JPS63191647U - - Google Patents

Info

Publication number
JPS63191647U
JPS63191647U JP1987082912U JP8291287U JPS63191647U JP S63191647 U JPS63191647 U JP S63191647U JP 1987082912 U JP1987082912 U JP 1987082912U JP 8291287 U JP8291287 U JP 8291287U JP S63191647 U JPS63191647 U JP S63191647U
Authority
JP
Japan
Prior art keywords
lead
semiconductor chip
insulating layer
insulator
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987082912U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526759Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987082912U priority Critical patent/JPH0526759Y2/ja
Publication of JPS63191647U publication Critical patent/JPS63191647U/ja
Application granted granted Critical
Publication of JPH0526759Y2 publication Critical patent/JPH0526759Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1987082912U 1987-05-29 1987-05-29 Expired - Lifetime JPH0526759Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (https=) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (https=) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63191647U true JPS63191647U (https=) 1988-12-09
JPH0526759Y2 JPH0526759Y2 (https=) 1993-07-07

Family

ID=30936002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987082912U Expired - Lifetime JPH0526759Y2 (https=) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0526759Y2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273367A (ja) * 1988-04-26 1989-11-01 Iwasaki Electric Co Ltd 発光ダイオード
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
JPH08298345A (ja) * 1995-04-26 1996-11-12 Shichizun Denshi:Kk チップ型発光ダイオード
WO2004093204A1 (ja) * 2003-04-16 2004-10-28 Tabuchi Electric Co., Ltd. 反射型発光ダイオード
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614585U (https=) * 1979-07-16 1981-02-07
JPS5950762A (ja) * 1982-09-01 1984-03-23 パワトロン・デイビジヨン・オブ・コントラヴエス・ゴ−ツ・コ−ポレイシヨン 永久磁石直流機およびその管状フレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614585U (https=) * 1979-07-16 1981-02-07
JPS5950762A (ja) * 1982-09-01 1984-03-23 パワトロン・デイビジヨン・オブ・コントラヴエス・ゴ−ツ・コ−ポレイシヨン 永久磁石直流機およびその管状フレ−ム

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273367A (ja) * 1988-04-26 1989-11-01 Iwasaki Electric Co Ltd 発光ダイオード
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
JPH08298345A (ja) * 1995-04-26 1996-11-12 Shichizun Denshi:Kk チップ型発光ダイオード
WO2004093204A1 (ja) * 2003-04-16 2004-10-28 Tabuchi Electric Co., Ltd. 反射型発光ダイオード
CN100394618C (zh) * 2003-04-16 2008-06-11 株式会社珍珠电球制作所 反射型发光二极管
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール
JP5669866B2 (ja) * 2011-02-09 2015-02-18 三菱電機株式会社 パワー半導体モジュール
US9129949B2 (en) 2011-02-09 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module

Also Published As

Publication number Publication date
JPH0526759Y2 (https=) 1993-07-07

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