JPS63193440A - Shadow mask alloy plate and shadow mask - Google Patents

Abstract

PURPOSE:To obtain a shadow mask without white irregularity by specifying X-ray diffraction intensity on a surface of a Fe-Ni group amber alloy plate. CONSTITUTION:X-ray diffraction intensity on a surface of an Fe-Ni group amber alloy plate is made to satisfy a relation shown in an equation I. In the equation I, I{111}, I{200}, I{220} represent X-ray diffraction integral intensities on a {111} plane, a {200} plane, a (220) plane, respectively, of the Fe-Ni group amber alloy plate, and IFe{110}, IFe{200} represent X-ray diffraction integral intensities on a {110} plane, a {200} plane, respectively, of alpha-Fe. An alloy which centers 36Ni-Fe to contain 30% to 50 % of Ni and the remaining part of Fe is typically used as the Fe-Ni group amber alloy, but an alloy to which Cr, Co and the like are added is allowed to be used as needed. When electron beam apertures are formed to manufacture a shadow mask, crystal bearings of the surface of the alloy plate should be preferably made uniform in order to form the apertures uniform in their shapes. Hence, a shadow mask without white irregularity can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a shadow mask used in a color television picture tube.

(Prior art) Shadow masks used in color television picture tubes are
It has the ability to project an accurate electron beam spot onto a three-color phosphor screen. Therefore, the relative position, diameter, and shape of the electron beam passage hole have a direct effect on image quality, and a high degree of machining of the electron beam passage hole is required. Furthermore, in order to prevent the generation of scattered electrons, a special process is required in which the surface of the electron beam passage hole facing the fluorescent screen is chamfered into a hemispherical shape. If these processing precisions are low, image quality will deteriorate due to doming.

Conventionally, such shadow masks have been processed by forming elongated electron passing holes by etching on a shadow mask original plate.

On the other hand, in recent years, the general demand for finer details on TV screens has increased, and the development of high-definition TV systems is progressing even in communication systems.Therefore, from the perspective of improving the resolution of picture tubes, shadow masks are being used. It is required to form an even finer electron beam passing hole.In addition, due to thermal expansion of the high-definition shadow mask, the problem of positional deviation of the electron beam passing hole arises, and to solve this problem, Fe
-The use of a Ni-based amber alloy is being considered. However, under such circumstances, problems that have not been much of an issue in the past have come into focus. One of them is
When fine electron beam passing holes are etched into a shadow mask original plate whose thickness has been thinned by rolling, there is a drawback that the holes are not uniform. It was discovered that the shape of the holes could be made uniform by aligning the (100) plane on the plate surface of the shadow mask original plate, and the results were published in Japanese Patent Application No. 57-147700 and No. 60-106024.

This was disclosed in Japanese Patent Application No. 58-19085 and Japanese Patent Application No. 60-73847.

However, white unevenness was found in the shadow mask with holes drilled in the shadow mask original plate whose plate surface was aligned with the (ioo) plane, and detailed measurements revealed that the shape of the electron holes was ideally similar, but the size It turns out that there are sizes.

(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned conventional problems.Not only the shape but also the size of the electron holes are extremely uniform, resulting in a shadow mask with no white unevenness. This is what we are trying to provide.

[Structure of the invention]

(Means and effects for solving the problem) According to the research conducted by the present inventors, it was found that the above-mentioned white unevenness was caused by the precipitation of α-Fe. Since α-Fe has poorer corrosion resistance than the amber alloy, the diameter of the electron hole becomes larger where α-Fe is localized. Therefore, this α
It has been found that this white unevenness can be eliminated by suppressing the precipitation of -Fe, leading to the creation of the present invention.

That is, the present invention is an alloy plate for which the X-ray diffraction intensity on the plate surface of an Fe-Ni-based amber alloy plate is as follows: and a shadow mask in which an electron beam passage hole is formed in this alloy plate. This parameter h is 20
If it is less than that, white unevenness tends to occur.

The alloy plate for shadow masks of the present invention is manufactured as follows. In FeNi alloys, the γ phase (f, c, c) occurs at temperatures above 900°C, regardless of the composition ratio of Fe and Ni.
It is known that it will become When slowly cooling the γ phase at 900° C. or higher, α phase Fs and γ phase Ni are precipitated in the γ phase Fe-Ni alloy. However, if the γ phase is rapidly cooled at 900°C or higher, the crystal structure formed at 900°C can be maintained as it is even at room temperature.
i alloy can be obtained.

Therefore, the alloy plate of the present invention can be obtained by performing a refining heat treatment in which the alloy plate is rapidly cooled from a high temperature of 900° C. or higher during normal manufacturing processes such as forging, hot rolling, and cold rolling. This tempering heat treatment is performed during the manufacturing process.

For example, it can be done anywhere, such as hot rolling machine or cold rolling.
This i! is preferably carried out after hot rolling and before cold rolling. In the 1lIqjt heat treatment, the end point temperature of hot rolling is 90
When the temperature is 0°C or higher, the temperature is typically lowered after hot rolling, but Cr, Co, etc. may be added as necessary.

Also, when manufacturing a shadow mask, 11! In order to form holes with uniform shapes, it is preferable to align the crystal orientations of the surfaces of the alloy plates. Specifically, Fe-Ni-based amber alloy (200)
The degree to which the (111) crystal plane is more concentrated than the (220) crystal plane is the (200) diffraction intensity by I+2°. ), (111) diffraction intensity as I(xn+1, (220)
If the diffraction intensity is I(2aa l, then g=(Its..> + I(txt>)/Lzz
. ), and it is sufficient if this g value is 2 or more. In other words, it is preferable to reduce the degree of aggregation of (220) crystal planes that result in non-uniform pore shapes.

In addition, the plate surface has 35% or more (100) planes, preferably 4
It is better to have 0% or more aggregation in terms of etching properties, etc., and the following formula is generally used to express the degree of aggregation. It is sufficient if the angle formed is 0.35 or more, preferably 0.4 or more.

In order to obtain an alloy plate for a shadow mask in which (100) planes are assembled in this way, an alloy ingot is formed into an ingot.

After the normal manufacturing process of forging and hot rolling,
Preferably, strong working rolling is performed at a rolling reduction of 80% or more, and then heat treatment is performed at a temperature exceeding the recrystallization temperature. By hard rolling, the (110) crystal planes are assembled, and by heat treatment at a temperature higher than the recrystallization temperature, the (100) crystal planes are rotated and the 1oo) crystal planes are assembled. Furthermore, if necessary, the accuracy of the plate thickness can be improved by cold rolling at a rolling rate of 25% or less without rotating the crystal plane.

Furthermore, more (100) crystal planes are aligned (A
) on the side opposite to the electron beam incident side, the cross-sectional shape of the electron beam passing hole becomes larger on the side (A), which is suitable for the hole. Therefore a = Inon)
/I(gzol) It is desirable that the surface having a large value of a be the opposite side to the electron beam incident side.

(Example) A plurality of 5-ton ingots were obtained. This is 1200
℃ 4 hours Me forging L160tX625'X6000Q
(7) Dimensions. Thereafter, it was heated to 1100° C. for 4 hours to perform hot rolling. Then, in a continuous heat treatment furnace,
After holding water at 100°C, it was carried out (II quality ripe heat treatment. After that, 90% cold rolling and recrystallization annealing at 900°C were performed to give a 4%
It was flattened using a skin pass and used as a shadow mask original plate. When electron beam passage holes were formed in this original plate by photoetching, uniform electron beam passage holes were obtained over the entire surface of the shadow mask.

FIG. 1 is an X-ray diffraction diagram of an alloy plate for a shadow mask according to this embodiment. When X-ray diffraction was performed over the entire surface of the shadow mask, it was found that 36% Ni-Fe (11
1), (200), and (220) peaks were shown.

Note that h (direct) was 101.5, and there was no white unevenness.

FIG. 2 is an example of X-ray diffraction of a shadow mask in the case where the refining heat treatment was not performed. In this case, most of the surfaces of the shadow mask are typical as shown in FIG. 1, but (110) and (200) of a-Fe and (200) of
There were locations where all of the peaks of 220) were present. The h value was 15.8, which coincided with the white spot of white unevenness.

An alloy plate for a shadow mask was manufactured, and the occurrence of white unevenness when a shadow mask was manufactured using this was investigated.

X-ray diffraction is CuKa 50kV 100+*A
Better hole formation was achieved when 2θ=40 to 80° and the side with the larger h value was placed on the opposite side of the electron beam incident surface.

〔Effect of the invention〕

As explained above, according to the present invention, a shadow mask without white unevenness can be obtained and is very effective.

[Brief explanation of the drawing]

FIG. 1 is an X-ray diffraction diagram of an example of the present invention, and FIG. 2 is an X-ray diffraction diagram of a comparative example. Agent Patent Attorney Nori Ken Yudo Takehana Kikuo Q 1st 1 Q Chiku 2 Figure

Claims (2)

[Claims] (1) The X-ray diffraction intensity on the plate surface of the Fe-Ni-based amber alloy plate is h=[[I_{_1_1_1_}+I_{_2_0_0
＿}+I_{_2_2_2_}]/[I_F_e_{＿
1_1_0_}+I_F_e_{_2_0_0_}]]
≧20 (However, I_{_1_1_1_}I_{_2_0
_0_}I_{_2_2_0_} are the {111} plane, {200} plane, and {220} plane of Fe-Ni-based amber alloy, respectively.
} plane X-ray diffraction intensity I_F_e_{_1_0_0_}, I_F_e_{_2
_0_0_} are the p{100} plane and {20} of α-Fe, respectively.
0} plane X-ray diffraction intensity). (2) The X-ray diffraction intensity on the plate surface of the Fe-Ni-based amber alloy plate is h=[[I_{_1_1_1_}+I_{_2_0_0
＿}+I_{_2_2_0_}]/[I_F_e_{＿
1_1_0_}+I_F_e_{_2_0_0_}]]
≧20 (However, I_{_1_1_1_}I_{_2_0
_0_}I_{_2_2_0_} are the {111} plane, {200} plane, and {220} plane of Fe-Ni-based amber alloy, respectively.
Surface X-ray diffraction integrated intensity I_F_e_{_1_1_0_}, I_F_e_{_2
_0_0_} are the {110} plane and {200} plane of α-Fe, respectively.
} A shadow mask characterized in that an electron beam passing hole is provided in an alloy plate for a shadow mask that satisfies the relationship of X-ray diffraction integrated intensity of the plane.