JPH09291194A - Phenol resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a phenolic resin composition for electrical and electronic components, having excellent heat resistance,. arc resistance and tracking resistance as well as unimpaired moldability and a molding material. SOLUTION: This invention provides phenolic resin molding material containing 25-50wt.% phenolic resin 20-50wt.% of which is modified with an unsaturated acid and a filler components comprising 20-40wt.% filler which releases the water of crystallization at 200 deg.C or above or containing 25-50wt.% phenolic resin 20-50wt.% of which is modified with an unsaturated acid and a filler component which comprises 20-40wt.% filler which releases the water of crystallization at 200 deg.C or above and in which at least one filler releases at least 20wt.%, based on the weight of the filler, water of crystallization at 200-500 deg.C.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a phenolic resin composition having excellent tracking resistance and a molding material using the same.

[0002]

2. Description of the Related Art Phenolic resin molding materials are excellent in heat resistance, dimensional stability, moldability and the like, and have been used for a long time in basic industrial fields such as automobiles, electricity and electronics. Especially,
Recently, demands for reliability of products have become severe, and electric performances such as arc resistance and tracking resistance have been required.

Usually, for parts requiring electrical performance, resins having excellent electrical properties such as unsaturated polyester, diallyl phthalate, melamine and melamine phenol are often used, but heat resistance, moldability, cost, etc. From the point of view, the excellent heat resistance and flame resistance of phenol resin molding materials,
It is desired to impart tracking resistance while maintaining moldability.

[0004]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of various studies in order to solve such problems of the conventional phenol resin composition or phenol resin molding material, and its object is to achieve the object. Is to provide a phenol resin composition and a molding material having excellent tracking resistance without deteriorating molding processability.

[0005]

The present invention comprises 25 to 50 wt% of a phenol resin characterized in that 20 to 50 wt% of the phenol resin is modified with an unsaturated acid,
As a filler, a phenol resin molding material containing 20 to 40 wt% of a filler that releases crystal water at 200 ° C. or higher, or 20 to 50 wt in the phenol resin.
% Of the phenolic resin modified with an unsaturated acid is contained in an amount of 25 to 50 wt%, and as a filler, 20 to 40 wt% of a filler that releases crystal water at 200 ° C. or higher is included, and at least one or more of them is included. Is 200
20 wt% to the weight of filler at ℃ to 500 ℃
The present invention relates to a phenol resin molding material which is characterized by releasing not less than 100% of water of crystallization.

2 in phenol resin used here
The phenolic resin characterized in that 0 to 50 wt% is modified with an unsaturated acid is not particularly limited as the unsaturated acid to be modified, but those having good compatibility with the phenolic resin such as tall oil and cashew oil are more preferable. desirable. The modification rate is 20 to 50 wt% in the resin, and more preferably 30 to
40 wt% is desirable. If the modification ratio is low, the tracking resistance cannot be sufficiently improved, and if it is too high, the tracking resistance is imparted, but the characteristics of the phenol resin such as heat resistance and moldability are impaired.

As the filler used as a filler and releasing crystal water at 200 ° C. or higher, aluminum hydroxide, magnesium hydroxide, zinc borate, calcium borate,
Examples include sepiolite. As the filler that releases crystal water at 200 ° C. or higher and 500 ° C. or lower, at least one filler that releases 20 wt% or more of crystal water at 200 ° C. or higher and 500 ° C. or lower relative to the weight of the filler is used. These include magnesium hydroxide, aluminum hydroxide and calcium borate. The addition amount is preferably 20 to 40 wt%, and if it is less than this, heat resistance and tracking resistance are deteriorated, and if it is more than this, the fluidity of the material is poor, and good moldability as a phenol resin molding material cannot be exhibited. is there.

The molding material obtained from the phenol resin composition of the present invention is suitable for electric and electronic parts which are required to have heat resistance, arc resistance and tracking resistance.

The phenol resin molding material of the present invention contains, in addition to these compounding compositions, pigments, mold release agents, fillers such as pulp and crushed cloth, curing accelerators, etc. which are used in ordinary phenol resin molding materials. It is manufactured by uniformly mixing these raw materials, heating and kneading them with a kneader such as a roll, a co-kneader, or a twin-screw extruder, and then pulverizing.

[0016]

EXAMPLE A molding material was obtained by heating and kneading with a usual two-roll mill in the composition shown in the examples and comparative examples in the upper column of Table 1. The characteristics of the molded article were measured for these molding materials, and the results shown in the lower column of Table 1 were obtained.

[0017]

[Table 1]

[0018]

EFFECT OF THE INVENTION The phenol resin composition or the phenol resin molding material of the present invention is suitable for electric and electronic parts in which molded articles obtained from these are excellent in heat resistance, arc resistance and tracking resistance. It is suitable.

Claims (2)

[Claims] 1. A phenolic resin, characterized in that 20 to 50 wt% of the phenolic resin is modified with an unsaturated acid, is contained in an amount of 25 to 50 wt%, and a filler that releases crystallization water at 200 ° C. or higher is used as a filler. A phenol resin molding material characterized by containing ˜40 wt%. 2. A phenolic resin, characterized in that 20 to 50 wt% of the phenolic resin is modified with an unsaturated acid, is contained in an amount of 25 to 50 wt%, and 20 fillers that release crystallization water at 200 ° C. or higher are used as fillers. -40% by weight, of which at least one filler releases 200% or more and 500% or less of water of crystallization in an amount of 20% by weight or more based on the weight of the filler.