JPS63187341U - - Google Patents
Info
- Publication number
- JPS63187341U JPS63187341U JP7736287U JP7736287U JPS63187341U JP S63187341 U JPS63187341 U JP S63187341U JP 7736287 U JP7736287 U JP 7736287U JP 7736287 U JP7736287 U JP 7736287U JP S63187341 U JPS63187341 U JP S63187341U
- Authority
- JP
- Japan
- Prior art keywords
- package
- power supply
- chip
- signal wiring
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987077362U JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Icパツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987077362U JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Icパツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63187341U true JPS63187341U (un) | 1988-11-30 |
JPH0720920Y2 JPH0720920Y2 (ja) | 1995-05-15 |
Family
ID=30925295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987077362U Expired - Lifetime JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Icパツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720920Y2 (un) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007081125A (ja) * | 2005-09-14 | 2007-03-29 | Toshiba Corp | 高周波用パッケージ |
JP2017045957A (ja) * | 2015-08-28 | 2017-03-02 | 株式会社東芝 | 高周波半導体装置 |
CN111199965A (zh) * | 2018-11-16 | 2020-05-26 | 模拟设备国际无限公司 | 调节器电路封装技术 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134060A (ja) * | 1984-12-04 | 1986-06-21 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
-
1987
- 1987-05-25 JP JP1987077362U patent/JPH0720920Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134060A (ja) * | 1984-12-04 | 1986-06-21 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007081125A (ja) * | 2005-09-14 | 2007-03-29 | Toshiba Corp | 高周波用パッケージ |
JP4575261B2 (ja) * | 2005-09-14 | 2010-11-04 | 株式会社東芝 | 高周波用パッケージ |
JP2017045957A (ja) * | 2015-08-28 | 2017-03-02 | 株式会社東芝 | 高周波半導体装置 |
CN111199965A (zh) * | 2018-11-16 | 2020-05-26 | 模拟设备国际无限公司 | 调节器电路封装技术 |
CN111199965B (zh) * | 2018-11-16 | 2023-11-03 | 亚德诺半导体国际无限责任公司 | 调节器电路封装技术 |
Also Published As
Publication number | Publication date |
---|---|
JPH0720920Y2 (ja) | 1995-05-15 |
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