JPS63177502A - Manufacture of film resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing thick film resistors or similar film resistors for hybrid integrated circuits.

[Prior Art] A conventional thick film resistor is formed as shown in FIG. 3. When manufacturing this, first, a conductive paste such as silver palladium paste or copper base paste is printed on an alumina substrate 1, and then dried. The pair of electrode conductors 2.3 is then baked.
is formed together with other wiring conductors, and then a resistor base is printed on the substrate 1 and the electrode conductor 2.3 so as to connect this pair of electrode conductors 2.3, dried, and fired to form a thick film. After forming the resistor 4, an overcoat glass 85 is formed by printing, drying and baking overcoat glass, and then a laser beam is projected onto the overcoat glass film 5 to form an overcoat glass 85. The resistance value was adjusted by forming grooves 6 in the coated glass membrane and the thick film resistor 4.

[Problems to be Solved by the Invention] When the thick film resistor 4 is formed between the pair of electrode conductors 2.3 that are closely spaced from each other, the thick film resistor 4 is formed more on the substrate 1 than on the upper part of the electrode conductors 2.3. As a result, the amount of time required for trimming increased. Further, a resistor remained in the kerf 6, making the resistance value unstable. This kind of problem is caused by the electrode conductor 2.3 and the wiring connected to it. ! This problem occurred significantly when the conductor was formed using copper paste.

When using copper paste, to avoid oxidizing the copper, use a material that is difficult to sublimate, such as a lanthanum-boron resistor paste containing oxidized tank glass that can be fired in a nitrogen atmosphere after printing the resistor paste. This inevitably increased the time required to trim the resistor.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a film resistor that can shorten the time required for trimming.

[Means for Solving the Problems] The present invention for solving the above problems and achieving the above objects will be described with reference to the reference numerals in FIGS. 1 and 2 showing embodiments. An insulator [15 is formed between at least a portion of the pair of electrode conductors 12.13 on the electrode conductor 11, and then an insulator [15] is formed to cover at least a portion of the insulator film 15 and the pair of electrode conductors 12.13. The present invention relates to a method of manufacturing a film resistor, in which film resistors 18 are formed so as to be connected to each other, and then a region of the film resistor 18 above the insulator M15 is trimmed.

[Operations] The thickness of the film resistor 18 on the insulator JI 115 provided according to the present invention is thinner than that on the substrate 11. Therefore, the volume of the film resistor 18 sublimated by trimming is reduced, and the time required for trimming is shortened.

[Example] Next, a method for manufacturing a hybrid integrated circuit device according to an example of the present invention will be described based on FIGS. 1 and 2. First, a copper paste made of copper powder, glass powder, etc. is printed on an alumina substrate 11, dried at 120°C for 10 minutes, and fired at 850°C in a N2 atmosphere to form a pair of electrode conductors 12 with a thickness of about 14 μm. .13 and the lower wiring conductor 14 are formed.

Next, a crystallized glass paste is printed on the area to be trimmed and the cross wiring area on the substrate 11, and
After drying for 0 minutes, the insulator film 15 and crossover glass film 16 are formed by baking at 850° C. in a N2 atmosphere. The insulating film 15 is formed between the pair of electrode conductors 12.13 so as to have a film thickness of approximately 14 μm, which is approximately the same as that of the pair of electrode conductors 12.13.

Next, a conductive paste is printed so as to pass through the crossover glass film 16, dried, and fired to form the upper wiring conductor 17.

Next, a 100Ω resistor was applied on the pair of electrode conductors 12.13 and the insulator film 15, and on the substrate 11 connecting the pair of electrode conductors 12.13.
/ A lanthanum-boron based resistor paste containing tantalum oxide glass was printed, dried at 120°C for 10 minutes, and baked at 850°C in an N2 atmosphere to form a film with a thickness of 21 μm and a vertical width of 1.5 μm.
Then, a thick film resistor 18 having a width of 3.4 mm is formed.

Next, an overcoat glass paste is printed on at least the resistor 18, dried at 120°C for 10 minutes, and baked at 530°C in an N2 atmosphere to form a protective film 19 with a thickness of about 10 μm.
form.

As a result, the resistance value between the pair of electrode conductors 12 and 13 is 23
It becomes 0Ω to 260Ω. Target resistance value is 370Ω±1%
Therefore, using a laser trimming device, a laser beam is applied to the thick film resistor 18 on the insulating film 15 to cut the protective film 1.
9 to form a kerf 20 and achieve the desired resistance value. Laser trimming was performed with a beam diameter of 50 μm, average power of 1.2 W, pulse frequency of 3 KHz, and trimming speed of 15 ffilI/Sec. As a result, ±1
It is not possible to adjust aII for a resistance value of % or more.

On the other hand, in the conventional example shown in FIG.
When laser trimming toward 0Ω, the beam diameter is 50 μm, the average output is 1.6 W, the pulse frequency is IKHz, and the speed is 5 views/sec.
When the trimming speed was significantly increased above Sec, the resistor remained in the kerf 6. Further, in the case of the conventional example, the variation in resistance value occurred by about 12% to +5%, which was larger than that of the present example. As is clear from the above comparison, the method according to the present invention makes it possible to increase the trimming speed and significantly shorten the working time. Note that the trimming speed (15+ml/SeC) in this example is approximately equal to the trimming speed of the RuO-based resistor. Therefore, inert (
N2) Even if the resistor 18 is a lanthanum-boron-based resistor paste containing tantalum oxide glass that can be fired in an atmosphere and is difficult to sublime based on the resistor paste, the conventional Ru
It can be trimmed in the same way as OZ-based resistors.

The embodiment has the following advantages.

(1) The film thickness of the resistor 18 in the trimming part is 44 mm thicker than before.
Since the size is reduced by about 0 to 50%, the volume of the resistor to be sublimated is reduced, and high-speed and highly accurate trimming becomes possible.

(2) Since the insulating film 15 is formed at the same time as the crossover glass film 16, the number of steps does not increase.

[Modifications] The present invention is not limited to the above-described embodiments, but can be modified. For example, the insulating film 15 may be provided entirely between the pair of electrode conductors 12.13. In addition, before forming the protective film 19, the resistor 18 is roughly trimmed,
Fine adjustment trimming may be performed after forming the protective film 19.

[Effects of the Invention] As is clear from the above, the present invention enables high-speed and highly accurate trimming of resistors.

[Brief explanation of the drawing]

1 is a sectional view taken along the line II in FIG. 2 showing a part of a hybrid integrated circuit according to an embodiment of the present invention; FIG. 2 is a plan view showing the hybrid integrated circuit in FIG. 1; The figure is a sectional view showing a conventional hybrid integrated circuit. 11... Substrate 12... Electrode conductor 13... Electrode conductor 14... Wiring conductor 15... Insulator film 16... Crossover glass film 17... Wiring conductor 18... Resistor 19...protective glass

Claims (1)

[Claims] (1) Pair of electrode conductors (12) (1) on an insulating substrate (11)
3), an insulating film (15
), and then forming a film resistor (18) so as to cover at least a portion of the insulating film (15) and interconnect the pair of electrode conductors (12) and (13), After that, the insulator film (15) in the film resistor (18) is
) A method for manufacturing a film resistor, comprising trimming the area above the film.