JPS59223747A - Amino resin molding material - Google Patents

Abstract

PURPOSE:To provide an amino resin molding material which has a high curing rate, gives moldings having excellent crack resistance and is suitable for use in the production of wiring equipment, electrical equipment, etc., by incorporating an epoxy resin-modified melamine resin. CONSTITUTION:An epoxy resin-modified melamine resin having a low hygroscopicity and a long pot life obtd. by reacting an epoxy resin with melamine is used. 1-10pts.wt. (per 100pts.wt. amino resin) said epoxy resin-modified melamine resin is mixed with a composition of an amino resin, e.g. urea resin, melamine resin or guanamine resin, contg. a reinforcing material such as pulp, a filler such as calcium carbonate, a hardener such as hexamethylenetetramine, a parting agent such as zinc stearate, a colorant, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an amino resin molding material used for wiring devices, sub-air appliances, etc.

[Background technology]

Conventionally, in order to improve the moldability of amino resin molding materials, it has been impossible to improve the moldability of the amino resin molding materials because the faster they are made to cure, the more the crack resistance of the molded products decreases.

[Purpose of the invention]

An object of the present invention is to provide an amino resin molding material that has quick curing properties and excellent crack resistance.

[Disclosure of the invention]

The present invention is an amino resin molding material comprising an amino resin, a reinforcing material, a filler, a curing agent, a mold release agent, a coloring agent, etc., and an epoxy-modified melamine resin further added thereto. Detailed description of the invention. The epoxy-modified melamine resin used in the present invention is an epoxy-modified melamine resin produced by the reaction between an epoxy resin and melamine, and is a mixture of a butyl etherified melamine resin and an epoxy resin, which has conventionally been inferior in curability, and has greatly improved hygroscopicity and pot life. It is not simply a mixture of epoxy resin and melamine resin, nor is it a time-consuming mixture that involves reacting melamine resin with aromatic amine and then mixing it with epoxy resin.It has low hygroscopicity, has a long pot life, and is easy to handle. It is something. Epoxy modified melamine resin i', l, are not particularly limited for amino resin, but preferably amino resin 100 weight jr
It is desirable to add 1 to 10 parts of epoxy-modified melamine Ii'iJ fat to t part (hereinafter simply referred to as part). In other words, if it is less than 1 part, it will be difficult to tolerate. This is because if the amount exceeds 10 parts, the quick curing property tends to decrease. As amino resin, it can be applied to all amino resins such as urea resin, melamine resin, guanamine resin, etc. singly or as a mixture, reinforcing materials such as pulp and wood flour, fillers such as calcium carbonate, aluminum hydroxide, etc. A hardening agent such as hexamethylenetetramine, a mold release agent such as stearic acid, zinc stearate, or wax, an M coloring agent, the above-mentioned epoxy paternal melamine resin, etc. are blended, mixed, crushed, and sieved to form a powdered molding material. It is granulated into a granular material. Embodiments of the present invention will be described below together with conventional examples.

[Examples 1 to 3] 100 parts of P/L/P for 100 parts of solid melamine resin,
'゛, xamine 2tfls, 7) <1 part aluminum oxide, 1 part zinc nateate, 5'fjf! 1 part of 3 drugs,
1 for Example 1 with solid epoxy modified melamine resin
5 parts for Example 2, and 5 parts for Example 3.
Add Hl to each, mix, and grind to obtain an amino resin molding material.

[Conventional example]

An amino resin molding material was obtained in the same manner as in the example except that the solid epoxy-modified melamine resin was not added.

〔Effect of the invention〕

As is clear from Table 1, the crack resistance of the amino resin molding materials of Examples 1 to 3 and the supporting examples is very good. It was confirmed.

Table 1 Button 1 A mild steel disc with a thickness of 3mm and a diameter of δn was inserted into a molded product with a thickness of 7η and a diameter of 60M, and the molded product was The number of times a crack occurs is measured using 1-1) cycles.

patent applicant Matsushita Electric Works Co., Ltd. Proxy Ben J” Toshimaru Take Moto (2 others)

Claims (1)

[Claims] tll In an amino resin molding material made by adding a reinforcing material, a filler, a hardening agent, a mold release agent, an N' coloring agent, etc. to an amino resin, it is claimed that an epoxy-modified melamine resin has been added to the amino resin. Characteristic amino resin molding material. (2) The amino resin molding material according to claim 1, wherein the amount of the epoxy-modified melamine resin is 1 to 10 parts by weight per 100 parts by weight of the amino resin.