JP3407760B2 - Phenolic resin molding materials - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material which is excellent in the smoothness of the surface of a molded product even after being left for a long time in a normal condition and a high humidity atmosphere.

[0002]

2. Description of the Related Art Phenolic resin molding materials are used in various fields, but in the fields of kitchens and lacquerware substrates, the surface of the molded product after normal conditions and after treatment in a high humidity atmosphere is affected by the usage environment of the molded product. A smoothness of is particularly required. Therefore, conventionally, the amount of the inorganic base material is increased, but the smoothness in the normal state is improved, but the smoothness after the high humidity atmosphere treatment is not improved, and the specific gravity is heavy. The current situation is that there are problems such as

[0003]

The object of the present invention is to provide a phenol having excellent smoothness of the surface of a molded article after being treated in a normal condition or in a high humidity atmosphere by blending an organic base material having a specific particle size. To provide a resin molding material.

[0004]

The present invention is a phenolic resin molding material comprising 100 parts by weight of a phenolic resin and 60 to 100 parts by weight of an organic base material (a), wherein the organic base material (a) is The grain size is composed of chaff powder of 200 mesh or less and the laminated sheet powder and / or plywood powder of grain size of 150 mesh or less, and the mixing ratio thereof is 30 to 90 parts by weight based on 100 parts by weight of the organic base material. It is a characteristic phenol resin molding material.

In the present invention, it is preferable that the organic base material chaff powder has a fine particle size of 200 mesh or less.
If the particle size is 200 mesh or more, the desired smoothness of the surface of the molded product cannot be obtained. Further, the blending amount is preferably 30 to 90 parts by weight with respect to 100 parts by weight of the organic base material. When the amount is 30 parts by weight or less, the smoothness of the molded product after the normal condition and the high humidity atmosphere treatment is not sufficiently improved. When it is 90 parts by weight or more, the fluidity of the molding material is deteriorated, resulting in a problem in moldability. A particularly preferred range is 50 to 80 parts by weight. Regarding the organic base material to be blended in combination with the chaff powder, it is preferably a laminated plate powder and / or plywood powder having a particle size of 150 mesh or less, and is not particularly limited,
Pulp having a particle size of 150 mesh or less, crushed cloth, coconut shell, walnut powder, olive powder, coffee powder and the like may be blended.

In the phenol resin molding material of the present invention, an inorganic base material is used in an amount of 3 to 1 per 100 parts by weight of the phenol resin for the purpose of improving mechanical strength, heat resistance and adjusting specific gravity.
0 parts by weight can be blended. As an inorganic base material,
One or more selected from clay, diatomaceous earth, calcium carbonate and glass fiber are preferably used. If the blending amount is 3 parts by weight or less, the blending effect is small, and if the blending amount is 10 parts by weight or more, the specific gravity becomes too large and the surface smoothness may be impaired. The method of forming a molding material is such that the above-mentioned phenol resin, the organic base material (a), the inorganic base material (b), a blended product of additives, etc. is heated and melted and kneaded by using a roll, a cokneader, an extruder or the like, A method of pelletizing or cooling and pulverizing is generally used. The phenol resin molding material obtained as described above is molded by a usual molding method such as injection molding or compression molding.

[0007]

The phenol resin molding material of the present invention contains, as the organic base material (a), fluffy powder having a particle size of 200 mesh or less and laminated plate powder and / or plywood powder having a particle size of 150 mesh or less. By blending the organic base material (a) having these fine particle sizes, when the phenol resin, the organic base material (a), the inorganic base material (b), the additive and the like are blended, the dispersibility of the blended product is improved. Further, the organic base material (a) has a good impregnation property with the phenol resin, and the fine particle size further enhances the impregnation property. These characteristics improve the smoothness of the surface of the molded product. Further, even when treated in a high-humidity atmosphere, the phenolic resin has sufficiently penetrated into the organic base material (a), and there is no organic base material (a) not impregnated with the phenolic resin. Swelling of (a) does not occur. Therefore, the smoothness of the surface of the molded product after the high humidity atmosphere treatment is significantly improved as compared with the conventional one.

[0008]

EXAMPLES The raw materials shown in Table 1 were heat-kneaded with a mixing roll in a predetermined composition and pulverized to produce a molding material. The bending strength, the water absorption rate, and the smoothness of the surface of the molded product (normal state and after treatment at 50 ° C., 95% for 240 hours) were measured for the obtained molding material, and the results are shown in the lower column of Table 1. .

[0009]

[Table 1]

[Measuring Method] (1) Bending Strength and Water Absorption: Measured according to JIS K 6911. (2) Smoothness of molded product surface: Measured using a surface roughness meter.

[0011]

EFFECT OF THE INVENTION The phenol resin molding material of the present invention is used in a high humidity environment such as a kitchen or a lacquer ware base because it has excellent surface smoothness when molded into a molded product in a normal state or after a high humidity atmosphere treatment. It is particularly suitable for molded articles and is suitable as an industrial phenol resin molding material.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI // (C08L 61/06 C08L 97:02 97:02) (56) References JP-A-62-295945 (JP, A) Special features Kai 57-78444 (JP, A) JP 61-152761 (JP, A) JP 63-146957 (JP, A) JP 57-8020 (JP, A) JP 6-93170 ( JP, A) JP 6-49323 (JP, A) JP 57-78449 (JP, A) JP 57-10638 (JP, A) JP 59-105049 (JP, A) JP 55-106257 (JP, A) JP-A 56-5846 (JP, A) JP-B 46-32504 (JP, B1) Patent 2930819 (JP, B2) Patent 2930818 (JP, B2) (58) Field (Int.Cl. ⁷ , DB name) C08L 61/04-61/16 WPI / L (QUESTEL)

Claims (2)

(57) [Claims] 1. A phenolic resin molding material comprising 100 to 100 parts by weight of a phenolic resin and 60 to 100 parts by weight of an organic base material, wherein the organic base material (a) has a grain size of 200 mesh or less and a grain size. Is a laminated plate powder and / or a plywood powder having a mesh of 150 mesh or less, and the mixing ratio thereof is 30 to 90 based on 100 parts by weight of the organic base material.
A phenol resin molding material characterized by being parts by weight. 2. 3 to 10 parts by weight of one or more kinds of inorganic base materials selected from clay, diatomaceous earth, calcium carbonate and glass fiber are further mixed with 100 parts by weight of a phenol resin. The phenol resin molding material according to claim 1.