JPS63187341U - - Google Patents

Info

Publication number
JPS63187341U
JPS63187341U JP7736287U JP7736287U JPS63187341U JP S63187341 U JPS63187341 U JP S63187341U JP 7736287 U JP7736287 U JP 7736287U JP 7736287 U JP7736287 U JP 7736287U JP S63187341 U JPS63187341 U JP S63187341U
Authority
JP
Japan
Prior art keywords
package
power supply
chip
signal wiring
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7736287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0720920Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987077362U priority Critical patent/JPH0720920Y2/ja
Publication of JPS63187341U publication Critical patent/JPS63187341U/ja
Application granted granted Critical
Publication of JPH0720920Y2 publication Critical patent/JPH0720920Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987077362U 1987-05-25 1987-05-25 Ｉｃパツケ−ジ Expired - Lifetime JPH0720920Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987077362U JPH0720920Y2 (ja) 1987-05-25 1987-05-25 Ｉｃパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987077362U JPH0720920Y2 (ja) 1987-05-25 1987-05-25 Ｉｃパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS63187341U true JPS63187341U (en:Method) 1988-11-30
JPH0720920Y2 JPH0720920Y2 (ja) 1995-05-15

Family

ID=30925295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987077362U Expired - Lifetime JPH0720920Y2 (ja) 1987-05-25 1987-05-25 Ｉｃパツケ−ジ

Country Status (1)

Country Link
JP (1) JPH0720920Y2 (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081125A (ja) * 2005-09-14 2007-03-29 Toshiba Corp 高周波用パッケージ
JP2017045957A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置
CN111199965A (zh) * 2018-11-16 2020-05-26 模拟设备国际无限公司 调节器电路封装技术

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134060A (ja) * 1984-12-04 1986-06-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134060A (ja) * 1984-12-04 1986-06-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081125A (ja) * 2005-09-14 2007-03-29 Toshiba Corp 高周波用パッケージ
JP2017045957A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置
CN111199965A (zh) * 2018-11-16 2020-05-26 模拟设备国际无限公司 调节器电路封装技术
CN111199965B (zh) * 2018-11-16 2023-11-03 亚德诺半导体国际无限责任公司 调节器电路封装技术

Also Published As

Publication number Publication date
JPH0720920Y2 (ja) 1995-05-15

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