JPS6320856A - Pin grid array - Google Patents

Abstract

PURPOSE:To eliminate the possibility of the defective cutting of a wire and the damage of a semiconductor chip and the like, and to improve reliability by insert-molding the semiconductor chip mounted to a circuit body into a substrate under the state in which the semiconductor chip is covered with a cover. CONSTITUTION:A substrate 1 is formed by a molded form consisting of a synthetic resin while a plurality of pins 2, base sections of which are insert-molded and fixed into the substrate 1, are projected from the substrate 1, and a semiconductor chip 4 is insert-molded and buried into the substrate 1 under the state in which a circuit body 3 to which the semiconductor chip 4 is mounted is connected to the base sections of the pins 2 and under the state in which the semiconductor chip 4 is covered with a cover 5. Consequently, the base sections of the pins are insert-molded to the substrate and the pins can be fastened to the substrate, thus easily fitting the pins. Action to the semiconductor chip 4 of the synthetic resin shaping the substrate 1 can be prevented, thus eliminating the cutting of wires for the semiconductor chip 4 and the damage of the semiconductor chip 4, then improving reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a pin grid 7 lay of a molded product such as an IC puff case.

E Background technology] Improving the functionality of elements in semiconducting water packages such as ICs,
In order to cope with the increase in the number of 10 units due to the increase in commercial density and the shortening of lead times due to higher speeds, we have developed a pin grid array that has pins for electrical connection to the outside on the back side of the board on which the chip is mounted. (abbreviated as PGA) has been put into practical use. A large number of pins are protruded using the entire back surface of this pin grid 7-lay 1-board board.
The device can be attached to the motherboard by inserting the pins into sockets or through holes provided on the device's mounting board (motherboard).

Conventionally, ceramic has been mainly used as the material for this substrate, and in recent years, in response to lower prices, attempts have been made to use 5lvi, a printed wiring board obtained from a resin laminate, as the second substrate.

That is, as shown in FIG. 3, the substrate 1 has a thickness of, for example, 1.
Glass base material epoxy of about 01 (3) is formed using a fat laminate board or glass base polyimide e (fat laminate board, etc.), a circuit 12 is provided on the surface of the board 1, and pin holes 13 are drilled in the board 1 using a drill etc. and pin 2 with a diameter of about 0.5 mm.
By press-fitting the head 14 into the pin hole 13, a large number of pins 2 are fixed in a protruding state from one substrate,
A pin array A is created. In Fig. 4, 15 is a collar protruding from each pin 2 to position the head 14 of the pin 2 into the board 1, and 16 is the insertion depth of the pin 2 when attaching it to the motherboard. This is a collar provided on some pins 2 for positioning. However, in this case, pin 2
In order to attach it, it is necessary to process a single pin hole 13 in the board 1 and press fit the pin 2 into the pin hole 13, which increases the number of man-hours and prevents cracks in the board 1. There is a problem in that there is a limit to the strength with which the pins 2 can be pressed into the substrate 1, making it impossible to obtain sufficient strength to pull the pins 2 out.

Therefore, the present applicant and others have devised a pin grid array A in which the substrate 1 is formed of a resin molded product as shown in FIG.

This product is manufactured by forming a substrate 1 on which a semiconductor chip 4 is mounted using a synthetic resin molded product, and inserting and fixing the bases of pins 2 into the substrate 1 during molding of the substrate 1. A book pin 2 is attached in a state of protruding from the board 1, and a circuit body 3 is insert-molded in the board 1 while being connected to the pin 2, and is embedded and fixed. In this device, when molding the substrate 1 with synthetic resin, the base of the pin 2 is inserted into the substrate 11 to fix the pin 2 to the substrate 1, so that the pin hole 13 is not formed as in the conventional example shown in FIG. The pin 2 can be easily attached without requiring man-hours such as drilling holes and press-fitting the pin 2, and the pull-out strength does not become unstable unlike when the pin 2 is press-fitted.

However, in the case shown in FIG. 4, work such as bonding the semiconductor chip 4 and bonding the wires 20 between the semiconductor chip 4 and the circuit body 3 must be performed after the substrate 1 has been molded with a (fat). In other words, it is necessary to perform this work with the pin 2 attached to the board 1 with it protruding, and there is a problem that the protruding pin 2 may get in the way or be damaged during this work. In this case, there is also a recess 32 in the substrate 1.
After the semiconductor chip 4 is mounted in the recess 32 with a There is also the problem that a separate sealing process is required.

In order to solve such problems, the applicant had previously
We devised the device shown in the figure (the device shown in FIG. 5 is not publicly known). That is, in this device, when insert molding and embedding and fixing the circuit body 3 connected to the pins 2 in the substrate 1 formed of a molded product of synthetic resin, the circuit body 3 on which the semiconductor chip 4 is mounted in advance is used. This is how it was done.

Therefore, with this device, work such as bonding the semiconductor chip 4 and bonding the wire 20 between the semiconductor chip 4 and the circuit body 3 can be partially performed on the circuit body 3 fixed to the base Fi1. For example, the semiconductor chip 4 can be mounted using the existing process of mounting the semiconductor chip on a circuit board or the lead frame method of mounting the semiconductor chip 4 without the pins 2 getting in the way; When the circuit body 3 is embedded and fixed in the substrate 1, the semiconductor chip 4 is also embedded in the substrate 1 and becomes sealed, thereby eliminating the need for a process for sealing the semiconductor chip. However, in this case, when the circuit body 3 is inserted into the substrate 1, the molding pressure of the synthetic resin used to mold the substrate 1 acts directly on the semiconductor chip 4, and the pressure between the semiconductor chip 4 and the circuit body 3 is There is a risk that the wire 20 may be cut, and since the semiconductor chip 4 is embedded in the resin forming the substrate 1 and is in direct contact with the synthetic resin, the contact between the semiconductor chip 4 and the synthetic υ1 resin may occur. There is a possibility that the semiconductor chip 4 may be damaged due to the stress between the
Such damage is particularly likely to occur in the case of a large semiconductor chip 4.

[Object of the Invention] The present invention has been made in view of the above points, and an object thereof is to provide a highly reliable ping flare array without the risk of poor wire cutting or damage to semiconducting water chips. This is the purpose.

[Disclosure of the Invention] In the pin grid 7 lay according to the present invention, the base F1.1 is formed of a molded product of synthetic resin, and a plurality of pins 2, which are fixed by insert molding the base into the base plate 1, are attached to the base plate. 1
The circuit body 3 on which the semiconductor chip t is mounted is connected to the base of the pin 2, and the semiconductor chip 4 is covered with a cover 5, which is inserted into the substrate 1 by insert molding. By making the semiconductor chip 4 mounted on the circuit body 3 covered with the cover 5 insert-molded into the substrate 1,
The present invention will be described in detail below with reference to Examples.

Figure 1 (of course not shown to actual size) shows an embodiment of the present invention, in which base Jfj, 1 is a molded product made by molding a synthetic resin molding material by injection molding, transfer molding, etc. be done. When molding the substrate 1 in this manner, a large number of pins 2 are attached to the substrate 1 in parallel by insert molding so that the bases of the pins 2 are embedded in the substrate 1, and semiconductor chips 4 such as IC chips are attached. The circuit body 3 having the circuit board 3 mounted on the surface thereof is embedded in the board 1 for installation. As the synthetic Ut resin constituting the substrate 1, thermosetting resins such as 7-ether, epoxy, silicone, and polyimide, polyphenylene 7-ite, polysal 7-one, and polyether sulfone can be used. It is preferable to use an epoxy resin in terms of its proven reliability, and the latter thermoplastic resin in terms of flexibility, mechanical strength, and heat resistance.

The pin 2 is formed to have a circular cross-section over the entire length in the axial direction, and is provided with a circular t811 that protrudes from the entire circumference of the pin 2. Similarly, a circular collar 21 is provided on the lower side of the circuit body 3. An insulator 22 having circuits 12 arranged radially on its surface can be used as the circuit body 3. For example, a lath epoxy wiring board or a lath polyimide wiring board can be used. Wiring board, Tlasteflon wiring board,
A polyester wiring sheet or film, a polyimide wiring film or sheet, etc. can be used.

Furthermore, a lead frame made of copper, aluminum, or 42 alloy (Ni-Fe alloy containing 42% Ni) fixed with a polyimide film or the like can also be used as the circuit body 3. From the viewpoint of electrical resistance, it is preferable to use a copper circuit, but from the viewpoint of ease of setting into a molding die 8, which will be described later, it is preferable to use a plate-shaped or lead frame-shaped one. A semiconductor chip 4 such as an IC chip is mounted on the circuit body 3 at the center of its surface, and a wire 20 is bonded between the semiconductor chip 4 and the circuit 12 of the circuit body 3. These operations of mounting the semiconductor nap 4 and wire bonding are performed before fitting the circuit body 3 into the board 1, so these operations can be carried out without the pins 2 being provided. This means that you can mount electronic components on circuit boards, do wire bonding, and do other work without getting in the way, using existing processes as they are. Furthermore, circuit body 3
There is a pin hole 7 in the land part of the circuit 12 at the position corresponding to the pin 2! 17! It is a role.

When molding the substrate 1, the pins 2 are inserted and set into the pin insertion holes 18 provided in the lower die 8a of the molding die 8, as shown in FIG.

At this time, the lower collar 21 of the pin 2 is locked to the upper surface of the peripheral edge of the pin insertion hole 18, and the insertion depth of the pin 2 into the pin insertion hole 18 is determined, and the pin insertion hole 18 is 21 closes the opening, thereby preventing resin from entering the pin insertion hole 18 during molding and causing cracks. Then, by inserting the upper end of the pin 2 into the pin hole 7 and locking the periphery of the pin hole 7 with the upper collar 11 of the pin 2, the circuit body 3 on which the semiconductor chip 4 is mounted is attached to the pin 2.
It is held by the lower mold 8a. On top of this, the f provided on pin 2
By locking the circuit body 3 with lll, the circuit body 3
is placed in the molding die 8 at an accurate position.
/ ) can do. Furthermore, a cover 5 is set on the circuit body 3 so as to cover the semiconductor chip 4 and the wires 20. The cover 5 is formed of a metal material, a synthetic resin material, or the like, with a recess opening in which the semiconductor chip 4 and the wire 20 are housed, and a collar 33 extends from the edge of the opening. The cover 5 can be set on either the movable side or the fixed side of the mold 8.
In addition, when the cover 5 is made of a metal material, it is necessary to interpose an electrical insulating material between the circuit 12 of the circuit body 3 and the cover 5. This electrical insulating material may be prepreg such as lath epoxy or An epoxy resin adhesive or the like can be used. After the circuit body 3 with the pins 2 and the semiconductor chip 4 mounted thereon is set in the lower mold 8a, the molding mold 8
The upper mold 8b and the lower mold 8a are clamped together, and the upper mold 8b has molding protrusions 10 protruding in correspondence with the positions of the respective pins 2. The upper y of pin 2 is on the lower end surface! Part a is inserted I! The first part 32 is recessed.

Therefore, by clamping the mold, with the upper end of the pin 2 inserted into the recess 32, the lower end surface of the molding protrusion 10 comes into contact with the upper surface of the periphery of the pin hole 7 of the circuit body 3, and the circuit body 3 is molded. It is clamped and fixed between the protrusion 10 and the collar 11 of the pin 2. Then, the substrate 1 is molded in the molding mold 8 by injecting a fat molding material into the molding mold 8 and hardening or solidifying it, and at the same time, the base of the pin 2 is inserted into the substrate 1 and , With the upper end of the pin 2 contacting and connected to the circuit 12, the circuit body 3 is insert-molded and integrated so as to be included in the board 1, and the base of the cover 5 is further embedded and fixed in the board 1. The entire cover 5, not just its base, may be embedded in the substrate 1. In this way, the cover 5 is covered and sealed!!
! With this, it is possible to obtain a pin grid 7 ray A as shown in FIG. 1 in which the semiconductor chip 4 is mounted.

When attaching the base of the pin 2 to the substrate 1 by insert molding, as shown in FIG.
The opening 11 provided in the flange 11 is embedded in the substrate 1, and the flange 21 is embedded with its lower surface exposed as the lower surface of the substrate 1. By embedding ' 21, the base of the pin 2 is firmly held within the substrate 1, making it possible to increase the pull-out strength of the pin 2 and to prevent the pin 2 from wobbling. When insert molding the circuit body 3 into the substrate 1, the semiconductor chip 4 is covered with the cover 5 together with the wires 20, so that the molding pressure of the synthetic resin when molding the substrate 1 is applied to the semiconductor chip 4. This can prevent the wires 20 from acting on the wires 20 and prevent defects such as the wires 20 from being cut, and the semiconductor chip 4 is sealed inside the cover 5. In order to avoid direct contact with the synthetic resin of the substrate 1, the semiconductor chip 4
There is no fear that the semiconductor chip 4 will be damaged by the stress between it and the synthetic resin.

The circuit 12 of the circuit body 3 and the pin 2 are connected through the pin hole 7.
This is done by insertion contact of the base of pin 2 into the
In order to ensure this connection, when the insulator 22 provided with the circuit 12 is used as the circuit body 3, it is preferable that the inner periphery of the pin hole 7 is plated with through-hole plating of +72i.

In addition, by the molding protrusion 10 provided on the upper mold 8b of the molding die 8, the periphery of the pin hole 7 and the upper end of the pin 2 are formed on the substrate 1 at the pin hole 7 portion of the circuit body 3, as shown in the Pt51 diagram. The exposed western part 9 is formed, and by filling this recess 9 with a conductive material such as small particles of low-melting metal alloy such as solder, cream solder, conductive paint, conductive face, conductive adhesive, etc., the pin hole is formed. 7 and the pin 2 can be joined with a conductive material, and the circuit 12 is exposed on the inner periphery of the pin hole 7.
It is possible to improve the reliability of conduction between the pin 2 and pin 2.
Further, the molding protrusion 10 provided on the upper die 8b of the molding die 8 also has the function of pressing the upper surface of the circuit body 3 and sandwiching the circuit body 3 between it and the F511 of the pin 2. Tomu (
It is also possible to prevent the circuit body 3 from being inserted into the substrate 1 in a diamond-shaped state due to floating when the oil is injected.

In the pin grid array A shown in FIG. 1 formed as described above, the device mounting board (motherboard)
Attachment to the motherboard 28 can be accomplished in three ways by inserting each pin 2 into a socket or through hole 29 provided on the motherboard 28.

At this time, pin 2 is attached to the board 1 as shown by the imaginary line in FIG.
Parallel to! ! If a number of positioning protrusions 30 are integrally protruded with equal protrusion dimensions, the tips of the positioning protrusions 30 will come into contact with the surface of the motherboard 28, and a predetermined gap will be formed between the base plate 1 and the motherboard 28. As shown in the conventional example shown in FIG. 3, some of the pins 2 have f! space for positioning. 16 is no longer necessary, and all pins 2 having the same shape can be used. Further, since the positioning protrusion 30 comes into contact with the motherboard 28 in this way, the load applied to the opening between the motherboard 28 and the board 1 is supported by the positioning protrusion 30, and deformation of the pin 2 can also be prevented. Monkey. Here, the determining protrusion 30 is formed into a molding recess 31 in the molding die 8 as shown in imaginary lines in FIG.
By providing this, it is possible to form them simultaneously when molding the substrate 1.

Note that when it is necessary to dissipate heat generated by the semiconductor chip 4 mounted on the substrate 1, a heat sink 17 made of copper, iron, aluminum, ceramic, etc. with excellent thermal conductivity is used to dissipate heat from the semiconductor chip 4 mounted on the substrate 1.
It's possible to attach it to.

By setting this heat radiator 17 in the molding die 8 as shown in FIG. 2, it can be provided by insert molding at the same time as the substrate 1 is molded with the resin molding material. Therefore, there is no need for man-hours such as drilling a hole in the substrate 1 to attach the heat sink 17 or fitting the heat sink 17 into the hole, and at this time, when the molding die 8 is clamped. The circuit body 3 can be sandwiched between the cover 5 and the heat sink 17, and the molding die 8
It is also possible to prevent the circuit body 3 from being deformed when resin is injected into the resin. It is preferable in terms of heat dissipation efficiency that the heat dissipation body 17 is fixed to the substrate 2 in a state where it is exposed from the back surface of the substrate 1. Also, in the embodiment shown in FIG. I tried to mount it on the top surface of the circuit body 3, which is the opposite surface, but
The semiconductor chip 4 may be mounted on the lower surface side of the circuit body 3. In particular, when the heat dissipation body 17 is used to radiate heat, when the semiconductor chip 4 is mounted on the lower surface of the circuit body 3, the heat dissipation body 17 is mounted on the substrate. Since the top surface of the substrate 1 is exposed, the heat radiated from the heat radiating body 17 can be effectively radiated without being trapped between the substrate 1 and the motherboard 28. In addition, the semiconductor chip 4
The present invention, in which the substrate is covered with a cover 5 to protect it from synthetic resin, can be applied to general applications such as epoxy sealing of semiconductors.

[Effect 1 of the Invention As described above, the pin grid array according to the present invention has a total of 1
(The board is formed from a resin molded product, and the base is insert-molded into the board so that multiple fixed pins protrude from the board, so when molding the board from synthetic resin, The base of the pin is insert-molded to fix the pin to the board, making it easy to attach the pin without requiring man-hours such as drilling pin holes or press-fitting the pin. The pull-out strength does not become unstable as in the case of the semiconductor chip, and since the circuit body with the semiconductor chip mounted is connected to the base of the pin and embedded in the board by insert molding, the semiconductor Chip mounting and wire bonding work can be done on the circuit body before it is mounted on the board, so these work can be done without any pins. This allows for easy mounting of semiconductor chips and wire bonding without getting in the way or damaging pins.In addition, the circuit body can be placed inside the substrate while the semiconductor chip is covered with a cover. Since it is insert molded, it is possible to prevent the synthetic resin forming the substrate from acting on the semiconductor chip, and there is no risk of the wires of the semiconductor chip being cut or the semiconductor chip being damaged. There are some things that can increase the reliability of pin grid arrays.

[Brief explanation of drawings]

Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of a molding die used for manufacturing the embodiment of Fig. 1, Fig. 3 is a sectional view of a conventional example, and Fig. A sectional view of another conventional example, FIG. 5 is a sectional view of a conventional example of a pond. 1 is the base, 2 is the pin, 3 is the circuit body, 4 is the semiconductor chip,
5 is a cover. Agent Patent attorney Ishi 1) 艮 71...No; board 2...pin 3...Circuit law 1st figure ・t...Pa 15 lead (Tochinobu 5・
...Cover Figure 2 Figure 3 Figure 4 Figure 5 Procedural amendment (voluntary) September 13, 1985 Patent No. M 164975 of 1985, name of invention Pin Grid 7 Ray 3, person making the amendment Relationship to the incident Patent applicant address 1048 Oaza Kadoma, Kadoma City, Osaka @Place name (5
83) Matsushita Electric Works Co., Ltd. Representative Sadao Fujii 4, Agent postal code 530 5, Date of amendment order 6, Number of inventions increased by amendment None 1) Mei IA8, page 3, line 1 "Figure 4" is corrected to "Figure 3." 2) Delete "ga" in the 9th line of page 6 of the same page and insert "are in contact with each other". 3) In the 18th line of the same page, next to “wire”, “
Insert "Contact". 4) Delete "cutting" in line 9 of page 13, and insert "contact or cutting". 5) Delete “ga cut” on page 13, line 96, and add [
Insert a line that touches or breaks. 6) Correct the attached drawing Medium Temperature 2 as shown in the attached sheet. Agent Patent Attorney Ishi 1) Private Figure 7 2

Claims (1)

[Claims] (1) A state in which a board is formed from a synthetic resin molded product, the base is insert-molded into the board, multiple pins are fixed and protrude from the board, and a circuit body with a semiconductor chip mounted is connected to the base of the pins. A pin grid array comprising a semiconductor chip covered with a cover and embedded in a substrate by insert molding.