JPS63182571U - - Google Patents
Info
- Publication number
- JPS63182571U JPS63182571U JP7489387U JP7489387U JPS63182571U JP S63182571 U JPS63182571 U JP S63182571U JP 7489387 U JP7489387 U JP 7489387U JP 7489387 U JP7489387 U JP 7489387U JP S63182571 U JPS63182571 U JP S63182571U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- heat dissipation
- circuit board
- insulating layer
- based circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489387U JPS63182571U (US20030157376A1-20030821-M00001.png) | 1987-05-19 | 1987-05-19 | |
| US07/406,401 US4993148A (en) | 1987-05-19 | 1989-09-12 | Method of manufacturing a circuit board |
| US07/540,389 US5081562A (en) | 1987-05-19 | 1990-06-19 | Circuit board with high heat dissipations characteristic |
| US07/794,281 US5173844A (en) | 1987-05-19 | 1991-11-19 | Integrated circuit device having a metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489387U JPS63182571U (US20030157376A1-20030821-M00001.png) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182571U true JPS63182571U (US20030157376A1-20030821-M00001.png) | 1988-11-24 |
Family
ID=30920535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7489387U Pending JPS63182571U (US20030157376A1-20030821-M00001.png) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182571U (US20030157376A1-20030821-M00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069816A (ja) * | 2010-09-24 | 2012-04-05 | Ain:Kk | アルミニウム複合材を使用した配線板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4929456A (US20030157376A1-20030821-M00001.png) * | 1972-07-18 | 1974-03-15 | ||
| JPS4980569A (US20030157376A1-20030821-M00001.png) * | 1972-12-12 | 1974-08-03 | ||
| JPS5724597A (en) * | 1980-07-22 | 1982-02-09 | Tokyo Shibaura Electric Co | Circuit board |
-
1987
- 1987-05-19 JP JP7489387U patent/JPS63182571U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4929456A (US20030157376A1-20030821-M00001.png) * | 1972-07-18 | 1974-03-15 | ||
| JPS4980569A (US20030157376A1-20030821-M00001.png) * | 1972-12-12 | 1974-08-03 | ||
| JPS5724597A (en) * | 1980-07-22 | 1982-02-09 | Tokyo Shibaura Electric Co | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069816A (ja) * | 2010-09-24 | 2012-04-05 | Ain:Kk | アルミニウム複合材を使用した配線板 |
