JPS59147033A - Reinforced heat-conductive resin - Google Patents

Abstract

PURPOSE:To obtain the titled resin having improved heat-conductivity and strength, by mixing a polymer resin with three kinds of heat-conductive reinforcing materials having rod-like, plate-like and graular forms, respectively. CONSTITUTION:100pts.wt. of a polymer resin (preferably epoxy, silicone, urethane or polyester resin) is mixed with three kinds of heat-conductive reinforcing materials such as metals, inorganic materials, etc., i.e. (A) preferably 5- 200pts.wt. of a rod-like material (e.g. glass fiber having a diameter of preferably 5-500mu and a length of 0.1-50mm.), (B) preferably 5-200pts.wt. of a plate-like material (e.g. mica, etc. having a particle diameter of 1,000-10mu) and (C) preferably 50-300pts.wt. of a graular material (e.g. alumina, etc. having a particle diameter of <=1,000mu, especially a 50% average particle diameter of <=50mu and the other 50% average particle diameter of 1,000-100mu).

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in reinforced resins with improved thermal conductivity, and more specifically, the present invention relates to improvements in reinforced resins with improved thermal conductivity. This is a thermally conductive reinforced resin that is a mixture of three types of components: ``stutter'' and granular (also referred to as powder) components.

Polymer resins range from the most commonly used polyethylene resin to
Various resins such as epoxy resins and silicone resins have been developed and have a wide range of uses, but in recent years, the development of resins with particularly high heat conductivity and strength has become a major issue.

Conventionally, resins have been filled with highly thermally conductive metals or inorganic granular materials in order to increase the thermal conductivity, but inorganic materials with particularly high thermal conductivity include
There is Periyar, alumina toka. However, it is difficult to mix all of these fillers in large quantities, and there are difficulties in significantly improving thermal conductivity.On the other hand, using metal as an optical filler material can provide a considerable improvement, but it is difficult to improve electrical insulation. Problems due to decline in sexual ability, etc. cannot be avoided.

Generally, in order to increase the strength of the resin, the resin is used as a rod-shaped material,
There are so-called plate-like molded products or sheet-like molded products that are combined with mat-like materials or cross-like materials, and also filled molded products such as glass chops.

Furthermore, plate-like materials, specifically filled resins such as glass flakes, mica, and metal pieces, are widely used for water resistance and metallic coating as well as electrical insulation properties.

However, in order to obtain a resin having the above-mentioned thermal conductivity and strength, the above-mentioned method of mixing granular or rod-shaped materials is not as effective as originally intended. The reason for this is thought to be that the number of mutual contact points (hereinafter abbreviated as contact points) of the heat conduction reservoirs of the granular and rod-shaped materials is small. Therefore, the inventors conducted various studies in order to increase the number of contact points, and found that the resin has three types: granular, rod-shaped, and plate-shaped.
They discovered that by adding modifiers, a resin with surprisingly improved thermal conductivity and strength could be obtained, and this invention was completed.

That is, the present invention provides a composition in which a thermally conductive and reinforcing material such as a metal or an inorganic material is mixed in a polymer resin.
This is a thermally conductive reinforced resin characterized by mixing the material in three forms: rod-like, plate-like, and granular.

Examples of the resin used in the present invention include thermoplastic resins such as polyethylene, nylon, polypropylene, polyester, polycarbonate, and polyphenylsulfone, and thermosetting resins such as epoxy, silicone, polyester, and urethane. In particular, the present invention can be effectively used for thermosetting resins with good workability, and by using a soft resin, it is possible to obtain a strong, thermally conductive soft resin with a high modulus of elasticity. Next, as the rod-shaped component used in the present invention, general-purpose glass fibers, clycuff fibers, Kevlar fibers, carpin fibers, nylon fibers, polyester fibers, metal fibers, etc. are used.
Its thickness is approximately 5 to 500 microns, and the length is 0.1 to 50 microns.
A piece cut into mm is suitable.

In addition, plate-like components include mica, glass flakes, metal flakes, etc., and their sizes are 1000 microns and up.
10 microns is effective, where the size is 100
Large particles of 0 micron or more have poor filling workability, and small particles of 10 micron or less impair thermal conductivity and reinforcing properties, making them unsuitable.

Further, as particulate components, alumina, silica, zirconia, perilica, calcium carbonate, metal particles, etc. with a particle size of 1000 microns or less are used.

If metal-based materials are used as the rod-shaped, plate-shaped, and granular materials of the present invention described above, a reinforced resin with excellent electrical and thermal conductivity can be obtained, and if inorganic materials are used in combination, the material has low thermal expansion. A thermally conductive reinforced resin with excellent properties and electrical insulation properties can be obtained.

In this invention, 5 to 200 parts by weight of the rod-like component, 5 to 200 parts by weight of the plate-like component, and 50 to 300 parts by weight of the granular component are added to 100 parts by weight of the above-mentioned polymer and child resin, respectively. More specifically, during the above granular formation, fine particles with an average particle size of 50 microns or less and other particles with an average particle size of 1,000 microns or less are used.
When the product is a mixture of two or more types of coarse particles of micron to 100 micron size, the above properties are even more pronounced.

The present invention will be explained in more detail below by showing comparative examples and examples. The resin used on each side was epoxy resin (Epikoat 828, Shell Co., Ltd.), and 100 parts by weight of it was added with HN2.
200 (Hitachi Chemical Co., Ltd.), 5 parts by weight of Penderz Methylamine Foil, and 6 parts by weight of the anti-settling agent EROSOLE+380 (Nihon Aerozuru Co., Ltd.) were mixed.

The curing conditions were all 80°C for 2 hours and 150°C for 4 hours.

Comparative Example 1 An epoxy resin was filled with 50 vol % of alumina powder NM-1 (Fujimi Abrasives Co., Ltd.).

Comparative Example 2 Alumina powder NM-1'ft in epoxy resin
30 vo1% and glass chop C806MA497 (
Asahi Fiber Glass Co., Ltd.) 20 vo1% was filled.

Comparative Example 3 30% of alumina powder NM-1 added to epoxy resin
VO1% and mica powder DR-1 (Mamabe Mica Co., Ltd.) 2
It was filled with 0 vol%.

Example 1 30% of alumina powder NH-1 was added to epoxy resin.
vo1% and comparative example 2 glass chop 10 vo1%
and mica powder DR-110vo1%.

Example 2 An epoxy resin was filled with 10 vol of alumina powder, 20 vol of the glass chop of Comparative Example 2, and 1% of mica powder DR-1't-10 vol.

Example 3 An epoxy resin was filled with 30 vol. of alumina powder, 5 vol.% of the glass chop of Comparative Example 2, and 15 vol.% of mica powder DR-1k.

Example 4 An epoxy resin was filled with 30 vol of alumina powder, 15 vol of glass chop from Comparative Example 2, and 5 vol 1% of mica powder DR-1.

The properties of the obtained resin were investigated and the results are shown in Table 1 below.
j.

Table 1 As is clear from the above table, the Examples, ie, the present invention, have improved thermal conductivity and are able to obtain resins with greater strength than the Comparative Examples.

Claims (9)

[Claims] (1) In a composition in which a thermally conductive and reinforcing material such as a metal or an inorganic material is mixed into a polymer resin, the material is mixed as a component in three forms: rod-shaped, plate-shaped, and granular. Conductive reinforced resin. (2) Add 5 to 2 parts of the above rod-shaped component to 100 parts by weight of the polymer resin.
00 parts by weight, plate-shaped fraction 5 to 200 parts by weight, and granular component 5
The thermally conductive reinforced resin according to claim 1, which is filled with 0 to 300 parts by weight in each embodiment. (3) The thermally conductive reinforced resin according to claim 1, wherein the polymer resin is a thermosetting resin such as epoxy, silicone, urethane, or polyester resin. (4) The thermally conductive reinforced tree knee 31 according to claim 1, wherein the three components of the rod-like, plate-like, and granular forms are inorganic materials or metallic materials. (5) The rod-like component is one or more of silica fiber, glass fiber, Kepler fiber, carbon fiber/glue, has a thickness of 5 to 500 microns, and a length of 0.1 to 50 mm. A thermally conductive reinforced resin according to claim 4. (6) The thermally conductive reinforced resin according to claim 4, wherein the plate-like component is one or both of mica and glass flakes, and the particles thereof have a particle size of 0 to 10 microns. (7) The thermally conductive reinforced resin according to claim 4, wherein the particulate component is alumina, silica, or zirconia. (8) The thermally conductive reinforced resin according to claim 1, which is a polymer resin mixed with glass fiber, alumina, and mica. (9) The thermally conductive reinforced resin according to claim 4, which uses a comb-shaped soft resin at room temperature. σ0 Among the above particulate components, the product is a mixture of two or more types of fine particles having a 50% average particle diameter of 50 microns or less and other coarse particles having a 50% average particle diameter of 1000 microns to 100 microns. thermally conductive reinforced resin.