JPS6320458U - - Google Patents
Info
- Publication number
- JPS6320458U JPS6320458U JP11340086U JP11340086U JPS6320458U JP S6320458 U JPS6320458 U JP S6320458U JP 11340086 U JP11340086 U JP 11340086U JP 11340086 U JP11340086 U JP 11340086U JP S6320458 U JPS6320458 U JP S6320458U
- Authority
- JP
- Japan
- Prior art keywords
- light
- cavity
- emitting element
- light emitting
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図は本考案の一実施例に係る光半導体装置
の断面図、第２図及び第３図は第１図の変形例を
示す光半導体装置の断面図である。
図中、１，１１，２１は本体の例示であるチツ
プキヤリア、デユアルインラインパツケージ、角
形パツケージ、２はキヤビテイ、３は発光素子又
は受光素子、４は受光素子又は発光素子、６は光
透過蓋としての光透過用ガラス窓蓋である。
FIG. 1 is a cross-sectional view of an optical semiconductor device according to an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views of optical semiconductor devices showing modifications of FIG. 1. In the figure, 1, 11, and 21 are examples of the main body, such as a chip carrier, a dual in-line package, and a rectangular package; 2 is a cavity; 3 is a light-emitting element or a light-receiving element; 4 is a light-receiving element or a light-emitting element; and 6 is a light-transmitting lid. This is a glass window cover for light transmission.
Claims (1)
れ形成し、一方のキヤビテイに発光素子又は受光
素子を、他方のキヤビテイに受光素子又は発光素
子を背中合せに且つ光軸を一致させて組み込み、
光透過蓋でキヤビテイを封止したことを特徴とす
る光半導体装置。 Cavities for receiving optical elements are formed on the front and back sides of the main body, and a light emitting element or a light receiving element is installed in one cavity, and a light receiving element or a light emitting element is installed in the other cavity with their optical axes aligned, back to back.
An optical semiconductor device characterized in that a cavity is sealed with a light-transmitting lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11340086U JPS6320458U (en) | 1986-07-25 | 1986-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11340086U JPS6320458U (en) | 1986-07-25 | 1986-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320458U true JPS6320458U (en) | 1988-02-10 |
Family
ID=30995167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11340086U Pending JPS6320458U (en) | 1986-07-25 | 1986-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320458U (en) |
-
1986
- 1986-07-25 JP JP11340086U patent/JPS6320458U/ja active Pending