JPH1095894A - Phenolic resin molding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which can give a molding having excellent moisture resistance, heat resistance and electrical properties, high strengths and excellent flame retardancy. SOLUTION: This material contains a resin component based on a resol phenolic resin, a filler component comprising the three components of a glass fiber, an organic fiber and a vinyl acetate resin and a flame retardant being a phosphorus flame retardant. The resol phenolic resin is desirably a dimethylene ether type resol resin or a combination of dimethylene ether-type resol resin with a methylol-type resol resin, and it is desirable that the filler component comprises 70-140 pts.wt. glass fiber, 5-25 pts.wt. organic fiber and 5-25 pts.wt. vinyl acetate resin per 100 pts.wt. resin component. It is desirable that the flame retardant being a phosphorus flame retardant is a mixture comprising red phosphorus, aluminum hydroxide and a phenolic resin and that the phosphorus flame retardant is used in an amount of 2-10 pts.wt. per 100 pts.wt. resin component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to moisture resistance, heat resistance,
The present invention relates to a flame-retardant phenol resin molding material having excellent electric properties and high strength, and particularly to a phenol resin molding material suitable for electronic parts such as small and thin trans bobbins.

[0002]

2. Description of the Related Art Phenolic resins are excellent in heat resistance, strength, moldability, etc. among various thermosetting resins.
It is used for various purposes such as molding materials and laminates. Among them, a resol-type phenol resin molding material which is ammonia-free has been used for many electronic components in recent years. Such components are required to have characteristics such as moisture resistance, dimensional stability, heat resistance, and electrical insulation.
As the thickness is reduced, a molded article having a smaller thickness is required to have higher strength and flame retardancy. Generally, a phenol resin contains glass fibers in order to obtain high strength, but has a drawback that it is brittle in structure as compared with a thermoplastic resin. In order to improve this point, various fillers and elastomers have been studied. In this case, although the strength is improved, problems such as a decrease in moisture resistance and heat resistance, and a further decrease in flame retardancy have occurred, and a satisfactory phenol resin molding material has not yet been obtained.

[0003]

SUMMARY OF THE INVENTION The present invention provides a phenolic resin molding material which is excellent in moisture resistance, heat resistance and electric characteristics and has high strength and flame retardancy required for electronic parts such as small and thin trans bobbins. It is intended to do so.

[0004]

According to the present invention, a resin component is mainly composed of a resole type phenol resin, a glass fiber, an organic fiber, and a vinyl acetate resin as fillers, and a phosphorus-based flame retardant as a flame retardant. The present invention relates to a phenolic resin molding material characterized by containing a flame retardant. As the resole type phenol resin, a dimethylene ether type resole resin or a methylol type resole resin can be used, but a dimethylene ether type resole resin, or a dimethylene ether type resole resin and a methylol type resole resin are preferably used.

The amount of filler is 70 to 140 parts by weight of glass fiber and 5 to 5 parts by weight of organic fiber with respect to 100 parts by weight of resin component.
Preferably 25 parts by weight and 5 to 25 parts by weight of vinyl acetate resin are used. Vinyl acetate resin has a degree of polymerization of 4000-6.
000 is preferably used.

As a phosphorus-based flame retardant, a mixture of red phosphorus, aluminum hydroxide, and a phenol resin is easy to handle, and aluminum hydroxide is 40 to 100 parts by weight with respect to 100 parts by weight of red phosphorus. Those containing 90 to 150 parts by weight of a phenol resin are preferred. The amount of the phosphorus-based flame retardant is 2 to 100 parts by weight of the resin component.
10 parts by weight are preferred.

The phenolic resin molding material of the present invention uses a resol-type phenolic resin as a main component of the phenolic resin, and is suitably used for electronic parts, particularly for applications requiring copper wire corrosion resistance and the like. When a novolak-type phenol resin is used as a main component, hexamethylenetetramine is usually used as a curing agent, but it should be avoided since corrosive gas such as ammonia gas is generated during curing.

The resole type phenol resin is not particularly limited, such as a dimethylene ether type resole resin or a methylol type resole resin, but is preferably a dimethylene ether type resole resin in terms of viscosity and heat stability upon heating and melting. In consideration of the balance, it is more preferable to use a dimethylene ether type resole resin and a methylol type resole resin in combination. It is preferable that the amount of generated metal corrosion components such as ammonia be as small as possible, and that the amount of ionic substances be as small as possible. The number average molecular weight of the resole type phenol resin is preferably from 500 to 1,000, and particularly preferably from 650 to 850. If it is less than 500, it has a low melting point and is easily consolidated at room temperature, making it difficult to handle. If it is more than 1,000, the fluidity is reduced and the roll workability during the production of molding materials is also poor.

In addition to these, the number average molecular weight is in the range of 800 to 1000 for adjusting the roll workability and the curability of the molding material.
Can be used in a small amount, and the addition amount is preferably 2 to 16 parts by weight, more preferably 4 to 14 parts by weight, based on 100 parts by weight of the resole type phenol resin. If the amount is less than 2 parts by weight, the effect of the addition on the roll workability and the curability is small, and if it exceeds 16 parts by weight, the curability of the molding material decreases.

The glass fiber used as the filler may be a commercially available glass fiber, and the addition amount is 70 to 140 parts by weight, more preferably 80 to 120 parts by weight, based on 100 parts by weight of the phenol resin component. Even if it is added in an amount exceeding 140 parts by weight, no further improvement in the strength when the molding material is formed into a molded product is recognized, and further problems such as deterioration of the fluidity of the molding material occur. If the amount is less than 70 parts by weight, the target strength is hardly obtained.

The organic fiber used as the filler is a crushed cloth, pulp, or the like.
5 to 25 parts by weight, more preferably 10 parts by weight, per 0 parts by weight
-20 parts by weight. Even if it exceeds 25 parts by weight,
Further improvement in strength when the molding material is used as a molded product is not recognized, and problems such as deterioration of fluidity due to an increase in viscosity at the time of melting of the molding material occur. If the amount is less than 5 parts by weight, the effect of the addition on the properties is small.

The vinyl acetate resin used as a filler is added for improving the strength, and has a polymerization degree of 4000.
6000-PSC / 20 ° C having a 20% methanol solution viscosity of 3000-6000 CPS is preferred. This addition amount is 5 to 25 parts by weight, more preferably 10 to 2 parts by weight, based on 100 parts by weight of the phenol resin.
0 parts by weight. Even if it is added in excess of 25 parts by weight, no further improvement in strength is obtained when the molding material is used as a molded product, and further problems such as poor fluidity due to an increase in viscosity during melting of the molding material occur. . If the amount is less than 5 parts by weight, the effect of the addition on the properties is small.

The phosphorus-based flame retardant, which is a flame retardant, is not particularly limited, but is preferably a mixture of red phosphorus, aluminum hydroxide, and a phenol resin. For 100 parts by weight of red phosphorus, 40 to 100 parts by weight of aluminum hydroxide; Those containing 90 to 150 parts by weight of a resin are particularly preferable. The addition amount of the phosphorus-based flame retardant is 2 to 10 parts by weight, more preferably 4 to 8 parts by weight, based on 100 parts by weight of the phenol resin. Even when added in excess of 10 parts by weight, no further improvement in flame retardancy was observed when the molding material was used as a molded product,
If the amount is less than 2 parts by weight, the effect of the addition on flame retardancy is small.

Although the effect of red phosphorus alone is recognized as a flame retardant, red phosphorus is a dangerous substance, and it requires much attention in handling and storage.
A mixture of red phosphorus, aluminum hydroxide, and a phenolic resin having the above composition is handled as a non-dangerous substance, so that there is no danger and the handling is easier than red phosphorus alone, which is preferable.

In forming a molding material, a curing aid such as slaked lime, a pigment, a release agent and the like are blended in addition to the above-mentioned phenolic resin composition, filler and flame retardant as in the case of ordinary molding materials. After uniform mixing, the mixture can be kneaded and pulverized with a pressure kneader, a twin-screw extruder, a heating roll or the like to obtain a molding material.

The phenolic resin molding material of the present invention is a phenolic resin molding material having excellent moisture resistance, heat resistance, and electrical properties, and having high strength and flame retardancy required for a small-sized thin-walled trans bobbin and the like. Used for electronic components that require high strength and flame retardancy.

[0017]

EXAMPLE A phenolic resin molding material was produced according to the formulation shown in Table 1. The properties of the molded article were measured for each molding material, and are shown in the lower column of Table 1.

[0018]

[Table 1]

[0019]

As is clear from the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is excellent in moisture resistance, heat resistance and electrical properties. Furthermore, it is high strength,
It is a phenolic resin molding material having excellent flame retardancy, and is suitable for small and thin molded products requiring these characteristics, particularly electronic parts such as trans bobbins.

Claims (5)

[Claims] 1. A resin component comprising a resol type phenol resin as a main component, a glass filler, an organic fiber, and a vinyl acetate resin as fillers, and a phosphorus-based flame retardant as a flame retardant. Phenolic resin molding material. 2. The phenolic resin molding material according to claim 1, wherein the resole type phenol resin as a main component of the resin is a dimethylene ether type resole resin, or a dimethylene ether type resole resin and a methylol type resole resin. 3. A glass fiber as a filler is 70 to 140 parts by weight and an organic fiber is 5 parts by weight based on 100 parts by weight of a resin component.
The phenolic resin molding material according to claim 1, wherein the phenolic resin molding material contains 5 to 25 parts by weight of a vinyl acetate resin. 4. The phosphorus-based flame retardant as a flame retardant is a mixture of red phosphorus, aluminum hydroxide, and a phenol resin,
40 parts aluminum hydroxide per 100 parts by weight of red phosphorus
The phenolic resin molding material according to claim 1 or 2, wherein the phenolic resin molding material contains phenolic resin in an amount of from 90 to 150 parts by weight. 5. The phenolic resin molding material according to claim 1, wherein a phosphorus-based flame retardant is contained in an amount of 2 to 10 parts by weight based on 100 parts by weight of the resin component.