JPS6320129Y2 - - Google Patents

Info

Publication number
JPS6320129Y2
JPS6320129Y2 JP1982056108U JP5610882U JPS6320129Y2 JP S6320129 Y2 JPS6320129 Y2 JP S6320129Y2 JP 1982056108 U JP1982056108 U JP 1982056108U JP 5610882 U JP5610882 U JP 5610882U JP S6320129 Y2 JPS6320129 Y2 JP S6320129Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode element
light
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982056108U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58158459U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982056108U priority Critical patent/JPS58158459U/ja
Publication of JPS58158459U publication Critical patent/JPS58158459U/ja
Application granted granted Critical
Publication of JPS6320129Y2 publication Critical patent/JPS6320129Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/537—Multiple bond wires having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1982056108U 1982-04-16 1982-04-16 発光ダイオ−ド Granted JPS58158459U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982056108U JPS58158459U (ja) 1982-04-16 1982-04-16 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982056108U JPS58158459U (ja) 1982-04-16 1982-04-16 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS58158459U JPS58158459U (ja) 1983-10-22
JPS6320129Y2 true JPS6320129Y2 (Direct) 1988-06-03

Family

ID=30066649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982056108U Granted JPS58158459U (ja) 1982-04-16 1982-04-16 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS58158459U (Direct)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111682A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp 光半導体素子用サブマウント
JPH0710003B2 (ja) * 1988-03-11 1995-02-01 信越半導体株式会社 混色発光半導体素子
EP1649514B1 (en) * 2003-07-30 2014-01-01 Panasonic Corporation Semiconductor light emitting device, light emitting module, and lighting apparatus
JP4756010B2 (ja) * 2007-06-18 2011-08-24 株式会社東芝 発光装置

Also Published As

Publication number Publication date
JPS58158459U (ja) 1983-10-22

Similar Documents

Publication Publication Date Title
TWI229458B (en) Back luminescent chip type light emitting unit and insulating substrate using the same
US6563139B2 (en) Package structure of full color LED form by overlap cascaded die bonding
JP2003197968A (ja) 透明導電層及び反射層で直接結合されたチップの積み重ねによるフルカラー発光ダイオード光源のパッケージ構造
US20020167015A1 (en) Semiconductor light emitting device
JPH0710003B2 (ja) 混色発光半導体素子
JP3649748B2 (ja) 発光ダイオードランプ
JP2000277808A (ja) 光源装置およびその製造方法
JP3414403B2 (ja) 発光ダイオードチップおよびこれを用いた発光ダイオード
JPWO1997001190A1 (ja) 発光ダイオードチップおよびこれを用いた発光ダイオード
JPH02283079A (ja) 発光素子
JP3571477B2 (ja) 半導体発光素子
JPH0691285B2 (ja) フルカラー発光装置
US20050156177A1 (en) Light-emitting device with enlarged area of active luminescence region
JPS6246293Y2 (Direct)
JP3237490B2 (ja) Ｌｅｄランプ
JPH065922A (ja) 多色発光ダイオード
JP2515531Y2 (ja) Ｌｅｄ発光表示素子
JPH0625966Y2 (ja) マトリクス型発光ダイオ−ド
KR101602861B1 (ko) 발광 소자
JP2567816B2 (ja) マトリクス表示装置
JPH0644116Y2 (ja) 炭化ケイ素発光ダイオード装置
JPS5939726Y2 (ja) 固定表示装置
JP2003078175A (ja) 疑似白色発光装置
JPS6232664A (ja) 交直両用ｌｅｄランプ
JPH04137772A (ja) ３色発光素子及び表示装置