JPS63195772U - - Google Patents

Info

Publication number
JPS63195772U
JPS63195772U JP1987087224U JP8722487U JPS63195772U JP S63195772 U JPS63195772 U JP S63195772U JP 1987087224 U JP1987087224 U JP 1987087224U JP 8722487 U JP8722487 U JP 8722487U JP S63195772 U JPS63195772 U JP S63195772U
Authority
JP
Japan
Prior art keywords
land
wiring pattern
component connection
electronic component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987087224U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987087224U priority Critical patent/JPS63195772U/ja
Priority to US07/196,603 priority patent/US4874907A/en
Publication of JPS63195772U publication Critical patent/JPS63195772U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1987087224U 1987-06-05 1987-06-05 Pending JPS63195772U (en18)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987087224U JPS63195772U (en18) 1987-06-05 1987-06-05
US07/196,603 US4874907A (en) 1987-06-05 1988-05-20 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987087224U JPS63195772U (en18) 1987-06-05 1987-06-05

Publications (1)

Publication Number Publication Date
JPS63195772U true JPS63195772U (en18) 1988-12-16

Family

ID=13908913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987087224U Pending JPS63195772U (en18) 1987-06-05 1987-06-05

Country Status (2)

Country Link
US (1) US4874907A (en18)
JP (1) JPS63195772U (en18)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384433A (en) * 1991-10-29 1995-01-24 Aptix Corporation Printed circuit structure including power, decoupling and signal termination
FR2697966B1 (fr) * 1992-11-06 1995-01-06 Thomson Csf Dispositif pour le test manuel d'une carte de circuit imprimé équipée de composants montés en surface.
US5307980A (en) * 1993-02-10 1994-05-03 Ford Motor Company Solder pad configuration for wave soldering
FR2720857B1 (fr) * 1994-01-12 1998-04-30 Fujitsu Ltd Module de circuit intégré hybride à électrode saillante.
US6274824B1 (en) * 1997-03-31 2001-08-14 Visteon Global Technologies, Inc. Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
US7645940B2 (en) * 2004-02-06 2010-01-12 Solectron Corporation Substrate with via and pad structures
JP3976020B2 (ja) * 2004-02-12 2007-09-12 株式会社豊田自動織機 表面実装用電子部品の表面実装構造
US20050190824A1 (en) * 2004-02-26 2005-09-01 Grande Brad L. Method and apparatus for mounting a modem to a carrier assembly
JP5150076B2 (ja) * 2006-09-15 2013-02-20 株式会社豊田自動織機 表面実装用電子部品の表面実装構造
JP2008227183A (ja) * 2007-03-13 2008-09-25 Fujitsu Ltd プリント基板ユニットおよびプリント配線板
EP1986204B1 (de) * 2007-04-16 2017-07-12 Marquardt GmbH Verfahren zur Herstellung eines elektromechanischen Schalters
CN103018591A (zh) * 2012-11-27 2013-04-03 胜宏科技（惠州）股份有限公司 一种高精密度线路板电性测试的方法
JP6362889B2 (ja) * 2013-04-26 2018-07-25 日立オートモティブシステムズ株式会社 電子制御装置
JP6332958B2 (ja) * 2013-12-18 2018-05-30 キヤノン株式会社 電子部品の実装構造及びプリント配線板並びに電子機器
JP6318638B2 (ja) * 2014-01-17 2018-05-09 富士通株式会社 プリント配線板および情報処理装置
US9763333B2 (en) * 2015-03-09 2017-09-12 Cooper Technologies Company Shared resistor pad bypass

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3742597A (en) * 1971-03-17 1973-07-03 Hadco Printed Circuits Inc Method for making a coated printed circuit board
JPS5724775U (en18) * 1980-07-17 1982-02-08
FR2522824A1 (fr) * 1982-03-05 1983-09-09 Commissariat Energie Atomique Dispositif pour appliquer des signaux logiques de test a deux etats sur une entree d'un circuit logique et application aux tests automatiques d'une pluralite de circuits logiques
DE3212165A1 (de) * 1982-04-01 1983-10-06 Basf Ag Herbizide diphenylether, verfahren zu ihrer herstellung und ihre verwendung zur bekaempfung unerwuenschten pflanzenwuchses
US4521262A (en) * 1983-01-10 1985-06-04 Pellegrino Peter P Method for mass producing printed circuit boards
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
JPS6298254A (ja) * 1985-10-25 1987-05-07 Matsushita Electric Works Ltd 建物の結露診断装置

Also Published As

Publication number Publication date
US4874907A (en) 1989-10-17

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