JPS63181347A - 感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法 - Google Patents

感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法

Info

Publication number
JPS63181347A
JPS63181347A JP62013035A JP1303587A JPS63181347A JP S63181347 A JPS63181347 A JP S63181347A JP 62013035 A JP62013035 A JP 62013035A JP 1303587 A JP1303587 A JP 1303587A JP S63181347 A JPS63181347 A JP S63181347A
Authority
JP
Japan
Prior art keywords
pressure
sensitive adhesive
dicing
sheet
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62013035A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312777B2 (enExample
Inventor
Hideo Kuroda
黒田　秀雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP62013035A priority Critical patent/JPS63181347A/ja
Priority to US07/108,202 priority patent/US4968559A/en
Publication of JPS63181347A publication Critical patent/JPS63181347A/ja
Publication of JPH0312777B2 publication Critical patent/JPH0312777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62013035A 1985-02-14 1987-01-21 感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法 Granted JPS63181347A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62013035A JPS63181347A (ja) 1987-01-21 1987-01-21 感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法
US07/108,202 US4968559A (en) 1985-02-14 1987-10-14 Pressure sensitive adhesive film with barrier layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62013035A JPS63181347A (ja) 1987-01-21 1987-01-21 感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法

Publications (2)

Publication Number Publication Date
JPS63181347A true JPS63181347A (ja) 1988-07-26
JPH0312777B2 JPH0312777B2 (enExample) 1991-02-21

Family

ID=11821866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62013035A Granted JPS63181347A (ja) 1985-02-14 1987-01-21 感圧接着性シ−ト及びこれを用いる半導体ウエハ−のダイシング方法

Country Status (1)

Country Link
JP (1) JPS63181347A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
WO1995012895A1 (en) * 1993-11-04 1995-05-11 Nitto Denko Corporation Process for producing semiconductor element and pressure-sensitive adhesive sheet for sticking wafer
SG83813A1 (en) * 1999-09-06 2001-10-16 Nitto Denko Corp Pressure-sensitive adhesive sheets for dicing
EP1312656A3 (en) * 2001-11-14 2004-02-04 Nitto Denko Corporation Surface-modified pressure-sensitive adhesive, method of modifying surface of pressure-sensitive adhesive and pressure-sensitive adhesive tape
JP2008045091A (ja) * 2006-08-21 2008-02-28 Nitto Denko Corp 加工用粘着シート

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
WO1995012895A1 (en) * 1993-11-04 1995-05-11 Nitto Denko Corporation Process for producing semiconductor element and pressure-sensitive adhesive sheet for sticking wafer
SG83813A1 (en) * 1999-09-06 2001-10-16 Nitto Denko Corp Pressure-sensitive adhesive sheets for dicing
EP1312656A3 (en) * 2001-11-14 2004-02-04 Nitto Denko Corporation Surface-modified pressure-sensitive adhesive, method of modifying surface of pressure-sensitive adhesive and pressure-sensitive adhesive tape
JP2008045091A (ja) * 2006-08-21 2008-02-28 Nitto Denko Corp 加工用粘着シート

Also Published As

Publication number Publication date
JPH0312777B2 (enExample) 1991-02-21

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