that the solid-state imaging device faces each output port of the spectroscope. attachment,
A three-panel camera characterized in that the mounting portions are respectively attached to the terminals, and the circuit component is folded up and stored in a case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62050542A JPS63217787A (en) | 1987-03-05 | 1987-03-05 | Three plate camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62050542A JPS63217787A (en) | 1987-03-05 | 1987-03-05 | Three plate camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63217787A true JPS63217787A (en) | 1988-09-09 |
Family
ID=12861898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62050542A Pending JPS63217787A (en) | 1987-03-05 | 1987-03-05 | Three plate camera |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63217787A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131228A (en) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | Optical device module and its manufacturing method |
| JP2016148677A (en) * | 2010-08-09 | 2016-08-18 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Micro inertia measurement apparatus |
| US9664516B2 (en) | 2014-04-25 | 2017-05-30 | SZ DJI Technology Co., Ltd. | Inertial sensing device |
-
1987
- 1987-03-05 JP JP62050542A patent/JPS63217787A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131228A (en) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | Optical device module and its manufacturing method |
| JP2016148677A (en) * | 2010-08-09 | 2016-08-18 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Micro inertia measurement apparatus |
| US10132827B2 (en) | 2010-08-09 | 2018-11-20 | SZ DJI Technology Co., Ltd. | Micro inertial measurement system |
| US10732200B2 (en) | 2010-08-09 | 2020-08-04 | SZ DJI Technology Co., Ltd. | Micro inertial measurement system |
| US11215633B2 (en) | 2010-08-09 | 2022-01-04 | SZ DJI Technology Co., Ltd. | Micro inertial measurement system |
| US9664516B2 (en) | 2014-04-25 | 2017-05-30 | SZ DJI Technology Co., Ltd. | Inertial sensing device |
| US10184795B2 (en) | 2014-04-25 | 2019-01-22 | SZ DJI Technology Co., Ltd. | Inertial sensing device |
| US10563985B2 (en) | 2014-04-25 | 2020-02-18 | SZ DJI Technology Co., Ltd. | Inertial sensing device |
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