JPS63188943U - - Google Patents
Info
- Publication number
- JPS63188943U JPS63188943U JP1987080602U JP8060287U JPS63188943U JP S63188943 U JPS63188943 U JP S63188943U JP 1987080602 U JP1987080602 U JP 1987080602U JP 8060287 U JP8060287 U JP 8060287U JP S63188943 U JPS63188943 U JP S63188943U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- guide
- metal foil
- semiconductor pellet
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080602U JPS63188943U (enExample) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080602U JPS63188943U (enExample) | 1987-05-26 | 1987-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188943U true JPS63188943U (enExample) | 1988-12-05 |
Family
ID=30931556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987080602U Pending JPS63188943U (enExample) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188943U (enExample) |
-
1987
- 1987-05-26 JP JP1987080602U patent/JPS63188943U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59129655U (ja) | オ−トマチツクシ−トベルトのガイドレ−ル装置 | |
| JPS6048258U (ja) | インジウムを含む半導体デバイス | |
| JPS63188943U (enExample) | ||
| JPS6071018U (ja) | 電気接触子 | |
| JPS60130649U (ja) | 樹脂封止型半導体装置 | |
| JPS63112339U (enExample) | ||
| JPS5917399U (ja) | 解栓タブを具えたエアゾ−ル缶 | |
| JPS5889931U (ja) | リ−ドフレ−ム | |
| JPS63112340U (enExample) | ||
| JPS63132433U (enExample) | ||
| JPS6151750U (enExample) | ||
| JPS59166391U (ja) | 導電性発熱体 | |
| JPS592742U (ja) | カセツトテ−プのテンシヨン装置 | |
| JPH0275747U (enExample) | ||
| JPS60179050U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
| JPH0236053U (enExample) | ||
| JPH0252337U (enExample) | ||
| JPS5918443U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH0236054U (enExample) | ||
| JPS59123999U (ja) | リ−ド線付きｅｌ | |
| JPH04759U (enExample) | ||
| JPS64340U (enExample) | ||
| JPS5815360U (ja) | 樹脂封止型半導体装置 | |
| JPS58147971U (ja) | 階段昇降装置 |