JP4516444B2 - Winding type vacuum deposition system - Google Patents

Description

  The present invention relates to a take-up vacuum film forming apparatus suitably used for, for example, the production of a self-protection function type film capacitor.

  Conventionally, in manufacturing a film capacitor, an insulating raw material film such as a plastic film is unwound from an unwinding roller, a metal film is deposited on one surface of the raw material film, and then the raw material film is wound around a winding roller. A take-up type vacuum evaporation apparatus is used.

  By the way, in this type of film capacitor, a metal vapor deposition film formed on the surface of the raw material film is divided into a plurality of capacitor pieces, and adjacent capacitor pieces are mutually connected by a narrow connection portion formed of the same vapor deposition film. There is a so-called self-security function type connected to the. This type of film capacitor is designed to minimize the dielectric breakdown area of each capacitor by fusing the connecting part when a dielectric breakdown occurs in a part (fuse function). .

  When manufacturing such a self-protection function type film capacitor with the above-described winding vacuum deposition apparatus, a metal film deposition region is provided between the unwinding roller and the evaporation source with respect to the film-forming surface of the raw material film. Mask forming means for forming a mask pattern to be defined is installed.

  As the mask forming means, it can be constituted by a flexographic printing unit, and the mask film forming ink (oil) transferred from the ink supply source to the plate cylinder while conveying the raw material film between the plate cylinder and the impression cylinder, The film is continuously transferred from the plate cylinder to the film-forming surface of the raw material film. Thereby, the self-protection function type film capacitor having a capacitor piece of an arbitrary shape can be continuously manufactured. The plate cylinder is composed of a sleeve printing plate or the like in which a mask pattern (letter plate) is formed on a photosensitive resin layer wound around a sleeve.

Japanese Patent Laid-Open No. 7-118835 JP 2003-25749 A

  However, in a winding type vacuum deposition apparatus equipped with a conventional flexographic printing unit, a seam exists on the printing surface of the plate cylinder on which the mask pattern is formed on the film forming surface of the raw material film. There are cases where ink for forming a mask adheres to a place to be deposited or a metal film adheres to a place to be masked. For this reason, there exists a problem that a mask pattern cannot be formed with high precision with respect to the film-forming surface of a raw material film.

  This invention is made in view of the above-mentioned problem, and makes it a subject to provide the winding type vacuum film-forming apparatus which can form a mask pattern in the film-forming surface of a raw material film with high precision.

  In solving the above problems, the winding type vacuum film forming apparatus of the present invention is configured such that a mask forming means for forming a mask pattern for defining a film forming region of a metal film on a film forming surface of a raw material film has a mask pattern. An ink supply source for supplying ink for forming a film, a plate cylinder on which the ink supplied from the ink supply source is transferred to form a mask pattern on the film-forming surface of the raw film, and The plate cylinder is constituted by a seamless sleeve printing plate.

  According to the present invention, since the seamless sleeve printing plate is used for the plate cylinder of the flexographic printing unit constituting the mask forming means, a desired mask pattern is continuously formed with high accuracy on the film forming surface of the raw material film. As a result, the productivity and reliability of the film capacitor can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this embodiment mode, an example in which the present invention is applied to a winding-type vacuum deposition apparatus will be described as a winding-type vacuum film forming apparatus.

  FIG. 1 is a schematic configuration diagram of a take-up vacuum deposition apparatus 10 according to an embodiment of the present invention. The take-up type vacuum vapor deposition apparatus 10 of the present embodiment includes a vacuum chamber 11, an unwinding roller 13 for a raw material film 12, a cooling can roller 14, a take-up roller 15, and an evaporation source of a vapor deposition material (present invention). (Corresponding to “film forming means”) 16.

  The vacuum chamber 11 is connected to an evacuation system such as a vacuum pump (not shown) via the pipe connecting portions 11a and 11c, and the inside thereof is evacuated to a predetermined degree of vacuum. The internal space of the vacuum chamber 11 is partitioned by a partition plate 11b into a chamber in which the unwinding roller 13, the winding roller 15 and the like are disposed, and a chamber in which the evaporation source 16 is disposed.

The raw material film 12 is a long insulating plastic film cut to a predetermined width. In this embodiment, an OPP (stretched polypropylene) single layer film is used.
In addition, plastic films such as PET (polyethylene terephthalate) film and PPS (polyphenylene sulfite) film, paper sheets, and the like are applicable.

  The raw material film 12 is unwound from the unwinding roller 13 and wound around the unwinding roller 15 via a plurality of guide rollers 17, a can roller 14, an auxiliary roller 18, and a plurality of guide rollers 19. The unwinding roller 13 and the winding roller 15 correspond to the “unwinding portion” and the “winding portion” of the present invention, respectively, and each is provided with a rotation drive portion, not shown.

  The can roller 14 is cylindrical and made of metal such as iron, and is provided with a cooling mechanism such as a cooling medium circulation system, a rotation drive mechanism for rotating the can roller 14, and the like. The raw material film 12 is wound around the circumferential surface of the can roller 14 at a predetermined holding angle. The raw material film 12 wound around the can roller 14 is cooled by the can roller 14 at the same time the film forming surface on the outer surface side is formed with the vapor deposition material from the evaporation source 16.

  The evaporation source 16 is provided with a mechanism for storing the vapor deposition material and evaporating the vapor deposition material by a known method such as resistance heating, induction heating, or electron beam heating. The evaporation source 16 is disposed below the can roller 14 and deposits vapor of the vapor deposition material on the raw material film 12 on the opposite can roller 14 to form a coating.

  As the vapor deposition material, not only single metal elements such as Al, Co, Cu, Ni, Ti, but also two or more kinds of metals such as Al—Zn, Cu—Zn, Fe—Co or multi-component alloys are applied, and the evaporation source Also, the number is not limited to one, and a plurality may be provided.

  The winding type vacuum vapor deposition apparatus 10 of the present embodiment further includes a pattern forming unit 20, an electron beam irradiator 21, a DC bias power source 22, and a static elimination unit 23.

  The pattern forming unit 20 corresponds to the “mask forming means” of the present invention, which forms a mask pattern for defining a metal film deposition area on the film forming surface of the raw material film 12. It is installed between the source 16 (can roller 14).

FIG. 2 shows the film formation surface of the raw material film 12.
The pattern forming unit 20 is configured to apply, for example, a mask pattern (oil pattern) 25 having a shape indicated by hatching in FIG. Since a metal film is not formed on the mask pattern 25, after the film formation, a substantially rectangular metal pattern in which a vapor deposition material is deposited on the opening 25a of the mask pattern 25 is connected at a predetermined pitch via the connection part 26a. In this manner, a plurality of rows of metal films 26 are formed (FIG. 2B). The form of the metal film 26 is not limited to the above.

  Each metal layer 26 constitutes a capacitor piece, and the connecting portion 26a is configured to be melted by Joule heat of the generated current when a dielectric breakdown occurs in a part thereof, and a dielectric breakdown region of the capacitor. However, it is designed to function as a so-called self-protection function film capacitor that can be minimized to individual units.

  FIG. 3 is a schematic configuration diagram of the pattern forming unit 20. The pattern forming unit 20 is composed of a flexographic printing unit, and an ink supply roll 31 such as an anilox roll and ink (oil in this example) supplied from the ink supply roll 31 are transferred to form a raw material film 12. A plate cylinder 32 for forming the mask pattern 25 on the surface, and an impression cylinder 33 which is provided on the plate cylinder 32 and is paired with the plate cylinder 32 to sandwich the raw material film 12 therebetween.

  A transfer roll 34 is in rolling contact between the plate cylinder 32 and the ink supply roll 31. The transfer roll 34 is supplied with a required amount of ink from the ink supply roll 31, and the supplied ink is supplied to the plate cylinder. Transfer to 32. The ink supply roll 31 and the transfer roll 34 correspond to the “ink supply source” of the present invention. A relief plate corresponding to the mask pattern 25 is formed on the surface of the plate cylinder 32, and the ink transferred onto the convex surface is transferred to the film formation surface of the raw material film 12 to form the mask pattern 25.

  In the present embodiment, the plate cylinder 32 is constituted by a seamless (seamless) sleeve printing plate. In the seamless sleeve printing plate, as shown in FIG. 4, a cushion layer 36 made of an elastic material and a polymer layer 37 forming a relief plate are laminated on the surface of a sleeve 35 made of synthetic resin or metal. The relief printing plate on the outermost surface can be composed of, for example, a photosensitive resin layer, and after a seamless process is performed on the seam, a mask pattern is formed using a photolithographic technique.

Next, in the conventional wind-up type vacuum deposition apparatus, the source film is irradiated with an electron beam before the deposition of the metal film to negatively charge the source film, and electrostatically is applied to the metal can roller. Although the adhesion force was generated so as to achieve adhesion, after the deposition of the metal film, the charge charged on the raw material film diffuses into the metal film deposited on the raw material film. In some cases, the adsorbing force between the two decreases, and the adhesion between the two deteriorates.
Therefore, in the present embodiment, a DC bias power supply 22 is installed in addition to the electron beam irradiator 21 so that the raw material film 12 is brought into close contact with the can roller 14 before and after the deposition of the metal film.

  The electron beam irradiator 21 corresponds to the “charged particle irradiation unit” of the present invention, and irradiates the raw material film 12 with an electron beam as charged particles to negatively charge the raw material film 12. FIG. 5 is a schematic cross-sectional view for explaining an electron beam irradiation process on the raw material film 12. In the present embodiment, the electron beam irradiator 21 is installed at a position facing the peripheral surface of the can roller 14 so that the electron beam is irradiated onto the film forming surface of the raw material film 12 in contact with the can roller 14. Yes. By irradiating the electron beam on the can roller 14, it is possible to irradiate the electron beam while cooling the raw material film 12.

  In particular, in the present embodiment, the electron beam irradiator 21 is configured so that the electron beam is irradiated while scanning in the width direction of the raw material film 12, whereby the raw material film is irradiated by local electron beam irradiation. While being able to avoid damage, the raw material film 12 can be charged uniformly and efficiently.

  The DC bias power source 22 corresponds to the “voltage applying unit” of the present invention that applies a predetermined DC voltage between the can roller 14 and the auxiliary roller 18. In the present embodiment, the can roller 14 is connected to the positive electrode, and the auxiliary roller 18 is connected to the negative electrode. As a result, the negatively charged material film 12 irradiated with the electron beam is electrically adsorbed and brought into close contact with the peripheral surface of the can roller 14 by electrostatic attraction as shown in FIG.

  Here, the auxiliary roller 18 is made of metal, and the peripheral surface thereof is provided at a position where it comes into contact with the film forming surface of the raw material film 12. FIG. 6 is a schematic cross-sectional view illustrating the adsorption action between the raw material film 12 and the can roller 14 after vapor deposition. A metal film 26 is formed in a pattern on the raw material film 12 by vapor deposition.

  The raw material film 12 guided by the auxiliary roller 18 is sandwiched between the metal film 26 and the can roller 14 by the contact between the metal film 26 (see FIG. 2B) on the film forming surface and the peripheral surface of the auxiliary roller 18. The material film 12 to be polarized is polarized, and an electrostatic attracting force is generated between the material film 12 and the can roller 14, and the two are closely attached.

  The neutralization unit 23 is disposed between the cooling can roller 14 and the take-up roller 15 and has a function of neutralizing the raw material film 12 charged by electron irradiation from the electron beam irradiator 21. As a configuration example of the static elimination unit 23, a mechanism is adopted in which the raw material film 12 is passed through plasma and the raw material film 12 is neutralized by bombarding.

  Next, operation | movement of the winding type vacuum evaporation system 10 of this Embodiment comprised as mentioned above is demonstrated.

  In the vacuum chamber 11 depressurized to a predetermined degree of vacuum, the raw material film 12 continuously fed from the unwinding roller 13 is subjected to a mask formation process, an electron beam irradiation process, a vapor deposition process, and a charge removal process. Then, it is continuously wound around the winding roller 15.

  In the mask formation process, the mask pattern 25 having the form shown in FIG. 2A is printed on the film formation surface of the raw material film 12 by the pattern formation unit 20. According to the present embodiment, since the plate cylinder 32 for forming the mask pattern 25 on the film forming surface of the raw material film 12 is constituted by the seamless sleeve printing plate, oil adheres to the place where the metal film is to be deposited. 2A, the mask pattern 25 shown in FIG. 2A can be formed with high accuracy. Thereby, it is possible to improve the productivity and secure the reliability of the film capacitor having the pattern shown in FIG. 2B.

  The raw material film 12 on which the mask pattern 25 is formed is wound around the can roller 14. The raw material film 12 is irradiated with an electron beam by an electron beam irradiator 21 in the vicinity of a contact start position with the can roller 14 and is negatively charged in terms of potential. At this time, since the source film 12 is irradiated with the electron beam at a position where the source film 12 is in contact with the can roller 14, the source film 12 can be efficiently cooled. Moreover, by irradiating the electron beam while scanning the film-forming surface of the traveling raw material film 12 in the width direction, thermal deformation of the raw material film 12 due to local irradiation of the electron beam can be avoided and at the same time uniform. The raw material film 12 can be charged efficiently.

  The negatively charged material film 12 that has been irradiated with the electron beam is brought into close contact with the can roller 14 that is biased to a positive potential by the DC bias power source 22 by electrostatic attraction (FIG. 5). Then, the vapor deposition material evaporated from the evaporation source 16 is deposited on the film formation surface of the raw material film 12, whereby the metal film 26 shown in FIG. 2B is formed. The metal film 26 has a plurality of rows of island shapes connected via the connecting portion 26a.

  A negative potential of the DC bias power supply 22 is applied to the metal film 26 formed on the raw material film 12 via the auxiliary roller 18. Since the metal film 26 is formed in an island shape connected in the longitudinal direction of the raw material film 12, in the raw material film 12 wound on the can roller 14 after the metal film 26 is deposited, It is positively polarized on the surface and negatively polarized on the other surface on the side of the can roller 14, and as shown in FIG. 6, the electrostatic attraction force between the raw film 12 and the can roller 14. Give rise to As a result, the raw material film 12 and the can roller 14 are in close contact with each other.

  As described above, in the present embodiment, before the metal film 26 is deposited, the raw material film 12 is charged by electron beam irradiation and is brought into close contact with the can roller 14. After the metal film 26 is deposited, the metal film 26 is charged. Since the raw material film 12 is brought into close contact with the can roller 14 by a bias voltage applied between the metal film and the can roller 14, a part of electric charges (electrons) charged on the raw material film 12 before the deposition of the metal film is obtained. Even if the metal film is released and disappears in the subsequent metal film deposition step, a part or all of the lost charge is compensated for by applying a negative potential (supplying electrons) from the auxiliary roller 18 to the metal film 26. It becomes possible to do.

  Therefore, according to the present embodiment, even after the vapor deposition step, a decrease in the adhesion between the raw material film 12 and the can roller 14 is suppressed, and a stable cooling action of the raw material film 12 is ensured before and after the vapor deposition step. become. Thereby, thermal deformation of the raw material film 12 at the time of vapor deposition of the metal film can be prevented, and the raw material film 12 can be run at a higher speed and the film forming operation speed can be increased, thereby improving productivity. It becomes like this.

  Such a configuration is particularly advantageous when the raw material film is formed of a material that is difficult to be charged when a metal film such as an OPP film adheres thereto. Further, when the metal film 26 is formed in a pattern on the raw material film 12, the charge may change as the temperature partially rises. Therefore, the adhesion of the metal film formation portion where the charge has been released is increased by a bias voltage. This is desirable because the raw material film 12 is uniformly cooled.

  The raw material film 12 on which the metal film 26 has been vapor-deposited as described above is neutralized by the neutralizing unit 23 and then wound around the winding roller 15. Thereby, the stable winding operation | movement of the raw material film 12 is ensured, At the same time, the winding wrinkle by charging can be prevented.

  The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

  For example, in the above embodiment, the metal film 26 deposited on the raw material film 12 is formed in an island shape connected via the connecting portion 26a as shown in FIG. 2B. Of course, a linear pattern along the direction (conveying direction) is also possible.

  In the above embodiment, the source film 12 is negatively charged by irradiating the electron beam. Instead, the source film 12 may be positively charged by irradiating ions. Good. In this case, the polarity of the bias applied to the can roller 14 and the auxiliary roller 18 is opposite to that of the above embodiment (the can roller 14 is a negative electrode and the auxiliary roller 18 is a positive electrode).

  In the above embodiment, the example in which the metal film is formed by applying the vacuum evaporation method using the evaporation source 16 as the film forming means has been described. However, the present invention is not limited to this, and the sputtering method, various CVD methods, etc. Other film forming methods for forming a metal film are also applicable, and film forming means such as a sputtering target can be appropriately employed in accordance with these film forming methods.

It is a schematic block diagram of the winding type vacuum evaporation system 10 by embodiment of this invention. It is a figure which shows a raw material film film-forming surface, A shows the state after formation of the mask pattern 25, and B has shown the state after vapor deposition of the metal film 26. FIG. 2 is a schematic configuration diagram of a pattern forming unit 20. FIG. 3 is a view showing an example of a cross-sectional structure of a plate cylinder 32 constituting the pattern forming unit 20. FIG. It is a cross-sectional schematic diagram explaining the irradiation process of the electron beam with respect to the raw material film. It is a cross-sectional schematic diagram explaining the adsorption | suction effect | action between the raw material film 12 and the can roller 14 after vapor deposition.

Explanation of symbols

10 Winding-type vacuum deposition equipment (winding-type vacuum film-forming equipment)
11 Vacuum chamber 12 Raw film 13 Unwinding roller 14 Can roller (cooling roller)
15 Winding roller 16 Evaporation source (film forming means)
18 Auxiliary roller 20 Pattern forming unit (mask forming means)
21 Electron beam irradiator (charged particle irradiation means)
22 DC bias power supply (voltage application means)
23 Static elimination unit 25 Mask pattern 26 Metal layer 31 Ink supply roll 32 Plate cylinder 33 Impression cylinder 34 Transfer roll 35 Sleeve 36 Cushion layer 37 Polymer layer

Claims (2)

A vacuum chamber, an unwinding unit that is disposed inside the vacuum chamber and continuously feeds the insulating raw material film, a winding unit that winds up the raw material film fed from the unwinding unit, and the unwinding unit, A cooling roller that is disposed between the winding unit and closely contacts the raw material film to cool the film; a film forming unit that is disposed opposite the cooling roller and forms a metal film on the raw material film; A mask forming unit that is installed between the unwinding unit and the film forming unit, and that forms a mask pattern that defines a film forming region of the metal film on the film forming surface of the raw material film ;
The mask forming means includes an ink supply source for supplying ink for forming the mask pattern, and a plate cylinder for transferring the ink supplied from the ink supply source to form the mask pattern on the film forming surface of the raw material film; An impression cylinder facing the plate cylinder and sandwiching the raw material film, wherein the plate cylinder is a seamless sleeve printing plate in which a mask pattern is formed on the outermost surface subjected to seamless processing Take-up type vacuum film forming equipment. A charged particle irradiation unit disposed between the mask forming unit and the film forming unit to irradiate the source film with charged particles;
An auxiliary roller that is disposed between the cooling roller and the winding portion and that contacts the film formation surface of the raw material film to guide the running of the raw material film;
Further comprising a voltage applying means for applying a DC voltage between these cooling rollers and the auxiliary roller,
The seamless sleeve printing plate is
A synthetic resin or metal sleeve;
A cushion layer made of an elastic material laminated on the surface of the sleeve;
The wound vacuum forming apparatus according to claim 1, further comprising a relief printing plate including a polymer layer laminated on a surface of the cushion layer and seamlessly processed at a seam, and a mask pattern formed on the surface. Membrane device.

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