JPS63213118A - Apparatus for producing thin metallic film - Google Patents

Abstract

PURPOSE:To prevent electrification of a high-polymer substrate during a heating and melting operation and to prevent wrinkling of the film-shaped high-polymer substrate by providing a deposition preventive plate and shutter plate in such a manner that the two plates overlap on each other at >=3 times the spacing therebetween while the shutter plate is held closed. CONSTITUTION:A metallic material of an evaporation source 5 is previously heated and melted prior to vapor deposition of metal atoms in the case of un-rolling the long-sized film-shaped high-polymer substrate wound like a roll in a vacuum and adhering the metal atoms evaporating from the evaporation source 5 by an electron beam to the high-polymer substrate, then rolling again the substrate. The aperture of the deposition preventive plate 4 is held covered by the movable shutter plate 8 during this heating and melting operation. The shutter plate 8 is opened and the vapor deposition is executed after the desired evaporation state is attained. The overlap of both the plate 4 and the plate 8 is set at x>=3d with respect to the spacing (d) between the two plates while the plate 8 is held closed, by which the electrification of the high-polymer substrate by the secondary electrons and reflected electrons from the metallic material is prevented and the wrinkling of the substrate on a take-up roll is obviated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a manufacturing apparatus for wrinkle-forming thin metal films on polymeric substrates.

BACKGROUND OF THE INVENTION The technology of forming metal thin films on film-like polymer substrates is important, and it is necessary to produce high-quality films in large quantities. One method for this purpose is a continuous winding type vacuum evaporation method as shown in FIG. 2, which uses a conveyance system using rollers and a vacuum evaporation method. That is, in Fig. 2, unwinding roll 1
While the unwound polymer substrate 2 is running along the circumferential surface of the cylindrical can 3, a metal thin film is deposited at the opening of the deposition prevention plate 4 from the evaporation source 5 heated by the electron beam 10. After that, it is wound up on a winding roll 6. At this time, if a voltage is applied between the bias roller 7 and the can, the polymer substrate and the can will come into close contact with each other, improving heat conduction between the two, making it possible to stably control the substrate temperature at the can temperature, and also to avoid the heat generated during evaporation. Heat damage to the substrate and wrinkles in the deposited film due to load can be prevented.

By the way, when depositing a metal thin film, it is necessary to heat and melt the metal material of the evaporation source in advance.

This heating and melting work is carried out in a vacuum, and an electron beam is used as the heating means. As shown in Figure 3, by separating the polymer substrate to reach the desired evaporation state, moving the polymer substrate, opening the shutter, and performing evaporation, only the desired metal thin film can be evaporated without thermal damage to the substrate.

Problems to be Solved by the Invention However, in this case, when winding up the part on which the metal thin film has not yet been deposited, wrinkles appear on the winding roll as shown in Figure 4, which causes The part where the metal thin film is formed is also wrinkled on the take-up roll. Such wrinkles are more noticeable when heating and melting work takes a long time, and the cause of wrinkles is that secondary electrons and reflected electrons from the metal material generated during heating and melting work cause polymer molecules to This seems to be because the board becomes electrically charged. However, this wrinkle cannot be prevented simply by arranging an anti-adhesion plate or a shutter so that the polymer substrate cannot be seen from the position of the evaporation source.

The present invention provides a continuous winding vacuum evaporation method that prevents a film-like polymer substrate from being charged by secondary electrons and reflected electrons from the metal material generated during heating and melting of the evaporated metal material. The purpose is to prevent wrinkles from forming on the take-up roll.

Means to solve the problem A long film-like polymer substrate wound into a roll is unwound in a vacuum, metal atoms evaporated from an electron beam evaporation source are attached to it, and then it is rolled again. A continuous winding type metal thin film production device is equipped with an adhesion prevention plate having an opening in a part between the running system on which the polymer substrate runs and the evaporation source, and a movable shutter that covers the opening. plate, and when the shutter plate is closed, the adhesion-prevention plate and the shutter plate overlap each other by three times or more the distance between them, or the adhesion-prevention plate and the shutter plate overlap. overlap three times or more, and when the shutter plate is closed, the adhesion prevention plate and the shutter plate overlap on both sides of the shutter plate by at least twice the distance between them.

According to the present invention, it is possible to prevent a film-like polymer substrate from being charged by secondary electrons and reflected electrons from the metal material generated during heating and melting of the evaporated metal material. It is possible to eliminate wrinkles on the take-up roll due to charging of the substrate.

Embodiment FIG. 5 shows the positional relationship between the adhesion prevention plate and the shutter plate. The distance between the adhesion prevention plate and the shutter plate was d, and the amount of overlap between the adhesion prevention plate and the shutter plate was both X in the front and back of the board running direction.

A metal thin film was actually formed by changing d and X. A polyimide film with a thickness of 12 microns and a width of 15 cra was used as the polymer substrate. Vacuum chamber 2X10-6torr
After evacuating to a temperature of 500 Å, a Ti film was vacuum-deposited as a metal thin layer to a thickness of 500 Å. The electron beam was applied to Ti from a 27° deflection type electron gun at an accelerating voltage of 10 kV. Emission current is 100 m when the shutter is closed with the configuration shown in Figure 1.
Heating and melting work began at A, and finally the emission current was set to IA. After heating and melting work, the board was moved 15m.
/min, the shutter was opened, and a Ti film was deposited. The deposition rate of the Ti film at this time was approximately 4000 A per second, and a Ti film of 300 A was formed on the polymer substrate. The can temperature was 100°C. The potential of each roller is 0V for the can and 1100V for the bias roller. Under the above conditions, the deposition experiment was conducted three times each by changing the distance d between the deposition prevention plate and the shutter plate and the amount of overlap X between the deposition prevention plate and the shutter plate, and the results are shown in FIG. In Figure 6, ○,
△ and × indicate cases where there were no winding wrinkles on the winding roll when winding up the part on which the metal thin film was not deposited in three vapor deposition experiments, and whether there were winding wrinkles or no winding wrinkles. This shows the case where the paper was rolled up, and the case where wrinkles appeared after winding up all three times. From Figure 6, X≧
It can be seen that there are no winding wrinkles in the 3d range. Figure 7 shows another example in which the traveling speed of the polymer substrate is 30 m/
minutes, and other conditions are the same as before, and one layer is placed on the polymer substrate.
The experimental results are shown when a 50A Ti film is formed. The meanings of the symbols in the graph are the same as before. Also in FIG. 7, winding wrinkles do not occur within the range of X≧3d.

The reason why winding wrinkles do not occur in the range of X≧3d is considered as follows. That is, the larger d is, the easier it is for secondary electrons and reflected electrons to pass between the adhesion prevention plate and the shutter plate and reach the polymer substrate, thereby charging the polymer substrate and causing wrinkles to occur when the polymer substrate is wound. In order to prevent this, it is sufficient to increase the amount of overlap between the adhesion prevention plate and the shutter plate.
The larger d is, the larger X needs to be. If X≧3d, secondary electrons and backscattered electrons almost no longer reach the polymer substrate through the gap between the anti-adhesion plate and the shutter plate (therefore, the polymer substrate is not charged and there are no wrinkles when it is rolled up). do not have.

Next, we will discuss the results when heating and melting the adhesion prevention plate and shutter plate stacked three times as shown in FIG. 8. Anti-adhesion plates were provided above and below the shutter plate, and as shown in FIG. 9, the distances between the anti-adhesion plates and the upper and lower shutter plates were both set to d. In addition, regarding the amount of overlap between the anti-adhesion plate and the shutter plate, both the upper and lower anti-adhesion plates were set to have the same amount X on the left and right sides. Then, as before, change d and X and place T on the polymer substrate.
i1ll was formed. FIGS. 10 and 11 show experimental results corresponding to FIGS. 6 and 7, respectively, when other experimental conditions were kept the same as before. By stacking the adhesion-proof plate and the shutter plate in three layers, the wrinkle-free conditions are wider than before, and if X≧2d, no wrinkles will appear during winding.

Effects of the Invention According to the present invention, it is possible to prevent a film-like polymer substrate from being charged by secondary electrons and reflected electrons from the metal material generated during heating and melting of the evaporated metal material. , a large amount of wrinkled metal thin film can be formed on a film-like polymer substrate.

[Brief Description of the Drawings] Fig. 1 is a sectional view showing a metal thin film manufacturing apparatus according to an embodiment of the present invention, and Figs. 2 and 3 are sectional views showing a conventional continuous winding type vacuum evaporation apparatus. , FIG. 4 is a perspective view showing wrinkles caused by winding of the polymer substrate due to charging, FIG. 5 is a sectional view showing the positional relationship between the adhesion prevention plate and the shutter plate, and FIGS. A graph showing the experimental results when metal thin films were formed by varying the amount of overlap X with the shutter plate, Figure 8 is a cross-sectional view showing another example of the metal thin film manufacturing apparatus, and Figure 9 is the apparatus shown in Figure 8. Figures 10 and 11, which show the positional relationship of the main parts in the i-plane, show the experimental results when a metal thin film was formed by changing the amount of overlap X between the adhesion prevention plate and the shutter plate in the apparatus shown in Figure 8. This is a graph showing. 1... Unwinding roll, 2... Polymer substrate,
3...can, 4...anti-adhesion plate, 5...
Evaporation source, 6... Take-up roll, 7... Bias roller, 8... Shutter plate, 9...
・Electron gun, 10...Electron beam, 11...
... Free roller, 12 ... Winding wrinkle, 1
3... Vacuum chamber, 14... Exhaust system, 15...
···Direction of rotation. Name of agent: Patent attorney Toshio Nakao and one other person Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 02θ 4θ 2θ ♂θ lθθ d (waste) Figure 10 d (next

Claims (2)

[Claims] (1) Continuous winding in which a long film-like polymer substrate wound into a roll is unwound in vacuum, metal atoms evaporated from an electron beam evaporation source are attached to it, and then wound into a roll again. In the metal thin film manufacturing apparatus of the formula, an adhesion prevention plate having an opening in a part is provided between the traveling system through which the polymer substrate runs and the evaporation source, and a movable shutter plate is provided to cover the opening. An apparatus for manufacturing a thin metal film, characterized in that, when the shutter plate is closed, the adhesion prevention plate and the shutter plate overlap each other by at least three times the distance between them. (2) Continuous winding in which a long film-like polymer substrate wound into a roll is unwound in vacuum, metal atoms evaporated from an electron beam evaporation source are attached to it, and then wound into a roll again. In the metal thin film manufacturing apparatus of the formula, an adhesion prevention plate having an opening in a part is provided between the traveling system through which the polymer substrate runs and the evaporation source, and a movable shutter plate is provided to cover the opening. The deposition prevention plate and the shutter plate overlap three times or more, and when the shutter plate is closed, the deposition prevention plate and the shutter plate overlap,
A metal thin film manufacturing apparatus characterized in that the shutter plates overlap each other on both sides by at least twice the distance between them.