JPS6320434U - - Google Patents

Info

Publication number
JPS6320434U
JPS6320434U JP1986114183U JP11418386U JPS6320434U JP S6320434 U JPS6320434 U JP S6320434U JP 1986114183 U JP1986114183 U JP 1986114183U JP 11418386 U JP11418386 U JP 11418386U JP S6320434 U JPS6320434 U JP S6320434U
Authority
JP
Japan
Prior art keywords
gold wire
pressure air
gold
movable part
detection circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986114183U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986114183U priority Critical patent/JPS6320434U/ja
Publication of JPS6320434U publication Critical patent/JPS6320434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1986114183U 1986-07-25 1986-07-25 Pending JPS6320434U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986114183U JPS6320434U (enExample) 1986-07-25 1986-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986114183U JPS6320434U (enExample) 1986-07-25 1986-07-25

Publications (1)

Publication Number Publication Date
JPS6320434U true JPS6320434U (enExample) 1988-02-10

Family

ID=30996683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986114183U Pending JPS6320434U (enExample) 1986-07-25 1986-07-25

Country Status (1)

Country Link
JP (1) JPS6320434U (enExample)

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