JPS63208298A - 多層プリント配線板 - Google Patents
多層プリント配線板Info
- Publication number
- JPS63208298A JPS63208298A JP4206087A JP4206087A JPS63208298A JP S63208298 A JPS63208298 A JP S63208298A JP 4206087 A JP4206087 A JP 4206087A JP 4206087 A JP4206087 A JP 4206087A JP S63208298 A JPS63208298 A JP S63208298A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- printed wiring
- hole
- blind
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206087A JPS63208298A (ja) | 1987-02-24 | 1987-02-24 | 多層プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206087A JPS63208298A (ja) | 1987-02-24 | 1987-02-24 | 多層プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63208298A true JPS63208298A (ja) | 1988-08-29 |
| JPH0370398B2 JPH0370398B2 (forum.php) | 1991-11-07 |
Family
ID=12625557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4206087A Granted JPS63208298A (ja) | 1987-02-24 | 1987-02-24 | 多層プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63208298A (forum.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393720B2 (en) | 2004-09-29 | 2008-07-01 | Unimicron Technology Corp. | Method for fabricating electrical interconnect structure |
-
1987
- 1987-02-24 JP JP4206087A patent/JPS63208298A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393720B2 (en) | 2004-09-29 | 2008-07-01 | Unimicron Technology Corp. | Method for fabricating electrical interconnect structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0370398B2 (forum.php) | 1991-11-07 |
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| JPH023631Y2 (forum.php) | ||
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |