JPH10182936A - Phenol resin molding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a phenol resin molding material suitably useful especially for electronic parts, excellent in curability, water resistance flame retardance and electric properties. SOLUTION: This phenol resin molding material has a resin composition of a resol type phenol resin, 20-75wt.% based on the phenol resin of fillers for releasing water of crystallization as a flame-retardant composition at >=200 deg.C and <=500 deg.C in which at least one filler releases >=20wt.% of water of crystallization based on the weight of the filler at >=200 deg.C and <=500 deg.C. In this case, the filler comprises 10-40wt.% of the ground material of a natural organic material and 10-50wt.% of baked clay.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to water resistance, flame resistance,
The present invention relates to a phenolic resin molding material having excellent electrical properties and curability, and particularly to a phenolic resin molding material suitable for electronic parts.

[0002]

2. Description of the Related Art In recent years, phenolic resin molding materials have been used for many electronic components. Such components are required to have properties such as dimensional stability against moisture, heat resistance, flame resistance, and high strength. In particular, with the recent miniaturization of electronic components, heat resistance and flame resistance of thinner molded products are being demanded.

[0003]

DISCLOSURE OF THE INVENTION The present invention provides a phenolic resin molding material which is excellent in curability, water resistance, flame resistance and electrical properties even in a thin molded product and is suitable for molding electronic parts. It is intended to provide.

[0004]

According to the present invention, the resin composition is a resol type phenolic resin, and 2
The phenol resin contains at least 20% by weight of a filler that releases water of crystallization at not less than 00 ° C and not more than 500 ° C, and at least one of them contains at least 20% by weight of crystallization water based on the weight of the filler. A phenolic resin molding material which emits at a temperature of 200 ° C. or more and 500 ° C. or less. As the phenolic resin, a resol-type phenolic resin is used, but a novolak-type phenolic resin can be used in combination as necessary for improving moisture resistance and appearance.

As the filler used as a flame retardant component and releasing water of crystallization at 200 ° C. or more and 500 ° C. or less, aluminum hydroxide, magnesium hydroxide, zinc borate, calcium borate and the like can be mentioned. This addition amount is 20% by weight or more and 75% by weight or less based on the phenol resin. 2
If the addition amount is less than 0% by weight, the flame resistance is not sufficiently exhibited, and if the addition amount exceeds 75% by weight, the specific gravity of the molded article becomes too high, and the moldability is lowered, and there is a problem that the practicality is lacking. At least one type of filler that releases water of crystallization at a temperature of 200 ° C or more and 500 ° C or less is used.
Those that release 20% by weight or more of water of crystallization based on the weight of the filler at 0 ° C. or less are used, and examples thereof include magnesium hydroxide, aluminum hydroxide, and calcium borate. It is preferable that these flame retardants are as large as possible. When a filler that releases crystallization water at a temperature lower than 200 ° C. is used, the heat resistance of the molded product becomes insufficient, which is not desirable for electric machines and electronic parts.

The pulverized natural organic substances used as the filler include coconut husks, rice husks, wood flour, etc. These organic substances are finely pulverized and used as the filler. Normally, natural organic matter contains lignin, and when used for resol-type phenolic resin molding materials to lower the pH in the material,
Problems such as a decrease in curability and a decrease in moisture resistance occur. Therefore, the calcined clay is 10% by weight based on the phenol resin.
When the content is at least 50% by weight, the pH of the material is adjusted to the neutral side, and the action of a basic hardening aid such as slaked lime or magnesium oxide is not suppressed.

The amount of the natural organic filler is preferably from 10% by weight to 40% by weight based on the phenol resin.
If the amount is more than 40% by weight, the flow of the molding material is shortened, which may cause a problem in moldability, and furthermore, the flame resistance is reduced. If the amount is less than 10% by weight, the good moldability characteristic of the organic filler may not be sufficiently exhibited.

In forming a molding material, an organic filler such as pulp and an inorganic filler such as glass fiber, wollastonite and calcium carbonate can be added to the above-mentioned molding material in the same manner as in a usual molding material. , Usually add slaked lime, pigment, release agent, etc.
The mixture is kneaded with a pressure kneader, a twin-screw extruder, a heating roll or the like to form a molding material.

The phenolic resin molding material of the present invention is excellent in curability, water resistance, flame resistance, and electrical properties, and is suitable for molding electronic parts.

[0010]

EXAMPLES A phenol resin molding material was prepared according to the composition shown in the upper column of Table 1. For each of the obtained molding materials, the characteristics of the molded article were measured and are shown in the lower column of Table 1.

[0011]

[Table 1]

[Measurement Method] Curability: Evaluated as Bacol hardness. 50φ × 3mm
The molded article was injection molded at 175 ° C. for a curing time of 30 seconds, and the surface hardness was measured 10 seconds after the product was taken out. Water absorption, deflection temperature under load, insulation resistance: JIS K 691
Perform according to 1. The test piece was formed by transfer molding at 175 ° C. for 3 minutes. Solder heat resistance: 1 test piece of 50φ x 3mm thickness
Transfer molding was performed at 75 ° C. for 3 minutes, immersed in a solder bath at 400 ° C. for 3 seconds, and the rate of change in thickness was measured. Flame resistance: A test piece having a thickness of 12.7 mm × 127 mm × 0.4 mm was transfer-molded at 175 ° C. for 3 minutes, and the flame resistance was confirmed according to the UL94 vertical method.

[0013]

As is clear from the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is excellent in curability, water resistance, flame resistance, and electrical properties. In particular, it has excellent water resistance, flame resistance, and curability, and is suitable for molded articles requiring these characteristics, particularly electronic parts.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI C08L 97:02)

Claims (2)

[Claims] 1. The resin composition is a resol type phenol resin, and a filler which releases water of crystallization at a temperature of 200 ° C. or more and 500 ° C. or less is used as a flame retardant component.
７５75% by weight, at least one of which contains 20% by weight or more of crystallization water based on the weight of the filler at 200 ° C.
A phenol resin molding material which emits at a temperature of at least 500 ° C. 2. A phenol resin containing 10 to 40% by weight of a pulverized natural organic substance, and a calcined clay of 10 to 5%.
The phenolic resin molding material according to claim 1, which contains 0% by weight.