JPS62174353U - - Google Patents
Info
- Publication number
- JPS62174353U JPS62174353U JP6295286U JP6295286U JPS62174353U JP S62174353 U JPS62174353 U JP S62174353U JP 6295286 U JP6295286 U JP 6295286U JP 6295286 U JP6295286 U JP 6295286U JP S62174353 U JPS62174353 U JP S62174353U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded
- light emitting
- light receiving
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の一実施例の縦断面図及
び横断面図、第２図は本考案の他の実施例の縦断
面図、第３図及び第４図は夫々異なる従来例の縦
断面図である。
１，１′：リード、２：発光素子、３：受光素
子、４：内部樹脂（透明シリコーン樹脂）、５：
外装樹脂（不透明エポキシ樹脂）、７：低体積弾
性率の樹脂。
Figures 1 a and b are longitudinal and cross-sectional views of one embodiment of the present invention, Figure 2 is a longitudinal cross-section of another embodiment of the present invention, and Figures 3 and 4 are different conventional examples. FIG. 1, 1': Lead, 2: Light emitting element, 3: Light receiving element, 4: Internal resin (transparent silicone resin), 5:
Exterior resin (opaque epoxy resin), 7: Resin with low bulk modulus.
Claims (1)
なる光結合素子において、前記発光素子と受光素
子間に内部樹脂で光路を形成し、該光路の周囲を
低体積弾性率の樹脂で被覆し、さらに外部周辺を
外装樹脂でトランスフアモールドしたことを特徴
とする光結合素子。 In an optical coupling device in which a light emitting element and a light receiving element pair are resin-molded, an optical path is formed between the light emitting element and the light receiving element using an internal resin, the periphery of the optical path is covered with a resin having a low bulk modulus, and an external An optical coupling element characterized by having its periphery transfer-molded with an exterior resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6295286U JPS62174353U (en) | 1986-04-24 | 1986-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6295286U JPS62174353U (en) | 1986-04-24 | 1986-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174353U true JPS62174353U (en) | 1987-11-05 |
Family
ID=30897719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6295286U Pending JPS62174353U (en) | 1986-04-24 | 1986-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174353U (en) |
-
1986
- 1986-04-24 JP JP6295286U patent/JPS62174353U/ja active Pending