JPS6320443A - Ion plating - Google Patents
Ion platingInfo
- Publication number
- JPS6320443A JPS6320443A JP16355186A JP16355186A JPS6320443A JP S6320443 A JPS6320443 A JP S6320443A JP 16355186 A JP16355186 A JP 16355186A JP 16355186 A JP16355186 A JP 16355186A JP S6320443 A JPS6320443 A JP S6320443A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- articles
- treated
- article
- hearth side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007733 ion plating Methods 0.000 title claims description 15
- 239000002184 metal Substances 0.000 claims abstract description 35
- 150000002736 metal compounds Chemical class 0.000 claims description 22
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 abstract description 4
- 238000007788 roughening Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は例えば機成部品等の被処理物品の表面に金属
又はセラミックの被膜を蒸看形成させるイオンプレーテ
ィング、特にそのハース側外表面の面荒れ防止に関する
ものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to ion plating, which forms a metal or ceramic film by steaming on the surface of an article to be treated, such as a mechanical component, particularly on the outer surface of the hearth side. This is related to preventing surface roughness.
[従来の技術]
第3図はイオンプレーティング装置を示す説明図であり
、図において1はホローカソードガン、2はホローカソ
ードガン1の上方に設けられたコーティング対象部品(
被処理物品)支持用の冶具、3はホローカソードガン1
と治具2との間に設けられたシャッタ、4はホローカソ
ードガン1と治具2とを取り囲む真空容器、5は真空容
器4の内側に設けられた複数の予熱ヒータ、6は真空容
器4内に反応ガスを導入するガスチューブである。ホロ
ーカソードガン1は、第4図に示すように、内部に金属
Tiを入れた水冷Cuルツボ製のバースフと、このハー
ス内のTiにArガスを吹き付けるTaチューブ8とか
らなり、ハース7とTaチューブ8との間には、ハース
7がプラス、Taチューブ8がマイナスとなるように電
圧が印加されている。[Prior Art] FIG. 3 is an explanatory diagram showing an ion plating apparatus. In the figure, 1 is a hollow cathode gun, and 2 is a part to be coated provided above the hollow cathode gun 1 (
Item to be processed) Support jig, 3 is hollow cathode gun 1
4 is a vacuum container surrounding the hollow cathode gun 1 and the jig 2; 5 is a plurality of preheaters provided inside the vacuum container 4; 6 is a vacuum container 4; This is a gas tube that introduces a reaction gas into the chamber. The hollow cathode gun 1, as shown in FIG. A voltage is applied between the tube 8 and the hearth 7 so that the voltage is positive and the Ta tube 8 is negative.
イオンプレーティング装置は上記のように構成され、従
来のイオンプレーティングは次のようにして行なわれて
いた。すなわち、真空容器4内の圧力を例えば0.02
〜0.005Torr程度のアルゴンガス7囲気に保ち
、金属の蒸発源であるホローカソ−ドガン1の上部に、
コーティング対象部品を治具2を介してセットし、部品
に対して該蒸発源との間に負の電圧をかけると、部品と
周囲との間でグロー放電が発生して、部品のまわりに強
い電界ができる。この状態で該蒸発源から金属(Ti)
を蒸発させると、蒸発原子はグロー放電のプラズマ中で
電離されてイオンになり、このイオン化された蒸発原子
はガスイオンと共に電界で加速されて対象部品に衝撃的
に入射し、その結果、対象部品の表面に被膜が形成され
ていた。The ion plating apparatus is constructed as described above, and conventional ion plating was performed as follows. That is, the pressure inside the vacuum container 4 is set to 0.02, for example.
Maintaining an atmosphere of argon gas 7 at about ~0.005 Torr, a hollow cathode gun 1, which is a metal evaporation source, is placed above the hollow cathode gun 1.
When a part to be coated is set via jig 2 and a negative voltage is applied between the part and the evaporation source, glow discharge occurs between the part and the surroundings, causing a strong discharge around the part. An electric field is created. In this state, metal (Ti) is removed from the evaporation source.
When evaporated, the evaporated atoms are ionized in the plasma of the glow discharge and become ions, and these ionized evaporated atoms are accelerated by the electric field together with the gas ions and impinge on the target part.As a result, the target part A film was formed on the surface.
[発明が解決しようとする問題点]
上記のような従来のイオンプレーティングでは、被処理
物品の凹部内を所定の厚みの金属又は金属化合物で蒸着
被覆させようとして、その凹部付近に集中的に金属又は
金属化合物を照射させると、スパッタの影響で該被処理
物品のハース側外表面に面荒れが発生するという問題点
があった。[Problems to be Solved by the Invention] In the conventional ion plating as described above, in order to coat the inside of the recessed part of the article to be treated with a metal or metal compound of a predetermined thickness, the ion plating is concentrated in the vicinity of the recessed part. When a metal or a metal compound is irradiated, there is a problem in that the outer surface of the object to be treated on the hearth side becomes rough due to the effect of sputtering.
この発明は、かかる問題点を解決するためになされたも
ので、被処理物品の凹部付近に集中的に金属又は金属化
合物を照射させても該被処理物品のハース側外表面に面
荒れが発生しないイオンプレーティングを得ることを目
的とする。This invention was made to solve this problem, and even if the metal or metal compound is intensively irradiated near the concave portion of the article to be treated, surface roughness occurs on the outer surface of the article on the hearth side. The aim is to obtain ion plating that does not.
[問題点を解決するための手段コ
この発明に係るイオンプレーティングは、負の電圧が印
加された被処理物品に、正電荷が与えられたガス状の金
属又は金属化合物を照射して、該被処理物品の表面を該
金属又は金属化合物で被覆するイオンプレーティングに
おいて、前記金属又は金属化合物を部分的にシールドす
る金網で前記被処理物品のハース側外表面を被覆して前
記金属又は金属化合物を照射するようにしたことを特徴
とするものである。[Means for Solving the Problems] Ion plating according to the present invention involves irradiating a positively charged gaseous metal or metal compound onto an article to be treated to which a negative voltage has been applied. In ion plating in which the surface of the article to be treated is coated with the metal or metal compound, the outer surface of the article to be treated on the hearth side is coated with a wire mesh that partially shields the metal or metal compound, and the metal or metal compound is coated on the outer surface of the article to be treated on the hearth side. It is characterized in that it irradiates.
[作用]
この発明においては、金属又は金属化合物を部分的にシ
ールドする金網で前記被処理物品のハース側外表面を被
覆して前記金属又は金属化合物を照射するようにしたか
ら、該金網で金属又は金属化合物が捕えられ、被処理物
品のハース側外表面に照射される金属又は金属化合物の
量が少なくなる。[Function] In this invention, since the metal or metal compound is irradiated by covering the hearth side outer surface of the article to be treated with a wire mesh that partially shields the metal or metal compound, the wire mesh partially shields the metal. Alternatively, the metal compound is trapped, and the amount of metal or metal compound irradiated onto the hearth-side outer surface of the article to be treated is reduced.
[実施例]
第1図はこの発明の一実施例を示す説明図であり、図に
おいて、10は被処理物品、11はこの被処理物品の凹
部、12は被処理物品10のハース側外表面を被覆する
金網である。金網12にはO〜正の電位が持たせである
。[Example] FIG. 1 is an explanatory diagram showing an embodiment of the present invention. In the figure, 10 is an article to be treated, 11 is a concave portion of the article to be treated, and 12 is an outer surface on the hearth side of the article to be treated 10. This is a wire mesh that covers the The wire mesh 12 has a potential of O to positive.
上記のように配置して行なうイオンプレーティングにお
いては、金網12で金属又は金属化合物(T i )が
捕えられ、被処理物品10のハース側外表面aに照射さ
れる金属又は金属化合物の量が少なくなる。従って、被
処理物品10の凹部11付近に集中的に金属又は金属化
合物を照射させても被処理物品10のハース側外表面に
面荒れが発生しないことになる。その結果、被処理物品
の外表面と凹部内の被覆の膜厚分布が均一になる。In the ion plating performed with the arrangement as described above, the metal or metal compound (T i ) is captured by the wire mesh 12, and the amount of metal or metal compound irradiated onto the outer surface a of the hearth side of the article to be processed 10 is reduced. It becomes less. Therefore, even if the metal or metal compound is intensively irradiated near the recess 11 of the article 10 to be treated, surface roughness will not occur on the outer surface of the article 10 on the hearth side. As a result, the thickness distribution of the coating on the outer surface of the article to be treated and within the recesses becomes uniform.
実験例
被処理物品の凹部の穴径が30mmφ、被処理物品の外
表面と金網との間隔d≧10の条件でイオンプレーティ
ングの実験をしたところ、被覆位置a % dと被覆の
厚さくμm)との関係は342図に示すようになった。Experimental Example An ion plating experiment was conducted under the conditions that the hole diameter of the concave part of the article to be treated was 30 mmφ, and the distance d≧10 between the outer surface of the article to be treated and the wire mesh. ) is now shown in Figure 342.
この実験例から本発明法は従来法と比較して均一に蒸着
被覆でき、面荒れが防止されることがわかる。This experimental example shows that the method of the present invention enables more uniform vapor deposition and prevents surface roughening compared to the conventional method.
[発明の効果]
この発明は以上説明したとおり、金属又は金属化合物を
部分的にシールドする金網で前記被処理物品のハース側
外表面を被覆して前記金属又は金属化合物を照射するよ
うにしたから、該金網で金属又は金属化合物が捕えられ
、被処理物品のハース側外表面に照射される金属又は金
属化合物の量が少なくなり、被処理物品のハース側外表
面の面荒れが防止できるという効果がある。[Effects of the Invention] As explained above, the present invention covers the outer surface of the hearth side of the article to be treated with a wire mesh that partially shields the metal or metal compound, and irradiates the metal or metal compound. The effect is that the metal or metal compound is captured by the wire mesh, the amount of metal or metal compound irradiated to the outer surface of the hearth side of the article to be treated is reduced, and surface roughening of the outer surface of the hearth side of the article to be treated can be prevented. There is.
第1図はこの発明の一実施例を示す説明図、第2図は被
覆位置と蒸暑膜厚との関係を示すグラフ、第3図はイオ
ンプレーティング装置の説明図、第4図はホローカソー
ドガンの説明図である。
図において、1はホローカソードガン、2は治具、3は
シャッタ、4は真空容器、5は予熱ヒ−タ、6はガスチ
ューブ、7はハース、8はTaチューブ、10は被処理
物品、11は凹部、12は金網である
代理人 弁理士 佐 藤 正 年
第1図
Ti″N Ti”N
第2図
fil[位!
第3図
J!!??’)気
第4図
手続補正書(自発)Fig. 1 is an explanatory diagram showing an embodiment of the present invention, Fig. 2 is a graph showing the relationship between the coating position and the heat film thickness, Fig. 3 is an explanatory diagram of the ion plating device, and Fig. 4 is a hollow cathode. It is an explanatory view of a gun. In the figure, 1 is a hollow cathode gun, 2 is a jig, 3 is a shutter, 4 is a vacuum container, 5 is a preheater, 6 is a gas tube, 7 is a hearth, 8 is a Ta tube, 10 is an article to be processed, 11 is a recess, and 12 is a wire mesh Agent Patent Attorney Masashi Sato Figure 1 Ti″N Ti″N Figure 2 fil [position! Figure 3 J! ! ? ? ') Chart 4 procedural amendment (voluntary)
Claims (1)
たガス状の金属又は金属化合物を照射して、該被処理物
品の表面を該金属又は金属化合物で被覆するイオンプレ
ーティングにおいて、前記金属又は金属化合物を部分的
にシールドする金網で前記被処理物品のハース側外表面
を被覆して前記金属又は金属化合物を照射するようにし
たことを特徴とするイオンプレーティング。In ion plating, the surface of the treated article is coated with the metal or metal compound by irradiating a positively charged gaseous metal or metal compound onto the treated article to which a negative voltage has been applied, Ion plating characterized in that the metal or metal compound is irradiated by covering the hearth side outer surface of the article to be processed with a wire mesh that partially shields the metal or metal compound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16355186A JPS6320443A (en) | 1986-07-14 | 1986-07-14 | Ion plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16355186A JPS6320443A (en) | 1986-07-14 | 1986-07-14 | Ion plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6320443A true JPS6320443A (en) | 1988-01-28 |
Family
ID=15776045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16355186A Pending JPS6320443A (en) | 1986-07-14 | 1986-07-14 | Ion plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6320443A (en) |
-
1986
- 1986-07-14 JP JP16355186A patent/JPS6320443A/en active Pending
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