JPS63170453A - Melamine resin molding compound - Google Patents
Melamine resin molding compoundInfo
- Publication number
- JPS63170453A JPS63170453A JP119787A JP119787A JPS63170453A JP S63170453 A JPS63170453 A JP S63170453A JP 119787 A JP119787 A JP 119787A JP 119787 A JP119787 A JP 119787A JP S63170453 A JPS63170453 A JP S63170453A
- Authority
- JP
- Japan
- Prior art keywords
- melamine resin
- resin molding
- parts
- polyethylene terephthalate
- molding compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000877 Melamine resin Polymers 0.000 title claims abstract description 28
- 239000004640 Melamine resin Substances 0.000 title claims abstract description 25
- 238000000465 moulding Methods 0.000 title abstract description 5
- 150000001875 compounds Chemical class 0.000 title abstract 3
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 239000003086 colorant Substances 0.000 claims abstract description 4
- 239000012778 molding material Substances 0.000 claims description 13
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 abstract 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は配線器具、電気器具、厨房器具等に用いられる
メラミン樹脂成形材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a melamine resin molding material used for wiring appliances, electrical appliances, kitchen appliances, etc.
従来、メラミン樹脂成形材料はその優れた耐アーク性、
耐トラツキング性、電気絶縁性、耐燃性、着色性、表面
硬度、＃溶剤性等によｒｔ＊器具、配線！Ｉ具等に広く
使用されているが靭性に乏しいため金ｌｉ１部品をイン
サート成形する時中成形品を力Ｖメ作業する時にり２ツ
クが発生しやすい欠点があった。Conventionally, melamine resin molding materials have excellent arc resistance,
Tracking resistance, electrical insulation, flame resistance, coloring, surface hardness, #solvent properties, etc. for rt* equipment, wiring! Although it is widely used for I tools, etc., it has the disadvantage that it is prone to double cracks when insert molding gold li parts and applying force to the molded product due to its poor toughness.
本発明の目的とするところは、靭性の付与され九メツミ
ン樹脂成形材料を提供することにある。An object of the present invention is to provide a nine-mettumine resin molding material that is imparted with toughness.
本発明はメラミン樹脂に充填剤、硬化剤、離型剤、着色
剤等を添加してなるメラミン樹脂成形材料において、ポ
リエチレンテレフタレートを添加したことを特徴とする
メラミン樹脂成形材料のため、靭性の付与されたメラミ
ン樹脂成形材料を得ることができたもので、以下本発明
の詳細な説明する。The present invention is a melamine resin molding material made by adding a filler, a curing agent, a mold release agent, a coloring agent, etc. to a melamine resin, and the melamine resin molding material is characterized by adding polyethylene terephthalate, which imparts toughness. The present invention will now be described in detail.
本発明に用いるポリエチレンテレフタレートとしては好
ましくは分子量８０００〜１５００００のものを用いる
ことが望ましい、即ち分子量が８０００宋満で祉靭性の
向上が少なく、１５０００Ｇをζえると 成形性が低下
する傾向にあるからである。ポリエチレンテレフタレー
トの添加量は特に限定するものでなく任意である。ポリ
エチレンテレフタレートの添加時期はメラミン樹脂合成
時或はメラミン樹脂と充填剤等を混合する時に添加して
もよく任意でアル。なおポリエチレンテレフタレートは
微粉砕形状で用いることがより分散性がよくなシ好まし
いことである。メラミン樹脂としてはメラミン樹脂、グ
アナミン樹脂等の単独、混合物、変性物を用いることが
できる。充填剤、硬化剤、離型剤、着色剤等については
メラミン樹脂成形材料に用いられるものをそのまま用い
ることができる。As the polyethylene terephthalate used in the present invention, it is preferable to use one with a molecular weight of 8,000 to 150,000; that is, when the molecular weight is 8,000 G, there is little improvement in toughness, and when the molecular weight exceeds 15,000 G, the moldability tends to decrease. It is. The amount of polyethylene terephthalate added is not particularly limited and is arbitrary. Polyethylene terephthalate may be added at any time during melamine resin synthesis or when mixing melamine resin and filler. Note that it is preferable to use polyethylene terephthalate in a finely pulverized form because it has better dispersibility. As the melamine resin, melamine resin, guanamine resin, etc. may be used alone, as a mixture, or as a modified product. As for fillers, curing agents, mold release agents, coloring agents, etc., those used in melamine resin molding materials can be used as they are.
以下本発明ｆ、実施例にもとづいて説明する。The present invention f will be described below based on examples.
実施例１
メラミン樹脂μに対しホ〜ムアμデヒド１．６モ〜を３
７％ホ〃マリンで加え、ＰＨ７に調整してから還流温度
で田分間反応させた後、分子量８０００ のポリエチ
レンテレフタレートをメラミン［ＪｉｌＯＯ重量部Ｃ以
置部に部と記す）に対し１０部添加し、更に１０分間反
応させて樹脂量の重量％（以下単に％と記す）のメラミ
ン樹脂ワニスを得、次に該樹脂ワニス２００部にバ〃グ
ｌＯＯ部を加えグレンダーで刀分間混合後、加熱乾燥し
てメラミン樹脂含浸バ〃プを得た。次に該樹脂含浸パル
１２００部に対しフタ〃酸０．５部、ステアリン酸亜鉛
２部、酸化チタン３部を加えボールミμで稔時間混合、
粉砕、着色してメラミン樹脂成形材料ｔ−得た。Example 1 1.6 mos of foam μ dehyde was added to 3 mos of melamine resin μ.
After adding 7% homarin and adjusting the pH to 7, reacting with Tamaki at reflux temperature, 10 parts of polyethylene terephthalate with a molecular weight of 8000 was added to melamine (parts by weight of JilOO, expressed as parts in place of C). The reaction was further carried out for 10 minutes to obtain a melamine resin varnish with a weight percent (hereinafter simply referred to as %) of the resin amount.Next, 100 parts of baggage was added to 200 parts of the resin varnish, mixed for a minute with a grinder, and then heated and dried. A melamine resin-impregnated bap was obtained. Next, 0.5 parts of phthalic acid, 2 parts of zinc stearate, and 3 parts of titanium oxide were added to 1200 parts of the resin-impregnated pulp, and the mixture was mixed using a ball mill μ.
It was crushed and colored to obtain a melamine resin molding material T-.
実施例２
メラミンＩＪｅｌｖに対しホμムアμデヒド１．６モμ
ヲ３７％ホμマリンで加え、ＰＨ７に調整してから還流
温度で鉛分間に応させた後、脱水し固形状メラミン樹脂
を得た０次に該メラミン樹脂１００部に対しバμプ１０
０部、無水フタ〃酸０．５部、ステアリン酸亜鉛２部、
酸化チタン３部、分子量１５００００のポリエチレンテ
レフタレートお部を加えプレンダーでお分間混合後、粉
砕してメラミン樹脂成形材料を得た。Example 2 1.6 moμ of homamdehyde for melamine IJelv
After adding 37% μmarine and adjusting the pH to 7, it was allowed to react with lead at reflux temperature, and then dehydrated to obtain a solid melamine resin.
0 parts, 0.5 parts of phthalic anhydride, 2 parts of zinc stearate,
Three parts of titanium oxide and one part of polyethylene terephthalate having a molecular weight of 150,000 were added, mixed for a minute in a blender, and then ground to obtain a melamine resin molding material.
比較例
実施例２と同じメラミン樹脂１００部に対し、バ〃デ１
００部、フタμ酸０．５部、ステアリン酸亜鉛２部、酸
化チタン３部を加えプレンダーでＩ分間混合後、粉砕し
てメラミン樹脂成形材料を得た。Comparative Example For 100 parts of the same melamine resin as in Example 2, 1 part of bade was added.
00 parts of phthalic acid, 0.5 parts of phthalic acid, 2 parts of zinc stearate, and 3 parts of titanium oxide were added, mixed for 1 minute in a blender, and then pulverized to obtain a melamine resin molding material.
実施例１と２及び比較例のメラミン樹脂成形材料を加熱
加圧成形して得た成形品の性能はｆｉｔ表で明白なよう
に本発明のものの性能はよく、本発、明のメラミン樹脂
成形材料の優れていることを確認した。As is clear from the fit table, the performance of the molded products obtained by heat-pressing molding of the melamine resin molding materials of Examples 1 and 2 and the comparative example is good, and the performance of the molded products of the present invention is good. Confirmed that the material is excellent.
第 １ 表Chapter 1 Table
Claims (2)
等を添加してなるメラミン樹脂成形材料において、ポリ
エチレンテレフタレートを添加したことを特徴とするメ
ラミン樹脂成形材料。(1) A melamine resin molding material made by adding a filler, a curing agent, a mold release agent, a coloring agent, etc. to a melamine resin, which is characterized by adding polyethylene terephthalate.
〜１５００００であることを特徴とする特許請求の範囲
第１項記載のメラミン樹脂成形材料。(2) The molecular weight of polyethylene terephthalate is 8000
The melamine resin molding material according to claim 1, wherein the melamine resin molding material has a molecular weight of 150,000 to 150,000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP119787A JPS63170453A (en) | 1987-01-07 | 1987-01-07 | Melamine resin molding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP119787A JPS63170453A (en) | 1987-01-07 | 1987-01-07 | Melamine resin molding compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170453A true JPS63170453A (en) | 1988-07-14 |
Family
ID=11494729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP119787A Pending JPS63170453A (en) | 1987-01-07 | 1987-01-07 | Melamine resin molding compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170453A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195762A (en) * | 1989-12-25 | 1991-08-27 | Matsushita Electric Works Ltd | Melamine resin molding material |
-
1987
- 1987-01-07 JP JP119787A patent/JPS63170453A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195762A (en) * | 1989-12-25 | 1991-08-27 | Matsushita Electric Works Ltd | Melamine resin molding material |
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