JPS6317275Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic device mounted with a large number of circuit boards and having a temperature sensor, a wind speed sensor, etc.

FIG. 3 is a side view showing the structure of a conventional electronic device.

Normally, in this type of electronic device 1, in order to detect the wind speed based on the temperature of the cooling air flow 3 flowing in the cooling layer 4 between the circuit boards 2, as shown in FIG. A sensor 5 such as a temperature sensor or a wind speed sensor is provided at a position a predetermined distance L from the substrate end surface 2a on the downstream side of the cooling air flow 3, but conventionally, no partition is provided between the sensors 5. As a result, the cooling air flows 3 from adjacent cooling layers 4 interfere with each other when exiting the substrate end surface 2a, making it impossible to accurately detect the temperature, wind speed, etc. of each cooling layer 4. Furthermore, if the distance L is shortened in order to prevent the interference of the airflow 3 between adjacent cooling layers 4, the sensor 5 will cause turbulence in the airflow 3 in the layer 4, and the substrate There was a problem in that it was difficult to uniformly cool the electronic components 6 mounted on the electronic components 2.

In view of this, the present invention has been proposed by stacking a plurality of circuit boards on which electronic components are mounted at predetermined intervals to form a cooling layer, and by circulating a cooling air flow through the cooling layer, cooling air is generated from the electronic components. In an electronic device that absorbs heat, downstream of the electronic component,
A partition plate that is arranged opposite to and parallel to the plurality of circuit boards and has a sensor attached at a position facing the electronic component, and the partition plate is connected to each other and is arranged perpendicularly to the partition plate. It is an object of the present invention to provide an electronic device in which the above-mentioned drawbacks are eliminated by forming a sensor mounting frame composed of a duct.

Hereinafter, the present invention will be specifically explained based on embodiments shown in the drawings.

FIG. 1 is a perspective view showing an example of an electronic device to which the present invention is applied, and FIG. 2 is a side view showing an example of a sensor mounting structure according to the present invention.

As shown in FIGS. 1 and 2, the electronic device 1 has a casing 7, in which a plurality of circuit boards 2 on which electronic components 6 are mounted form a cooling layer 4. implemented at regular intervals. A sensor mounting frame 9 is provided in front of the housing 7 in the figure, that is, on the downstream side of the cooling air flow 3, and a duct 9b is provided in the frame 9 so as to be continuous with each cooling layer 4. The duct 9b is formed from a partition plate 9a provided to face the circuit board 2, and on the partition plate 9a in each duct 9b, a temperature sensor and a wind speed sensor are installed corresponding to each cooling layer 4. A sensor 5 such as the above is attached via a support stand 10.

Since the present invention has the above-described configuration, the cooling air flow 3 flows from the right side to the left side in FIG. absorb. The airflow 3 that has absorbed heat from the component 6 flows from the cooling layer 4 into the duct 9b continuous to each cooling layer 4 of the sensor mounting frame 9, and the sensor 5 detects its temperature, wind speed, etc. At this time, since the partition plate 9a of the duct 9b is provided to face each circuit board 2, the air flow 3 flowing through each cooling layer 4 flows into the duct 9b without interfering with each other, and the sensor 5 detects the temperature, etc.

As explained above, according to the present invention, on the downstream side of the cooling air flow 3, facing the plurality of circuit boards 2,
a partition plate 9a that is arranged in parallel and has a sensor 5 attached at a position facing the electronic component 6;
Since the sensor mounting frame 9 is formed of a duct 9b that connects the partition plates 9a to each other and is arranged perpendicularly to the partition plate 9a, the cooling air flows 3 flowing through each cooling layer 4 do not interfere with each other. flows into the duct 9b without any
can accurately measure the temperature, wind speed, etc. of each cooling layer 4. In addition, the sensor 5
Since the distance L can be long enough to not disturb the air flow 3, it is possible to uniformly cool the electronic components 6 on the board 2.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of an electronic device to which the present invention is applied, FIG. 2 is a side view showing an example of a sensor mounting structure according to the present invention, and FIG. 3 is a diagram showing the structure of a conventional electronic device. FIG. 1...Electronic device, 2...Circuit board, 3...Cooling air flow, 4...Cooling layer, 5...Sensor, 6...
Electronic parts, 9b...Duct.

Claims (1)

[Claims for Utility Model Registration] A plurality of circuit boards 2 carrying electronic components 6 are stacked at predetermined intervals to form a cooling layer 4, and a cooling air flow is caused to flow through the cooling layer 4. In the electronic device that absorbs heat generated from the electronic component 6, the electronic component 6 is provided with: a circuit board located downstream of the electronic component 6, facing and parallel to the plurality of circuit boards 2, and at a position facing the electronic component 6; An electronic device characterized by forming a sensor mounting frame 9 consisting of a partition plate 9a to which a sensor 5 is attached, and a duct 9b connecting the partition plates 9a to each other and disposed perpendicularly to the partition plate 9a. Device.