JPH10182932A - Phenol resin molding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject material excellent in moisture resistance, heat resistance, electric characteristics and wear resistance required for electronic parts, by compounding a resol type phenol resin with an organic filler and an inorganic filler. SOLUTION: This phenol resin molding material is obtained by compounding (A) a phenol resin composition comprising (i) 100 pts.wt. of a resol type phenol resin and (ii) 20-100 pts.wt. of a novolak type phenol resin mixed with a polyamide by melt blending or solution blending with (B) an organic filler and/or (C) an inorganic filler. Preferably, the molding material is compounded with (D) a flame-retardant, and ground cloth is used as the component B and calcium carbonate as the component C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin molding material having excellent moisture resistance, heat resistance, electrical properties and abrasion resistance, and more particularly to a phenolic resin molding suitable for electronic parts, especially sliding parts. It is about materials.

[0002]

2. Description of the Related Art Phenolic resins are excellent in heat resistance, strength, moldability, etc. among various thermosetting resins.
It is used for various purposes such as molding materials and laminates. Among them, the resol type phenol resin molding material is characterized by being ammonia-free, and has been used in many electronic parts in recent years. Such components are required to have properties such as moisture resistance, dimensional stability, heat resistance, and electrical insulation, and resol-type phenolic resin molding materials are suitable because of their excellent balance of heat resistance, strength, and electrical properties. It is used for Above all, in the sliding parts, operation failures such as contact failures due to the wear powder are rarely occurring, and materials having excellent wear resistance are required. Usually, in the thermosetting resin molding materials including the phenolic resin molding materials, when the inorganic filler is mainly used, the abrasion resistance is reduced. On the other hand, when the organic filler is mainly used, the flame retardancy is indispensable for such parts. And usually contains a large amount of flame retardant, which reduces the wear resistance. In order to improve this point, various fillers and lubricants have been studied.However, there are problems such as a decrease in moisture resistance and heat resistance, and a phenol resin molding material satisfying the requirements has not yet been obtained. Absent.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component having excellent moisture resistance, heat resistance, and electrical characteristics, and to prevent operation failure such as contact failure due to abrasion powder in a sliding portion. Accordingly, it is an object of the present invention to provide a phenol resin molding material having excellent wear resistance.

[0004]

SUMMARY OF THE INVENTION The present invention relates to a novolak type phenolic resin 20 prepared by melt-mixing or solution-mixing a polyamide resin with 100 parts by weight of a resol-type phenolic resin.
The present invention relates to a phenol resin molding material characterized by comprising an organic filler and / or an inorganic filler mixed with a phenol resin composition consisting of about 100 parts by weight.

[0005] The phenolic resin molding material of the present invention uses a resole type phenolic resin as a main component, and is suitably used for electronic parts, particularly for applications requiring copper wire corrosion resistance and the like. A molding material containing a novolak type phenol resin as a main component usually uses hexamethylenetetramine as a curing agent. Since this generates corrosive gas such as ammonia gas during curing, application to such electronic components should be avoided.

The resole type phenol resin is not particularly limited, such as a dimethylene ether type resole resin or a methylol type resole resin, but is preferably a dimethylene ether type resole resin in view of the viscosity and heat stability of the molding material when heated and melted. Considering the balance with curability,
It is more preferable to use a dimethylene ether type resole resin and a methylol type resole resin in combination. Further, it is preferable that the amount of generated metal corrosion components such as ammonia be as small as possible, and that the amount of ionic substances be as small as possible. The number average molecular weight of the resole type phenol resin is preferably from 500 to 1,000, and particularly preferably from 650 to 850.
If it is less than 500, it is low in melting point and easily solidified at room temperature, so that it is not easy to handle. If it exceeds 1,000, the fluidity is reduced and the roll workability at the time of molding material production is deteriorated.

A novolak-type phenol resin obtained by melt-mixing or solution-mixing a polyamide resin is obtained by adding the polyamide resin 2 to 100 parts by weight of a normal novolak-type phenol resin.
It is a resin composition obtained by melt-mixing or solution-mixing 0 to 60 parts by weight. When the addition amount of the polyamide resin is less than 20 parts by weight, the desired abrasion resistance is not sufficiently exhibited, so that it is not preferable. When the addition amount exceeds 60 parts by weight, the matrix of the mixture becomes polyamide, and the phenol resin is added. It is not preferable because various characteristics such as heat resistance are adversely affected.

When this composition is used as a molding material, the amount of the polyamide mixed novolak type phenol resin composition is 20 parts by weight based on 100 parts by weight of the resol type phenol resin.
To 100 parts by weight, preferably 40 to 80 parts by weight. If the amount is less than 20 parts by weight, a sufficient improvement in the intended wear resistance is not recognized, and if it exceeds 100 parts by weight, no further improvement in the wear resistance is recognized, and also the molding material has It is not preferable because the curability and heat resistance decrease.

Although it is possible to adopt a method of simply blending a polyamide powder at the time of forming a molding material,
In this case, the abrasion resistance is considerably inferior to the case of melting or mixing with a phenolic resin, and furthermore, when the molding material is cured, the appearance of the molded product has a mottled pattern and small swelling. Yes, and should be avoided.

In the present invention, the organic filler used is crushed cloth, pulp powder, plywood powder, etc., the inorganic filler is calcium carbonate, kaolin clay, etc., and the amount added is the same as that used for general phenolic resin molding materials. The amount is usually 50 to 120 parts by weight based on 100 parts by weight of the resin component. In addition, those used as flame retardants are metal compounds having water of crystallization such as aluminum hydroxide and magnesium hydroxide, red phosphorus and the like, and the amount added depends on the intended flame retardancy level. 10 to 40 parts by weight per 100 parts by weight is preferred.

In forming a molding material, in addition to the above-mentioned phenolic resin composition, filler and flame retardant, a curing aid such as slaked lime, a pigment, a release agent and the like are blended in the same manner as in the case of ordinary molding materials. After uniform mixing, pressure kneader, twin screw extruder,
After kneading and pulverizing with a heating roll or the like, a molding material can be obtained.

The phenolic resin molding material of the present invention is excellent in moisture resistance, heat resistance and electric properties required for electronic parts,
Further, it is a phenolic resin molding material excellent in wear resistance for preventing operation failure such as contact failure due to abrasion powder in sliding parts.

[0013]

EXAMPLE A phenolic resin molding material was produced according to the formulation shown in Table 1. The properties of the molded article were measured for each molding material, and are shown in Table 2.

[0014]

[Table 1]

[0015]

[Table 2]

[0016]

As is clear from the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is excellent in moisture resistance, heat resistance and electrical properties. Furthermore, it is excellent in abrasion resistance, and can be particularly suitably used as a sliding component that may cause a contact failure or the like due to abrasion powder among electronic and electric components.

Claims (2)

[Claims] 1. An organic filler and / or an inorganic filler are added to a phenol resin composition comprising 100 parts by weight of a resol type phenol resin and 20 to 100 parts by weight of a novolak type phenol resin obtained by melting or mixing a polyamide resin. A phenolic resin molding material characterized by comprising: 2. The phenolic resin molding material according to claim 1, further comprising a flame retardant.