JPS63200360U - - Google Patents
Info
- Publication number
- JPS63200360U JPS63200360U JP9148287U JP9148287U JPS63200360U JP S63200360 U JPS63200360 U JP S63200360U JP 9148287 U JP9148287 U JP 9148287U JP 9148287 U JP9148287 U JP 9148287U JP S63200360 U JPS63200360 U JP S63200360U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil pattern
- wiring board
- printed wiring
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の一実施例のパターン図、第2
図は同上の他の実施例のパターン図、第3図は電
源回路の回路図、第4図は第3図に対応した従来
例のパターン図、第5図は電源回路の回路図、第
6図は第5図に対応した従来例のパターン図であ
る。
4はプリント板、5,6は銅箔パターン、7,
8は接合部である。
Figure 1 is a pattern diagram of an embodiment of the present invention, Figure 2 is a pattern diagram of an embodiment of the present invention.
The figure is a pattern diagram of another embodiment same as above, Figure 3 is a circuit diagram of a power supply circuit, Figure 4 is a pattern diagram of a conventional example corresponding to Figure 3, Figure 5 is a circuit diagram of a power supply circuit, and Figure 6 is a diagram of a conventional example. This figure is a pattern diagram of a conventional example corresponding to FIG. 5. 4 is a printed board, 5 and 6 are copper foil patterns, 7,
8 is a joint.
Claims (1)
リント板を収納する金属ケースとの間の静電誘導
等による静電遮蔽の効果を大きくするため、ある
いは電流容量に鑑みて銅箔パターンの発熱を低減
するために該銅箔パターンの幅を広くしたプリン
ト配線板において、上記電子部品が接続されるプ
リント板の接合部の部分のみ銅箔パターンを狭幅
にして成ることを特徴とするプリント配線板。 (2) 上記電子回路をチヨツパ型電源回路とし、
銅箔パターンを狭幅にして接続する電子部品を上
記電源回路の雑音防止用コンデンサであることを
特徴とする実用新案登録請求の範囲第1項記載の
プリント配線板。[Scope of Claim for Utility Model Registration] (1) To increase the effect of electrostatic shielding due to electrostatic induction between a metal case housing a printed board on which electronic components constituting an electronic circuit are mounted, or to increase the current capacity. In view of this, in a printed wiring board in which the width of the copper foil pattern is widened in order to reduce heat generation in the copper foil pattern, the width of the copper foil pattern is narrowed only at the joint portion of the printed board where the electronic components are connected. A printed wiring board characterized by: (2) The above electronic circuit is made into a choppy type power supply circuit,
2. The printed wiring board according to claim 1, wherein the electronic component to which the copper foil pattern is narrowed and connected is a noise prevention capacitor of the power supply circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9148287U JPS63200360U (en) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9148287U JPS63200360U (en) | 1987-06-15 | 1987-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63200360U true JPS63200360U (en) | 1988-12-23 |
Family
ID=30952304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9148287U Pending JPS63200360U (en) | 1987-06-15 | 1987-06-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63200360U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310123A (en) * | 2005-04-28 | 2006-11-09 | Minebea Co Ltd | Planar lighting system |
JP2008059987A (en) * | 2006-09-01 | 2008-03-13 | Minebea Co Ltd | Planar lighting apparatus |
JP2017028005A (en) * | 2015-07-17 | 2017-02-02 | 本田技研工業株式会社 | Circuit board with high tolerance against ground noise, and electronic apparatus including circuit board |
-
1987
- 1987-06-15 JP JP9148287U patent/JPS63200360U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310123A (en) * | 2005-04-28 | 2006-11-09 | Minebea Co Ltd | Planar lighting system |
JP4596145B2 (en) * | 2005-04-28 | 2010-12-08 | ミネベア株式会社 | Surface lighting device |
JP2008059987A (en) * | 2006-09-01 | 2008-03-13 | Minebea Co Ltd | Planar lighting apparatus |
JP4674692B2 (en) * | 2006-09-01 | 2011-04-20 | ミネベア株式会社 | Surface lighting device |
JP2017028005A (en) * | 2015-07-17 | 2017-02-02 | 本田技研工業株式会社 | Circuit board with high tolerance against ground noise, and electronic apparatus including circuit board |