JPS63182571U - - Google Patents

Info

Publication number
JPS63182571U
JPS63182571U JP7489387U JP7489387U JPS63182571U JP S63182571 U JPS63182571 U JP S63182571U JP 7489387 U JP7489387 U JP 7489387U JP 7489387 U JP7489387 U JP 7489387U JP S63182571 U JPS63182571 U JP S63182571U
Authority
JP
Japan
Prior art keywords
metal
heat dissipation
circuit board
insulating layer
based circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7489387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7489387U priority Critical patent/JPS63182571U/ja
Publication of JPS63182571U publication Critical patent/JPS63182571U/ja
Priority to US07/406,401 priority patent/US4993148A/en
Priority to US07/540,389 priority patent/US5081562A/en
Priority to US07/794,281 priority patent/US5173844A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP7489387U 1987-05-19 1987-05-19 Pending JPS63182571U (US06811534-20041102-M00003.png)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7489387U JPS63182571U (US06811534-20041102-M00003.png) 1987-05-19 1987-05-19
US07/406,401 US4993148A (en) 1987-05-19 1989-09-12 Method of manufacturing a circuit board
US07/540,389 US5081562A (en) 1987-05-19 1990-06-19 Circuit board with high heat dissipations characteristic
US07/794,281 US5173844A (en) 1987-05-19 1991-11-19 Integrated circuit device having a metal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7489387U JPS63182571U (US06811534-20041102-M00003.png) 1987-05-19 1987-05-19

Publications (1)

Publication Number Publication Date
JPS63182571U true JPS63182571U (US06811534-20041102-M00003.png) 1988-11-24

Family

ID=30920535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7489387U Pending JPS63182571U (US06811534-20041102-M00003.png) 1987-05-19 1987-05-19

Country Status (1)

Country Link
JP (1) JPS63182571U (US06811534-20041102-M00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012069816A (ja) * 2010-09-24 2012-04-05 Ain:Kk アルミニウム複合材を使用した配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929456A (US06811534-20041102-M00003.png) * 1972-07-18 1974-03-15
JPS4980569A (US06811534-20041102-M00003.png) * 1972-12-12 1974-08-03
JPS5724597A (en) * 1980-07-22 1982-02-09 Tokyo Shibaura Electric Co Circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929456A (US06811534-20041102-M00003.png) * 1972-07-18 1974-03-15
JPS4980569A (US06811534-20041102-M00003.png) * 1972-12-12 1974-08-03
JPS5724597A (en) * 1980-07-22 1982-02-09 Tokyo Shibaura Electric Co Circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012069816A (ja) * 2010-09-24 2012-04-05 Ain:Kk アルミニウム複合材を使用した配線板

Similar Documents

Publication Publication Date Title
JP2504486B2 (ja) 混成集積回路構造
JPS63182571U (US06811534-20041102-M00003.png)
JPS63182570U (US06811534-20041102-M00003.png)
JPS63182572U (US06811534-20041102-M00003.png)
JPH032699U (US06811534-20041102-M00003.png)
JPH0543488Y2 (US06811534-20041102-M00003.png)
JPH0379469U (US06811534-20041102-M00003.png)
JPS6138996U (ja) プリント基板の放熱構造
JPS614431U (ja) 両面配線回路基板
JPS5977243U (ja) 半導体装置
JPH0212875U (US06811534-20041102-M00003.png)
JPS61131870U (US06811534-20041102-M00003.png)
JPH01174940U (US06811534-20041102-M00003.png)
JPS6127271U (ja) プリント基板
JPS6355460U (US06811534-20041102-M00003.png)
JPS59127268U (ja) 混成集積回路装置
JPS6138954U (ja) 半導体装置
JPS6092828U (ja) 電子部品の実装構造
JPH0238743U (US06811534-20041102-M00003.png)
JPS63100872U (US06811534-20041102-M00003.png)
JPS6157555U (US06811534-20041102-M00003.png)
JPS5820560U (ja) プリント配線板
JPS6452274U (US06811534-20041102-M00003.png)
JPS6387889U (US06811534-20041102-M00003.png)
JP2000040763A (ja) Icパッケージ及びその製造方法