JPS63186491A - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to the construction of a hybrid integrated circuit board having a metal board circuit pattern formed by bonding copper plates.

(Prior art) Hybrid integrated circuits are usually made by bonding a copper plate to the surface of an aluminum or iron plate using an epoxy resin or polyimide resin plate as an insulator, and then forming a circuit pattern using an etching method. , I
It is equipped with functional parts such as C. In manufacturing this type of circuit board, a circuit pattern is formed on a board cut into predetermined dimensions by etching or the like.

(Problem to be solved by the invention) However, in this case, the etching agent diffuses into the end surface of the board from the peeled part of the pasted resin material that occurs during cutting, causing a corrosion phenomenon when used as a circuit board for a long time. There was fear.

Figure 2 shows an example of this, a metal iron plate! A polyimide plate 3 as an insulating material and a copper plate 4 are bonded together using an epoxy resin adhesive 2 to form a circuit board.After cutting, a circuit pattern 4° is formed by etching, etc., a chip capacitor 5 is mounted, and a copper plate 4 is bonded. The parts are joined together to form a hybrid integrated circuit.

The above-mentioned cutting is generally carried out by a mechanical cutting method using a shear or the like, but in this case, the substrate, which is a composite structure of metal and resin materials each having different hardness, tends to cause peeling of the resin material at the cut end surface a, and etching is difficult. This method has the disadvantage of forming a corroded area due to the penetration of electrolyte during the process.

(Means for Solving the Problems) Based on this background, the present invention provides a conventional hybrid integrated circuit board with a required number of wedge-shaped grooves (hereinafter referred to as grooves) and fills them with a resin material. This process will be explained in detail with reference to the drawings below.

(Embodiment) FIG. 1 is an explanatory diagram showing an embodiment of the present invention, and the same parts as in FIG. 2 are given the same numbers. In FIG. 1, 6 indicates a filled resin material, and C indicates a groove.

Before the etching process, grooves C are formed in the required number (determined from the IC chip size, etc.) of the substrate on the substrate mainly composed of the metal iron plate 11, the bolyamide plate 3, and the copper plate 4 using a press. The tip of this V FRC reaches into the metal iron plate 1 from the epoxy resin adhesive 2 that joins the metal iron plate 1 and the polyamide 3.

After filling the epoxy resin 6 into the groove C, the substrate is separated by cutting. The epoxy resin 6 does not necessarily have to form a complete groove inside the vII 4c, as long as both sides separated after cutting are sufficiently covered with the filler 6.

Due to this structure, it is possible to prevent the electrolytic solution from eroding the resin combination portion during etching. Furthermore, in order to reduce costs, it is important to handle large boards with a configuration that allows for the cutting of many pieces, and to proceed as far as possible to the later stages of the process. It was difficult to construct a multi-layer structure because it would cause scratches on the pattern part and damage to the mounted parts. However, with the substrate structure of the present invention, it is easy to handle the ViM processing and filling with the resin material, and manual cutting and separation such as snap-off is possible in the final process.

(Effects of the Invention) As explained above, with the board structure of the present invention, there is no damage over time due to breakage of the end face during cutting, and the handling of large boards with a plurality of board structures is possible at the final stage of the component mounting process, etc. This has the advantage that it is possible to provide a low-cost hybrid integrated circuit.

[Brief explanation of the drawing]

FIG. 1 is an explanatory sectional view of the structure of a circuit board of the present invention, and FIG. 2 is an explanatory sectional view of the structure of a conventional circuit board. DESCRIPTION OF SYMBOLS 1... Metal plate, 2... Adhesive layer, 3... Insulating board, 4... Copper conductive plate, 4'... Copper circuit pattern,
5... Chip capacitor, 6... Filling resin material, a.
...cut end surface, b...°-eroded part, C... groove part. Patent applicant: Japan Radio Co., Ltd.

Claims (1)

[Claims] In a hybrid integrated circuit board in which an insulator is bonded to a metal plate made of iron, aluminum or an alloy thereof, and a conductive plate forming a circuit pattern is bonded to the other surface of the insulator,
Before forming the circuit pattern, a required number of wedge-shaped grooves are provided on the conductive surface, the tips of the grooves are provided sufficiently to reach the joint between the metal plate and the insulator, and the grooves are filled with an insulating material. A hybrid integrated circuit board characterized by: