JPS5823853A - Molding material of thermosetting resin - Google Patents

Abstract

PURPOSE:The titled material capable of reducing extremely a shrinkage factor during molding, a shrinkage factor and water absorption of a molded article, obtained by adding an inorganic hollow material to a thermosetting resin. CONSTITUTION:A thermosetting resin preferably a phenol resin or an amino resin is blended with an inorganic hollow material such as glass ballon, silas ballon, fly ash balloon, etc. The amount of the hollow material added is 10- 60wt%, preferably 20-50wt% based on the total amount of the molding material.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermosetting resin molding material IC used for wiring, electrical appliances, industrial goods, household goods, etc. The objective is to reduce the shrinkage of the molded product and the water absorption of the molded product.

Conventional thermosetting resin molding materials use wood flour, pulp, calcium carbonate, etc. as the main filler. Wiring equipment with high molded product shrinkage rate and molded product water absorption rate,
It has the disadvantage that it cannot be used for precision applications, high-end applications, etc., because it is used for electrical appliance odor, industrial supplies, household goods, etc.

The present invention solves the above-mentioned drawbacks by significantly reducing the molding time contraction rate, molded product shrinkage rate, and molded product water absorption rate by adding an inorganic hollow body.

Next, the present invention will be explained in detail. Thermosetting resins used in the present invention include phenolic resin, area resin, melamine resin, phenol-#f-based metsumin It 81, -4KV resin, unsaturated polyester resin, KVVN resin, and imide resin. Among thermosetting resins in general, To number is preferably used, preferably amino resins such as phenol-ustgit and urea resins, metsuden resins, phenol-modified melamine resins, and daanamine resins. As an inorganic hollow body, a glass balloon, v′
In general, the amount of inorganic hollow bodies such as plus runes, pearlite balloons, normal V-evers, Vl-covers, etc. is not limited to *icia*, but preferably the amount of molding material metal. It is desirable that the Io~60 weight or less (simply written as 'excellent') tL < If it is preferable in the summer, it is preferable to add a blanket to the weight, that is, the shrinkage rate and water absorption rate should be less than 10. This is because there is a tendency for the reduction effect to become smaller, and as the shaft thickness increases, the strength of the molded product decreases. Additives other than resins and inorganic hollow bodies include hardeners commonly used in thermosetting resin molding materials, fillers such as wood flour and calcium carbonate, stearic acid, and wax.
Colorants, car pump hooks, iron oxide, etc.
These thermosetting resins, inorganic hollow bodies, curing agents,
A thermosetting resin molding material is obtained by mixing, kneading, pulverizing, and, if necessary, granulating a filler, a release agent, and a coloring agent.

At this time, it is important not to destroy the inorganic hollow body.

The present invention will be explained below using Example 4.

Examples 1 to 1 1 mole of phenol to 16sty
After addition of 1% formalin, the mixture was reacted under acidic conditions using a diluted acid rope, and then dehydrated and boiled down to obtain a Noltsuk-type Hue/-pv tree with a melting point of 9°C. Using this phenolic resin, mix it according to the recipe in Table 1, knead it with a roll, and then crush it.
C phenol ~ Obtain resin molding material.

l/Ii1 table! l! Example Reef and 6 Resin molding materials were obtained using Lily 1tII11 with a residual water content W excellent and melamine resin in Formulation Table 8 of Table 2 (thus, after heating, kneading, and pulverizing).

Table 2 Hata Conventional Examples 1 to 8 Conventional Example 1 is the one in which the V-rasp balloons in Example 4 are replaced with wood flour, and Conventional Example 8 is the one in which the shirasu balloons in Example 4 are replaced with pulp. A conventional example Hatake was prepared by replacing the v'9 sprunes of Example 6 with pulp.

The thermosetting resin molding materials of Examples 1 to 8 and Conventional Examples 1 to 8 were test-sprayed, and as is clear from Table 8, the thermosetting resin molding materials of the present invention had a higher molding shrinkage rate and molding properties. Product shrinkage rate,
It was confirmed that the water absorption rate of the molded products was small in each case, and that the thermosetting resin molding material according to the present invention was excellent.

Table 8 patent applicant Matsushita Electric Works Co., Ltd. Daisanjin Bensanshi Toshimaru Take Moto (2 others)

Claims (1)

[Claims] ti) A thermosetting resin molding material characterized by adding an inorganic hollow body. (Snow) - Thermosetting resin acid y# material according to claim 1, characterized in that the amount of inorganic hollow bodies is 10 to 60% by weight of the total amount, -C Thermosetting resin is a 7-enol resin.
S The thermosetting resin molding material of the first and second claims, the thermosetting resin molding material of the claims imjgt and the second claim, characterized in that the thermosetting resin is an amino resin. .