JP2811635B2 - Structure for fixing solid-state imaging device and method for fixing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for fixing a solid-state imaging device such as a charge-coupled device (CCD) used in a television camera or the like.

[0002]

2. Description of the Related Art Conventionally, in a television camera or the like, imaging light of a subject emitted from an optical system is red (R), green (G), and blue (B) by a three-color separation prism (color separation prism). After the subject image of each color component is photoelectrically converted into a video signal of each color by three solid-state image sensors, various signal processing is performed from each imaging output, for example, a composite color video signal of an NTSC system. (Television signal) is known.

A solid-state image sensor for photoelectrically converting the subject image of each color component is fixed to each light emitting surface via a pair of prism bases fixed to a color separation prism. These solid-state imaging devices are accurately fixed in a state where back focus adjustment and registration adjustment on the order of μm are performed for each optical axis using a predetermined jig, and the work requires careful attention. Things.

[0004]

By the way, the solid-state image pickup device is fixed to the light exit surface side of the color separation prism after the above-mentioned back focus adjustment and various adjustments such as up, down, left and right tilts are completed. However, adhesives and screws are often used for fixing.

However, the fixing operation of the solid-state image sensor with the adhesive is not only complicated and time-consuming, but also the adhesive enters between the element holder and the spacer, and the position of the adjusted solid-state image sensor is deviated. There is a problem. Therefore, as shown in, for example, Japanese Utility Model Application Laid-Open No. 59-39580, a pillar is provided on a prism, this is fitted into a hole of a solid-state imaging device, and solder is applied to a gap between the pillar and the mounting hole to connect the two. Although there is a proposal to join, although the joining operation is relatively simplified, it is difficult to set up a support on the prism, and there is a danger that solder may reach the prism and the surface side of the solid-state imaging device. It was not very effective.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a first invention is directed to a solid-state image pickup device and a light-receiving surface side of the solid-state image pickup device, wherein a color separation prism is provided. An element base having a first connection portion fixed to the light emission surface side, including a second connection portion, and having a mounting stud erected, an opening for opening the light receiving surface side while mounting the solid-state imaging device; An element holder having an insertion hole larger in diameter than the stud so as to insert the mounting stud, and having a connection portion connected to the second connection portion; and the solid-state imaging device on the element holder. An elastic member fixed to the mounting stud so as to elastically press the element and displace the element holder with respect to the element base; If you provide a fixed structure To,

According to a second aspect of the invention, based on the solid-state imaging device assembly constructed according to the first aspect, the device holder of the solid-state imaging device assembly is back-focused in correspondence with a fixing portion of the color separation prism. After the adjustment, the first connection portion and the fixing portion of the element base are fixed, and the element holder is displaced with respect to the element base. After the registration adjustment, the connection portion of the element holder and the element base are adjusted. It is another object of the present invention to provide a method for fixing a solid-state imaging device, wherein the method comprises fixing the second connection portion.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to a three-plate type color video camera. FIG. 1 is an exploded perspective view showing an embodiment of a solid-state imaging device fixing structure and a fixing method according to the present invention.

The embodiment shown in FIG. 1 will be described with reference to, for example, a three-plate video camera. A three-color separation prism 1 has a ceramic prism base 3 attached to both sides thereof.
a, 3b to be attached to the frame of the device. The imaging light of the subject incident on an imaging lens (taking lens) (not shown) is
The light is separated into three colors of red (R), green (G), and blue (B), and reaches the light receiving surface of the solid-state imaging device 5 via the trimming filter 2 from the light emission surface side of the three-color separation prism 1. Has become.

A metal coating (metallizing layer) 4 such as copper (Cu) or silver palladium (Ag-Pd) is applied to the light emitting surfaces of the prism bases 3a and 3b by a metallizing method. .

A metal plate-like element holder 7 provided with a solid-state image pickup device 5 is sequentially stacked on a metal plate-like element base 6 and the element base 6 is screwed with a screw 9 via a leaf spring 8. By doing so, the respective intermediate members are elastically pressed and fixed to each other. Each of the element base 6 and the element holder 7 is a metal that can be soldered.

More specifically, an element base 6 having an opening 6a corresponding to the light receiving surface of the solid-state imaging element 5 has bent pieces 6b connected to the metal coatings 4 of the prism bases 3a and 3b at central portions on both sides. 6b and 4
The connecting pieces 6c, 6c and the mounting studs 6d, 6d protrude.

On the other hand, the element holder 7 has openings 7a corresponding to the light receiving surface and insertion holes 7b, 7b having a diameter sufficiently larger than the diameter of the studs for inserting the studs 6d, 6d. Connection piece 6 of base 6
c, 6c, and projecting connecting pieces 7c, 7c, and further, upstanding tongue pieces 7d, 7d surrounding the solid-state imaging device 5.
Having.

At the time of mounting, the studs 6d, 6d of the element base 6 are provided with through holes 7 of sufficiently large diameter of the element holder 7.
The solid-state imaging device assembly 10 is temporarily assembled by inserting the solid-state imaging device 5 into the studs 6d and 6d with the screws 9 and 9 via the leaf spring 8 through the b and 7b. By this provisional assembly, the element holder 7 provided with the solid-state imaging element 5 with respect to the element base 6 is allowed to move elastically back and forth (in the optical axis direction) based on the studs 6d and 6d, and has a sufficiently large diameter. The vertical and horizontal movements are allowed by the insertion holes 7b.

The solid-state image pickup device assembly 10 is arranged with a jig (not shown) so as to maintain a predetermined relationship with the trimming filter 2. After adjusting the tilt, the bent pieces 6b, 6b of the element base 6 and the prism base 3a,
3b and the metal coating 4 are fixed by soldering. Thereafter, the element holder 7 holding the solid-state imaging element 5 is pressed or held by the elastic force of the leaf spring 8 against the pressing force with the element base 6 to move or rotate on the element holder 7 so that the three colors (R , G, B)
After the registration adjustment of
Connection pieces 6c, 6c and connection pieces 7c, 7c of the element holder 7
And the three-color separation prism 1
The solid-state imaging device 5 on which the back focus adjustment and the registration adjustment have been accurately performed is fixed to the imaging light emitting surface. By using the solid-state imaging device assembly as described above, each of the above adjustments can be individually performed in two parts. Therefore, once the back focus is adjusted, the previous adjustment (registration adjustment) is performed in the subsequent operation (registration adjustment). Without making any mistakes, the various adjustment operations can be performed very accurately, and as a result, the reliability of the equipment is improved.

[0016]

As described above in detail, according to the solid-state image sensor fixing structure and the fixing method of the present invention, the element holder holding the solid-state image sensor can be relatively displaced along the element base. The use of the solid-state image pickup device assembly which is elastically pressed into contact allows the back focus adjustment and the registration adjustment for the prism to be performed separately in two parts. In other adjustments performed during the process, the previous adjustment position is not deviated, and there is an advantage that the reliability of the device is improved, such as easiness of assembly and improvement of assembly accuracy.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a solid-state imaging device fixing structure and a fixing method according to the present invention.

[Explanation of symbols]

1 ... color separation prism, 2 ... trimming filter, 3a,
3b: prism base, 5: solid-state image sensor, 6: element base, 7: element holder, 8: leaf spring, 10: solid-state image sensor assembly.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H04N 9/09 H04N 5/335

Claims (2)

(57) [Claims] 1. A solid-state image pickup device, comprising: a first connection portion which is open on a light receiving surface side of the solid-state image pickup device and is fixed to a light emission surface side of a color separation prism; and has a second connection portion. Together with an element base on which the mounting studs are erected, mounting the solid-state imaging device and opening the light receiving surface side thereof, having an insertion hole larger in diameter than the studs so that the mounting studs can be inserted, and An element holder having a connection portion connected to the second connection portion; and the elastic member presses the solid-state imaging device on the element holder so that the element holder can be displaced with respect to the element base. A solid-state image sensor fixing structure, characterized in that the solid-state image sensor assembly is made up of an elastic member fixed to a mounting stud. 2. A solid-state image pickup device, comprising: a first connection portion which is open on a light receiving surface side of the solid-state image pickup device and is fixed to a light emission surface side of a color separation prism; and has a second connection portion. Together with an element base on which the mounting studs are erected, mounting the solid-state imaging device and opening the light receiving surface side thereof, having an insertion hole larger in diameter than the studs so that the mounting studs can be inserted, and An element holder having a connection portion connected to the second connection portion; and the elastic member presses the solid-state imaging device on the element holder so that the element holder can be displaced with respect to the element base. An elastic member fixed to a mounting stud to form a solid-state image pickup device assembly, wherein the element holder of the solid-state image pickup device assembly corresponds to a fixing portion of the color separation prism, and the back focus is adjusted. The first connection part of the element and the fixing part are fixed, the element holder is displaced with respect to the element base, and after the registration adjustment, the connection part of the element holder and the second connection of the element base are adjusted. A method for fixing a solid-state imaging device, comprising: